JPS63264625A - Mold-making resinous material for molding - Google Patents
Mold-making resinous material for moldingInfo
- Publication number
- JPS63264625A JPS63264625A JP9918587A JP9918587A JPS63264625A JP S63264625 A JPS63264625 A JP S63264625A JP 9918587 A JP9918587 A JP 9918587A JP 9918587 A JP9918587 A JP 9918587A JP S63264625 A JPS63264625 A JP S63264625A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- agent
- resin
- weight
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 31
- 239000012260 resinous material Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 239000000843 powder Substances 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 13
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract description 15
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract description 12
- 238000002156 mixing Methods 0.000 abstract description 5
- -1 3,4-epoxycyclohexenylmethyl Chemical group 0.000 abstract description 4
- 229920005862 polyol Polymers 0.000 abstract 3
- 150000003077 polyols Chemical class 0.000 abstract 3
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 8
- 239000004927 clay Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000002075 main ingredient Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- XYXBMCIMPXOBLB-UHFFFAOYSA-N 3,4,5-tris(dimethylamino)-2-methylphenol Chemical compound CN(C)C1=CC(O)=C(C)C(N(C)C)=C1N(C)C XYXBMCIMPXOBLB-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- GOYGTBXFJBGGLI-UHFFFAOYSA-N 7a-but-1-enyl-3a-methyl-4,5-dihydro-2-benzofuran-1,3-dione Chemical compound C1=CCCC2(C)C(=O)OC(=O)C21C=CCC GOYGTBXFJBGGLI-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 241000276489 Merlangius merlangus Species 0.000 description 1
- 208000019651 NDE1-related microhydranencephaly Diseases 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229960000892 attapulgite Drugs 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical class OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QTYUSOHYEPOHLV-UHFFFAOYSA-N octa-1,3-diene Chemical compound CCCCC=CC=C QTYUSOHYEPOHLV-UHFFFAOYSA-N 0.000 description 1
- 229910052625 palygorskite Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は成型用樹脂型剤に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a resin molding agent for molding.
ざらに詳しくは本発明は脂環式エポキシ樹脂と無機物粉
末とからなる主剤と酸無水物、アルキルアミンとからな
る硬化剤を用いた成型用樹脂型剤に関する。More specifically, the present invention relates to a resin molding agent for molding using a main ingredient consisting of an alicyclic epoxy resin and an inorganic powder, and a curing agent consisting of an acid anhydride and an alkylamine.
この発明の樹脂型剤により作成された成型用樹脂型は、
機械部品などの製品モデルおよび同モデル関連治具、板
金成形用の型、プラスチック成形用の型などに使用され
る。The resin mold for molding created using the resin mold agent of this invention is
It is used for product models such as mechanical parts, jigs related to the models, molds for sheet metal molding, molds for plastic molding, etc.
特にこの発明の樹脂型は金屈製金型に比べて加工作業が
容易であることから頻繁にモデルチェンジを要する分野
、大量の治工具を短期間に準備する必要がある場合など
に利用でき、納期短縮、コストダウン、軽量化に大きく
貢献できる。In particular, the resin mold of this invention is easier to process than the mold made by Kinkure, so it can be used in fields that require frequent model changes, or when it is necessary to prepare a large number of jigs and tools in a short period of time. It can greatly contribute to shortening delivery times, reducing costs, and reducing weight.
(従来技術)
従来は一般的に金属製の金型が用いられており、製作は
機械工作で行われていた。(Prior Art) Conventionally, metal molds have generally been used, and manufacturing has been carried out by mechanical work.
このため製作コストが高くなり、納期がかかり、また、
金爪製の金型は重り9作業性が悪いうえ、改修および修
正が難しい、あるいは保管中のメンテナンスが難しいな
ど多くの難点をかかえていた。This increases production costs, takes longer delivery times, and
Molds made from gold claws had many drawbacks, such as poor workability, difficulty in repair and modification, and difficulty in maintenance during storage.
これを解決する手段としてビスフェノールAタイプのエ
ポキシ樹脂、ノボラックタイプのエポキシ樹脂などから
なる樹脂型が用いられ、その製作はマスターモデルを用
いる“複製″方式によるものであった。As a means to solve this problem, resin molds made of bisphenol A type epoxy resin, novolac type epoxy resin, etc. were used, and their production was based on a "duplication" method using a master model.
(発明が解決しようとする問題点)
しかし、これらビスフェノールAタイプのエポキシ樹脂
、ノボラックタイプのエポキシ樹脂を用いた型剤はまず
流動性に欠けている。(Problems to be Solved by the Invention) However, molding agents using these bisphenol A type epoxy resins and novolac type epoxy resins lack fluidity.
つまり樹脂型を製作する場合、寸法精度の良い成形品を
得るため、すなわち2寸法精度の良い樹脂型を得るため
加工時に樹脂中の気泡を除去することを必要とするが、
流動性がないため脱泡しにクク、生産性が悪いのと同時
に得られた成形品の寸法精度に欠けるという欠点があっ
た。In other words, when manufacturing a resin mold, in order to obtain a molded product with good dimensional accuracy, that is, to obtain a resin mold with good two-dimensional accuracy, it is necessary to remove air bubbles in the resin during processing.
Due to the lack of fluidity, it is difficult to defoam, the productivity is poor, and the resulting molded products lack dimensional accuracy.
次に耐熱性が悪い点である。Second, it has poor heat resistance.
すなわち、樹脂型の中でも射出成形用の型に用いる場合
、150℃程度の温度に耐える必要があるが、前記のビ
スフェノールAタイプのエポキシ樹脂などを用いた樹脂
型は120〜150℃程度の高温状態にさらされると脆
くなるという欠点があった。In other words, when used as a mold for injection molding among resin molds, it is necessary to withstand temperatures of about 150°C, but resin molds using the above-mentioned bisphenol A type epoxy resin etc. can withstand high temperatures of about 120 to 150°C. The disadvantage is that it becomes brittle when exposed to
本発明者は、これらの問題点を解決すべく鋭意研究の結
果、本発明を完成させた。The present inventor completed the present invention as a result of intensive research to solve these problems.
(発明の桶成)
づ゛なわら2、本発明は
「(a)脂環式エポキシ樹脂20〜80重量%(b)無
芸物粉末 80〜20重番%(C)(a)と(b
)の合計fn100重fi1部に対して2衛アルコール
5重猷部以下
を主成分とする主剤と
(d)酸無水物 95〜99.9重ω%(e)′F
f!化促進剤 0.05〜5重量%を主成分とする
硬化剤からなることを特徴とする成形用樹脂型剤」
である。(Creation of the Invention) Second, the present invention consists of ``(a) 20 to 80% by weight of alicyclic epoxy resin, (b) 80 to 20% by weight of inorganic powder, (C) (a) and (b)
), based on a total of 1 part fn100 weight fi, a main ingredient containing not more than 5 parts alcohol and (d) an acid anhydride 95 to 99.9 weight ω% (e)'F
f! A resin molding agent for molding, characterized in that it consists of a curing agent whose main component is a curing accelerator of 0.05 to 5% by weight.
本発明の成形用樹脂型剤の主剤中の樹脂成分として用い
る脂環式エポキシ樹脂としては3.4エポキシシクロへ
キセニルメチル、3.4エボキシシクロヘキサン力ルポ
キシレート、ジベンテンジエボキシド、ビニルシク口ヘ
キセンジエボキシドなどがあり、中でも3.4エポキシ
シクロへキセニルメチル、3.4エポキシシクロヘキサ
ンカルボキシレートが好ましい。Examples of the alicyclic epoxy resins used as the resin component in the main resin of the molding resin molding agent of the present invention include 3.4 epoxycyclohexenylmethyl, 3.4 epoxycyclohexane rupoxylate, dibenthene dieboxide, vinyl hexene dieboxy Among them, 3.4 epoxycyclohexenylmethyl and 3.4 epoxycyclohexane carboxylate are preferred.
この脂環式エポキシ樹脂の一例である3、4エポキシシ
クロへキナン力ルポキシレートの構造式は以下の通りで
ある。The structural formula of 3,4 epoxycyclohequinane lupoxylate, which is an example of this alicyclic epoxy resin, is as follows.
これらの脂環式エポキシ樹脂の使用量は主剤中20〜8
0重辺%、好ましくは30〜70重徂%。The amount of these alicyclic epoxy resins used is 20 to 8 in the main resin.
0% by weight, preferably 30-70% by weight.
さらに好ましくは40〜60重番%である。More preferably, it is 40 to 60%.
20重量%より少ない場合は硬化収縮率や線膨張係数は
小さく、好ましいが、樹脂aが少ないため強度が低下し
、不適であり、逆に80vff1%より多い場合は強度
は向上するが、熱伝導率が著しく低下し、射出成形成形
用樹脂型としてはサイクルアップがはかれず、生産性が
低Fするので、不適であるだけでなく硬度が低下し、硬
化時のIt!2f!率、線膨張係数が大きくなり、不適
である。If it is less than 20% by weight, the curing shrinkage rate and coefficient of linear expansion will be small, which is preferable, but the strength will decrease due to the small amount of resin a, making it unsuitable.On the other hand, if it is more than 80vff1%, the strength will improve, but the thermal conductivity will decrease. It is not only unsuitable, but also hardness decreases, and the It! 2f! The coefficient of thermal expansion and coefficient of linear expansion become large, making it unsuitable.
本発明の成形用樹脂型剤の主剤のもう一つの成分である
無殿物粉末としてはアスベスト、アルミナ、アタパルジ
ャイト、カオリンクレー、火山灰。Precipitate-free powders that are another component of the main ingredient of the molding resin molding agent of the present invention include asbestos, alumina, attapulgite, kaolin clay, and volcanic ash.
カーボンブラック、グラフフィト、微粉珪酸、珪酸カル
シウム、珪藻土、酸化マグネシウム、酸化チタン、酸化
鉄、水酸化マグネジ・シム。水酸化・アルミニウム、ス
レート粉、セリサイト、石英粉(フリント)、溶融シリ
カ粉、ボロンナイトライド、炭酸カルシウム、炭酸マグ
ネシウム、タルク。Carbon black, graphite, finely divided silicic acid, calcium silicate, diatomaceous earth, magnesium oxide, titanium oxide, iron oxide, hydroxide magnetic screw shim. Hydroxide/aluminum, slate powder, sericite, quartz powder (flint), fused silica powder, boron nitride, calcium carbonate, magnesium carbonate, talc.
長石粉、二酸化モリブデン、パライト、蛭石、ホワイテ
ィング、マイカ、ロウ石クレー、石膏(無水)などがあ
り、これらを目的に合せて適当に組合わせて用いる。Feldspar powder, molybdenum dioxide, pallite, vermiculite, whiting, mica, waxite clay, gypsum (anhydrous), etc. are used in appropriate combinations depending on the purpose.
これら無機物粉末を混入する目的は硬度や熱伝導率を向
上させ比重を大きくするためである。The purpose of mixing these inorganic powders is to improve hardness and thermal conductivity and increase specific gravity.
また、各種無機物粉末の有するそれぞれの役割は以下の
通りである。Further, the respective roles of various inorganic powders are as follows.
・タルク、シリカT I 02 :硬度収縮やfQ+
a;張を小さくする。・Talc, silica T I 02: Hardness shrinkage and fQ+
a; Reduce tension.
・グラスファイバー、セラミック:硬度を上げ重槍を小
さくする。・Glass fiber, ceramic: Increases hardness and reduces heavy spear size.
・カーボン:熱性lユをよくし重でを小さくする。・Carbon: Improves heat resistance and reduces weight.
・オルベン:金属粉や充!i 1’9Jの分散をよくす
る。・Orben: Metal powder and charge! i Improve the dispersion of 1'9J.
などであり、用途によってその組合せは異なるし、配合
比率も異なる。etc., and the combinations and blending ratios vary depending on the application.
また、金FEV)を入れる場合は必ずオルベン(粘土)
を加えるが、この場合の使用比率の代表的な例は以下の
通りである。Also, when adding gold (FEV), be sure to use orben (clay).
A typical example of the usage ratio in this case is as follows.
金属沿 15〜30部 金属粉 15〜20部オ
ルベン2〜5 or カーボン15〜20タルク
′JO〜10 タルク 20〜5オルベン
2〜3
(粘土)
この無機物粉末の合計使用aは主剤中80〜20重ヱ%
、好ましくは30〜70重凹%、さらに好ましくは60
〜41部%である。Metal powder: 15-30 parts Metal powder: 15-20 parts Olben 2-5 or Carbon 15-20 Talc 'JO-10 Talc 20-5 Olben 2-3 (Clay) The total usage a of this inorganic powder is 80-20 in the base material. Weight%
, preferably 30 to 70%, more preferably 60%
~41 parts%.
これら無芸物粉末を均一に分散させるため、オルベン(
粘土)の役割は大きいが、オルベンを多く入れすぎると
分散状態は維持できるものの、粘度は増し、流動性を失
い、樹脂型製作時に行なう脱泡などの工程で問題を生じ
使用不可となる。In order to uniformly disperse these inorganic powders, orben (
(clay) plays an important role, but if too much orben is added, although the dispersion state can be maintained, the viscosity increases and fluidity is lost, causing problems in processes such as defoaming during resin mold production, making it unusable.
従って、オルベン(粘土)の吊1および無改粉末とエポ
キシ開脂の混合時のヘンシェルミキサーの回転スピード
が重要なポイントとなる。Therefore, the rotation speed of the Henschel mixer at the time of mixing the Olben (clay) suspension and the unmodified powder and the epoxy resin are important points.
この無機物粉末の合計使用量が20童侶%より少ない場
合は相対的に樹脂1nが多くなるため強度が向上し、好
ましいが、硬化収縮率や線膨張係数は大きくなり、さら
に、熱伝導率が著しく低下し。If the total amount of the inorganic powder used is less than 20%, the resin 1n will be relatively large, so the strength will improve, which is preferable, but the curing shrinkage rate and linear expansion coefficient will increase, and furthermore, the thermal conductivity will decrease. significantly decreased.
不適である。Not suitable.
この無ぼ物粉末の割合が低下すると硬化時の収縮率や線
膨張係数が増加するだけでなく、樹脂型の熱伝導率が低
下し、射出成形用樹脂型としてはサイクルアップがはか
れず、生産性が低下するので、好ましくない。If the proportion of this indestructible powder decreases, not only will the shrinkage rate and coefficient of linear expansion during curing increase, but also the thermal conductivity of the resin mold will decrease, making it difficult to cycle up as a resin mold for injection molding. This is not preferable because it reduces productivity.
逆に無機物粉末の合計使用λが80唄j%より多い場合
は硬化時の収縮率や線膨張係数は小さくなり、好ましい
が、逆に強度が低下し、好ましくない。On the other hand, if the total usage λ of inorganic powders is more than 80%, the shrinkage rate and coefficient of linear expansion during curing will decrease, which is preferable, but the strength will decrease, which is not preferable.
この無芸物粉末の粒度は100〜500メツシユ、好ま
しくは200〜400メツシユ、さらに好ましくは30
0メツシユ前後である。The particle size of this inorganic powder is 100 to 500 mesh, preferably 200 to 400 mesh, more preferably 30 mesh.
It is around 0 meshes.
500メツシユより大きい粒度のものでは成形後の強度
や表面の平滑度が悪く、また逆に100メツシユより小
さくする必要は特に無い。If the particle size is larger than 500 mesh, the strength and surface smoothness after molding will be poor, and on the other hand, there is no particular need to make the particle size smaller than 100 mesh.
本発明の成形用樹脂型剤の主剤に含まれる多価アルコー
ルとしては、
エチレングリコール、ジエチレングリコール。Examples of polyhydric alcohols contained in the main ingredient of the molding resin molding agent of the present invention include ethylene glycol and diethylene glycol.
エチレンモノグリコール、ネオペンチルグリコール、グ
リセリン、シクロヘキサノール、1゜6ヘキサンジオー
ル、トリメチルプロパン、1゜4ブタンジオール、ペン
タエリスリトールなどがあり、中でも
コスト面、無害性などから、エチレングリコール、ジエ
チレングリコールが好ましい。Examples include ethylene monoglycol, neopentyl glycol, glycerin, cyclohexanol, 1°6 hexanediol, trimethylpropane, 1°4 butanediol, and pentaerythritol. Among them, ethylene glycol and diethylene glycol are preferred from the viewpoint of cost and harmlessness.
これら多価アルコールの使用量は主剤中0.1〜5重j
%であるが、好ましくは0.3〜4重1%である。The amount of these polyhydric alcohols used is 0.1 to 5% in the base agent.
%, preferably 0.3 to 4% by weight.
更に好ましくは0.4〜3.0重j%である。More preferably, it is 0.4 to 3.0% by weight.
0.1重分%より少ない場合は反応が進まず、硬化に時
間を要する。If the amount is less than 0.1% by weight, the reaction will not proceed and it will take time to cure.
5.0m0%以上の場合は硬度が保てず、耐熱性が劣り
、型剤としては不適である。If it is more than 5.0m0%, hardness cannot be maintained and heat resistance is poor, making it unsuitable as a molding agent.
本発明の成形用樹脂型剤の硬化剤の成分として用いる酸
無水物としては、
メチルテトラヒドロ無水フタル酸[商品名:HN220
0.エピクロンB−570]
メチルエンドメチレンテトラヒドロ無水フタル酸[商品
名:カヤハードMCr)、無水メチルハイミック酸 M
HAC−P、MHAC−1]メチルブテニルテトラヒド
ロ無水フタル酸[商品名:Y)−1−306]
ドデセニル無水コハク酸、メチルへキサヒドロ無水フタ
ル駁[商品名:リカシッドMH−700゜エビクロンB
−650,HN3500]などがあり、中でもメチルテ
トラヒドロ無水フタル酸、メチルへキサヒドロ無水フタ
ル酸などが好ましい。As the acid anhydride used as a component of the curing agent of the molding resin molding agent of the present invention, methyltetrahydrophthalic anhydride [trade name: HN220
0. Epicron B-570] Methylendomethylenetetrahydrophthalic anhydride [Product name: Kayahard MCr), Methylhimic anhydride M
HAC-P, MHAC-1] Methylbutenyltetrahydrophthalic anhydride [Product name: Y)-1-306] Dodecenyl succinic anhydride, Methylhexahydrophthalic anhydride [Product name: Rikacid MH-700゜Evicron B
-650, HN3500], among which methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc. are preferred.
硬化剤の大半の成分であるこれら酸無水物の使用届はエ
ポキシ当aと酸無水物当量との比により算出するが、重
量化で主剤100に対し酸無水物20〜90.好ましく
は主剤100に対し酸無水物40〜70であり、更に好
ましくは、主剤100に対し酸無水物55〜65である
。The usage notification for these acid anhydrides, which are the majority of the components of the curing agent, is calculated based on the ratio of epoxy equivalent a to acid anhydride equivalent, and in terms of weight, the acid anhydride is 20 to 90. Preferably, the proportion of the acid anhydride is 40 to 70 per 100 of the base resin, and more preferably 55 to 65 of the acid anhydride per 100 of the base.
重層比で主剤100に対し酸無水物の暑が20より少な
い場合は硬化に時間を要するだけでなく。If the layer ratio of acid anhydride is less than 20 to 100 of base material, it not only takes time to cure.
充分に硬化しないため、一定の硬度が保てず、型剤とし
ては不適であり、逆に90より多い場合は充分に硬化は
するものの脆くなり、好ましくない。Since it does not harden sufficiently, a constant hardness cannot be maintained, making it unsuitable as a molding agent.On the other hand, if it exceeds 90, although it hardens sufficiently, it becomes brittle, which is undesirable.
本発明の成形用樹脂型剤の硬化剤の効果を促進させるた
めの硬化促進剤としては、第三アミン。A tertiary amine is used as a curing accelerator for accelerating the effect of the curing agent in the molding resin molding agent of the present invention.
ホウ酸エステル、ルイス酸、イミタゾールなどがあり、
中でもベンジルジメチルアミン、トリスジメチルアミノ
メチルフェノールなどが好ましい。There are boric acid esters, Lewis acids, imitazole, etc.
Among them, benzyldimethylamine, trisdimethylaminomethylphenol and the like are preferred.
これら硬化促進剤の使用過は硬化剤中0.05〜5.0
重量%であるが、好ましくは0.1〜2゜0型缶%であ
る。The amount of these curing accelerators used is 0.05 to 5.0 in the curing agent.
It is expressed in weight percent, preferably 0.1 to 2°0 type can percent.
更に好ましくは0.1〜0.5重層%である。More preferably, it is 0.1 to 0.5%.
0.05重1%より少ない場合は硬化速度の改善効果が
小さく、ロス時間多くなり、型の製作に手間取り、コス
ト的にも高くなる。When the amount is less than 0.05% by weight and 1%, the effect of improving the curing speed is small, loss time increases, it takes time to manufacture the mold, and the cost becomes high.
逆に5重1%より多い場合は、発熱が大きく、性質にム
ラができたり、硬化速度が早すぎるためポットライフが
短くなり、型製作上細工ができなくなる。On the other hand, if the amount is more than 1% by weight, the heat generation will be large, the properties will be uneven, the curing speed will be too fast, the pot life will be shortened, and it will not be possible to work with molds.
また、硬化促進剤の使用1が5重辺%より多い場合は硬
度が発現しないだけでなく、脆くなり、耐熱性がなくな
るため型剤としては不適である。Furthermore, if the amount of the curing accelerator used is more than 5%, it is not suitable as a molding agent because it not only does not exhibit hardness, but also becomes brittle and loses heat resistance.
次に9本発明の成形用樹脂型剤を用いて樹脂型を作成す
る手順を記述する。Next, a procedure for creating a resin mold using the molding resin molding agent of the present invention will be described.
■まず9作成したい物体の原型となる品物と金型枠の外
形となる容器を準備する。■First 9. Prepare the item that will be the prototype of the object you want to create and the container that will be the outline of the mold frame.
■原型となる品物に離型剤を塗布し、金型枠を作成する
容器にいれる。■Apply a mold release agent to the product that will become the prototype and place it in the container where the mold frame will be made.
■あらかじめ調合された主剤と硬化剤を所定の比率で混
合する。■Mix the pre-mixed base agent and curing agent in a predetermined ratio.
■充分に混合した後、脱泡して金型枠を作成する容器に
流し込む。■After mixing thoroughly, defoaming the mixture and pouring it into a container where the mold frame will be made.
■容器に流し込んだ時点で再び脱泡を行なう。■ Defoaming is performed again after pouring into the container.
■成形用樹脂型剤を流し込んだ容器ごとオーブンにいれ
、80〜150”Cで数時間かけて硬化させる。(2) Place the container filled with molding resin into an oven and harden at 80 to 150"C for several hours.
■型剤が硬化した頃を見計って一旦オーブンから取出し
、硬化していることを確認する。■When the molding agent has hardened, take it out of the oven and check that it has hardened.
■硬化していることを確認した後、原型となる品物を取
外し、再びオーブンにいれ150〜160℃で5〜15
時間かけて硬化させる。■After confirming that it has hardened, remove the original item and place it in the oven again for 5 to 15 minutes at 150 to 160℃.
Let it harden over time.
以下に実施例を挙げて本発明の詳細な説明する。The present invention will be explained in detail by giving examples below.
実施例−1 以下の組成になるように主剤を調合した。Example-1 The main ingredients were mixed to have the following composition.
(a)脂環式エポキシ樹脂として
3.4エボキシシクロヘキサン力ルポキシレート(ダイ
セル化学製セロキサイド2021 )53、1wt%
(b)無毀物粉末として
オルベン(粘土) 3.5wt%鉄粉
21.2wt%タルク
21.2wt%(C)多価アルコールとして
エチレングリコール 1.1vit%次に、以下
の組成になるように硬化剤を調合した。(a) 3.4 epoxycyclohexane lupoxylate (Daicel Chemical Celloxide 2021) 53.1 wt% as alicyclic epoxy resin (b) Olben (clay) as solid powder 3.5 wt% iron powder
21.2wt% talc
21.2 wt% (C) Ethylene glycol 1.1 vit% as polyhydric alcohol Next, a curing agent was prepared to have the following composition.
(d)M無水物として
テトラヒドロ無水フタルg 99.’ht%(HN−
2200)
(e)硬化促進剤として
ベンジルジアミン o、 iwt%前記のよう
な手順で上記の主剤と硬化剤とを混合し、容器にいれ、
容器ごと100℃に保持されているオーブンにいれ、3
時間そのままにして硬化させた。(d) Tetrahydrophthalanhydride g as M anhydride 99. 'ht%(HN-
2200) (e) Benzyldiamine as a curing accelerator o, iwt% Mix the above main ingredient and curing agent according to the procedure described above, put it in a container,
Place the whole container in an oven maintained at 100℃,
It was left to harden for a while.
次に一旦オーブンから取出し、原型となる品物を取外し
、再びオーブンにいれて150℃で10時間かけて完全
に硬化させた。Next, the product was taken out of the oven, the original model was removed, and the product was placed in the oven again and completely cured at 150° C. for 10 hours.
オーブンから取出された樹脂型は充分な硬度。The resin mold taken out of the oven is sufficiently hard.
強度および寸法精度などを有するものであった。It had strength and dimensional accuracy.
実施例−2
実施例−1におけるエチレングリコールの苗わりにジエ
チレングリコールを用いた以外は実施例−1と同様に行
ない、実施例−1と同じような充分な硬度1強度および
寸法精度樹脂型が得られた。Example 2 The same procedure as Example 1 was carried out except that diethylene glycol was used instead of the ethylene glycol seedling in Example 1, and a resin mold with sufficient hardness, strength, and dimensional accuracy as in Example 1 was obtained. Ta.
Claims (1)
価アルコール 5重量部 以下を主成分とする主剤と (d)酸無水物 95〜99.9重量% (e)硬化促進剤 0.05〜5重量% を主成分とする硬化剤からなることを特徴とする成形用
樹脂型剤。[Scope of Claims] (a) Alicyclic epoxy resin 20 to 80% by weight (b) Inorganic powder 80 to 20% by weight (c) Polyvalent to 100 parts by weight of the total amount of (a) and (b) It is characterized by consisting of a main component mainly consisting of 5 parts by weight or less of alcohol, (d) an acid anhydride 95 to 99.9% by weight, and (e) a curing agent mainly containing 0.05 to 5% by weight of a curing accelerator. A resin molding agent for molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62099185A JPH0739464B2 (en) | 1987-04-22 | 1987-04-22 | Molding agent for molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62099185A JPH0739464B2 (en) | 1987-04-22 | 1987-04-22 | Molding agent for molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63264625A true JPS63264625A (en) | 1988-11-01 |
JPH0739464B2 JPH0739464B2 (en) | 1995-05-01 |
Family
ID=14240591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62099185A Expired - Lifetime JPH0739464B2 (en) | 1987-04-22 | 1987-04-22 | Molding agent for molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0739464B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013038945A1 (en) | 2011-09-14 | 2013-03-21 | 株式会社ダイセル | Triepoxy compound and method for producing same |
WO2013153988A1 (en) | 2012-04-13 | 2013-10-17 | 株式会社ダイセル | Diepoxy compound and method for producing same |
WO2014181699A1 (en) | 2013-05-10 | 2014-11-13 | 株式会社ダイセル | Curable epoxy resin composition and cured product thereof |
WO2014181787A1 (en) | 2013-05-10 | 2014-11-13 | 株式会社ダイセル | Curable epoxy resin composition and cured product thereof, diolefin compound and production method therefor, and production method for diepoxy compound |
WO2014182138A1 (en) | 2013-05-10 | 2014-11-13 | 주식회사 씨티씨바이오 | Film preparation containing donepezil-free base and method for producing same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57105420A (en) * | 1980-11-03 | 1982-06-30 | Union Carbide Corp | Curable epoxy resin-containing composition |
JPS58145724A (en) * | 1982-02-25 | 1983-08-30 | Toray Ind Inc | Epoxy resin elastomer |
JPS5981329A (en) * | 1982-09-30 | 1984-05-11 | ユニオン、カーバイド、コーポレーシヨン | Curable epoxy resin-containing molding composition |
-
1987
- 1987-04-22 JP JP62099185A patent/JPH0739464B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57105420A (en) * | 1980-11-03 | 1982-06-30 | Union Carbide Corp | Curable epoxy resin-containing composition |
JPS58145724A (en) * | 1982-02-25 | 1983-08-30 | Toray Ind Inc | Epoxy resin elastomer |
JPS5981329A (en) * | 1982-09-30 | 1984-05-11 | ユニオン、カーバイド、コーポレーシヨン | Curable epoxy resin-containing molding composition |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013038945A1 (en) | 2011-09-14 | 2013-03-21 | 株式会社ダイセル | Triepoxy compound and method for producing same |
US9249256B2 (en) | 2011-09-14 | 2016-02-02 | Daicel Corporation | Triepoxy compound and method for producing same |
WO2013153988A1 (en) | 2012-04-13 | 2013-10-17 | 株式会社ダイセル | Diepoxy compound and method for producing same |
WO2014181699A1 (en) | 2013-05-10 | 2014-11-13 | 株式会社ダイセル | Curable epoxy resin composition and cured product thereof |
WO2014181787A1 (en) | 2013-05-10 | 2014-11-13 | 株式会社ダイセル | Curable epoxy resin composition and cured product thereof, diolefin compound and production method therefor, and production method for diepoxy compound |
WO2014182138A1 (en) | 2013-05-10 | 2014-11-13 | 주식회사 씨티씨바이오 | Film preparation containing donepezil-free base and method for producing same |
KR20160006199A (en) | 2013-05-10 | 2016-01-18 | 주식회사 다이셀 | Curable epoxy resin composition and cured product thereof |
KR20160006198A (en) | 2013-05-10 | 2016-01-18 | 주식회사 다이셀 | Curable epoxy resin composition and cured product thereof, diolefin compound and production method therefor, and production method for diepoxy compound |
Also Published As
Publication number | Publication date |
---|---|
JPH0739464B2 (en) | 1995-05-01 |
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