JPS6327039U - - Google Patents

Info

Publication number
JPS6327039U
JPS6327039U JP12127086U JP12127086U JPS6327039U JP S6327039 U JPS6327039 U JP S6327039U JP 12127086 U JP12127086 U JP 12127086U JP 12127086 U JP12127086 U JP 12127086U JP S6327039 U JPS6327039 U JP S6327039U
Authority
JP
Japan
Prior art keywords
resin
bonding
stamp
thickness
squeegee
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12127086U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528763Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12127086U priority Critical patent/JPH0528763Y2/ja
Publication of JPS6327039U publication Critical patent/JPS6327039U/ja
Application granted granted Critical
Publication of JPH0528763Y2 publication Critical patent/JPH0528763Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
JP12127086U 1986-08-06 1986-08-06 Expired - Lifetime JPH0528763Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12127086U JPH0528763Y2 (enrdf_load_stackoverflow) 1986-08-06 1986-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12127086U JPH0528763Y2 (enrdf_load_stackoverflow) 1986-08-06 1986-08-06

Publications (2)

Publication Number Publication Date
JPS6327039U true JPS6327039U (enrdf_load_stackoverflow) 1988-02-22
JPH0528763Y2 JPH0528763Y2 (enrdf_load_stackoverflow) 1993-07-23

Family

ID=31010381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12127086U Expired - Lifetime JPH0528763Y2 (enrdf_load_stackoverflow) 1986-08-06 1986-08-06

Country Status (1)

Country Link
JP (1) JPH0528763Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110524A (ja) * 2009-11-30 2011-06-09 Canon Machinery Inc 塗布装置
KR101165360B1 (ko) 2010-11-26 2012-07-12 주식회사 프로텍 다이 본더용 접착제 스탬핑 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6375628B2 (ja) * 2014-01-27 2018-08-22 三菱電機株式会社 樹脂供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110524A (ja) * 2009-11-30 2011-06-09 Canon Machinery Inc 塗布装置
KR101165360B1 (ko) 2010-11-26 2012-07-12 주식회사 프로텍 다이 본더용 접착제 스탬핑 장치

Also Published As

Publication number Publication date
JPH0528763Y2 (enrdf_load_stackoverflow) 1993-07-23

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