JPS6326320A - High power conductive copper alloy - Google Patents
High power conductive copper alloyInfo
- Publication number
- JPS6326320A JPS6326320A JP16778486A JP16778486A JPS6326320A JP S6326320 A JPS6326320 A JP S6326320A JP 16778486 A JP16778486 A JP 16778486A JP 16778486 A JP16778486 A JP 16778486A JP S6326320 A JPS6326320 A JP S6326320A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- content
- copper alloy
- exceeds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 4
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 4
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 4
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052745 lead Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 229910052796 boron Inorganic materials 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229910052787 antimony Inorganic materials 0.000 claims abstract 2
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 12
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 6
- 229910052718 tin Inorganic materials 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 2
- 238000006731 degradation reaction Methods 0.000 abstract 2
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
本発明は高力で優れたバネ特性を有し、かつ耐食性に優
れた安価なバネ用鋼合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an inexpensive steel alloy for springs that has high strength, excellent spring properties, and excellent corrosion resistance.
従来、丹銅及び黄銅は、その優れた加工性並びに低コス
ト材料であるため、電子、電気部品材料としても、電気
機器用バネ、計」り器用バネ、スイッチ、コネクター等
に広範囲に使用されていた。Traditionally, red copper and brass have been widely used as materials for electronic and electrical components, such as springs for electrical equipment, springs for gauges, switches, and connectors, due to their excellent workability and low cost. Ta.
しかし近年、機器、装置の小型化、軽量化により更に強
度、バネ特性の向上が強く要望されており、また耐食性
が劣るため、耐食性の向」二に対しても強い要望がある
。However, in recent years, due to the miniaturization and weight reduction of equipment and devices, there has been a strong demand for further improvements in strength and spring characteristics, and since corrosion resistance has been poor, there has also been a strong demand for improvements in corrosion resistance.
本発明はかかる点に鑑みなされたもので、安価で、強度
、バネ特性に優れ、耐食性にも優れた銅合金を提供しよ
うとするものである。The present invention has been made in view of these points, and an object thereof is to provide a copper alloy that is inexpensive, has excellent strength and spring characteristics, and is also excellent in corrosion resistance.
すなわち、Ｚｎ１Ｏ〜４０ｗｔ％、 Ｐ０．００５〜０
．０７０ｗｔ％、Ｓｎ０．０５〜１０ｗｔ％を含み、残
部Ｃｕ及び不可避的不純物からなる高力導電銅合金並び
にＺ ｎ １．０〜４０ｗｔ％、Ｐ ０．００５〜０
．０７０ｗｔ％、Ｓ ｎ Ｏ，０５〜１ 、０ ｗ ｔ
％を含み、さらに Ｂ、Ｎｊ、、Ｓｊ、Ｆｅ、Ｐｂ、Ｃ
０．Ｃｒ、Ｍｎ、Ｔｅ、Ｉｎ、Ｔｉ、Ｚｒ、Ｈｆ、Ｂｅ
、Ｍｇ、Ａｇ、Ｃｄ、Ｇｅ。That is, Zn1O~40wt%, P0.005~0
．． A high-strength conductive copper alloy containing 0.070 wt%, Sn 0.05 to 10 wt%, and the remainder Cu and inevitable impurities, and Zn 1.0 to 40 wt%, P 0.005 to 0.
．． 070wt%, SnO, 05~1, 0wt
%, and further includes B, Nj, , Sj, Fe, Pb, C
0. Cr, Mn, Te, In, Ti, Zr, Hf, Be
, Mg, Ag, Cd, Ge.
Ａｓ、Ｓｂの白河れか１種又は２種以上を合計０．００
５〜２．０ｗｔ％含み、残部Ｃｕ及び不可避的不純物か
らなる高力導電銅合金に関するものである。A total of 0.00 of one or more types of As and Sb Shirakawa
The present invention relates to a high-strength conductive copper alloy containing 5 to 2.0 wt% of Cu and the balance being Cu and unavoidable impurities.
次に本発明合金の各成分元素の限定理由について述べる
ことにする。銅と亜鉛は本発明合金の基本材料となるも
ので、加工性、機械的強度に優れているとともに熱伝導
性にも優れている。亜鉛含有量を１０〜４０ｗｔ％とす
る理由は、亜鉛含有量が１０ｗｔ％未満では強度が低く
、亜鉛含有量が４． Ｏｗ ｔ％をこえるとβ相の析出
が多量となり、材料性質が安定しなくなるためである。Next, the reason for limiting each component element of the alloy of the present invention will be described. Copper and zinc are the basic materials of the alloy of the present invention, and have excellent workability and mechanical strength as well as excellent thermal conductivity. The reason why the zinc content is set to 10 to 40 wt% is that if the zinc content is less than 10 wt%, the strength will be low. This is because if it exceeds Ow t%, a large amount of β phase will precipitate and the material properties will become unstable.
りんの含有量を０．００５〜０．０７０ｗｔ％とする理
由は、りん含有量が０．００５ｗｔ％未満では強度の向
上が認められず、耐食性の改善も期待できない。逆にり
ん含有量が０．０７０ｗｔ％をこえると導電性の低下及
び粒界腐食が発生し易くなるためである。錫含有量を０
．０５〜１．０ｗｔ％とする理由は、錫含有量が０．０
５ｗｔ％未満では強度、バネ特性の向上が認められず、
錫含有量が１．０ｗｔ％をこえると導電性の低下が著し
くなるためである。The reason why the phosphorus content is set to 0.005 to 0.070 wt% is that if the phosphorus content is less than 0.005 wt%, no improvement in strength is observed and no improvement in corrosion resistance can be expected. On the other hand, if the phosphorus content exceeds 0.070 wt%, the conductivity decreases and intergranular corrosion tends to occur. Tin content 0
．． The reason for setting it to 05 to 1.0 wt% is that the tin content is 0.0
If it is less than 5wt%, no improvement in strength or spring properties is observed,
This is because when the tin content exceeds 1.0 wt%, the conductivity decreases significantly.
また、副成分としてＢ、Ｎｉ、Ｓｉ、Ｆｅ、Ｐｂ、Ｇ０
．Ｃｒ、Ｍｎ、Ｔｅ、Ｉ ｎ、Ｔｉ、Ｚｒ、Ｈｆ、Ｂｅ
、Ｍｇ、Ａｇ、Ｃｄ、Ｇｅ、Ａｓ。In addition, as subcomponents B, Ni, Si, Fe, Pb, G0
．． Cr, Mn, Te, In, Ti, Zr, Hf, Be
, Mg, Ag, Cd, Ge, As.
ｓｂからなる群より選択された１種又は２種以」二の含
有量の総計を０．００５〜２．０ｗｔ％とする理由は、
０．００５ｗｔ％未満では、強度、バネ特性の向上が認
められず、２．０ｗｔ％を超えると導電性の低下と半田
付は性の低下が著しくなるためである。The reason why the total content of one or more selected from the group consisting of sb is 0.005 to 2.0 wt%,
This is because if it is less than 0.005 wt%, no improvement in strength or spring characteristics will be observed, and if it exceeds 2.0 wt%, the conductivity and soldering properties will be significantly reduced.
次に本発明の詳細な説明する。Next, the present invention will be explained in detail.
第１表に示した組成の合金を溶解し、厚さ３０ｍの鋳塊
を得た。次に鋳塊を約７００ ’Ｃで熱間圧延し、厚さ
８．０Ｉにした後、表面を固剤する。An alloy having the composition shown in Table 1 was melted to obtain an ingot with a thickness of 30 m. The ingot is then hot rolled at about 700'C to a thickness of 8.0I, and the surface is hardened.
そして冷間圧延で厚さ１．０ａｎにした後、７５０°Ｃ
で５分間の焼鈍を行い、最終圧延で厚さ０．５■とした
。この試料を２００℃で１時間の熱処理を行い、引張強
さ、バネ限界値、バネ疲労試験、電気伝導度の測定を行
い、また、塩水噴震試験を実施し、第１表の結果を得た
。After cold rolling to a thickness of 1.0 an, the temperature is 750°C.
It was annealed for 5 minutes and final rolled to a thickness of 0.5 cm. This sample was heat treated at 200℃ for 1 hour, and the tensile strength, spring limit value, spring fatigue test, and electrical conductivity were measured.Also, a salt water jet test was conducted, and the results shown in Table 1 were obtained. Ta.
塩水噴霧試験はＪＴＳ Ｚ ２３７１法１こ基づいて行
い、２週間１Σ（露後の腐食減Ｒ（ｍｄｄ）を求めた。The salt spray test was conducted based on the JTS Z 2371 method, and the corrosion reduction R (mdd) after 2 weeks of exposure was determined.
第１人かられかる様に、本発明合金は引張強さ、ハネ限
界値、疲労特性、電傑伝導性及び耐食性においてバラン
スのとれた良好な特性をもち、丹銅、黄銅よりも優れて
いることがわかる。As stated by the first person, the alloy of the present invention has well-balanced properties in terms of tensile strength, spring limit value, fatigue properties, electrical conductivity, and corrosion resistance, and is superior to red copper and brass. I understand that.
以］、のように本発明合金は丹銅、黄銅にくらべ強度、
バネ特性、耐食性の全てに優れた銅合金である。従って
、本発明合金を丹銅、黄銅に代替して電気機器用バネ、
計測器用バネ、スイッチ、コネクター等に使用すること
により、機器の小型化、軽量化及び信頼性の向上をはか
ることが可能である。As shown in [below], the alloy of the present invention has higher strength than red copper and brass.
A copper alloy with excellent spring properties and corrosion resistance. Therefore, the alloy of the present invention can be used as a substitute for red copper or brass for springs for electrical equipment.
By using it for springs for measuring instruments, switches, connectors, etc., it is possible to make devices smaller, lighter, and more reliable.
Claims (2)
０ｗｔ％、Ｓｎ０．０５〜１．０ｗｔ％を含み、残部Ｃ
ｕ及び不可避的不純物からなる高力導電銅合金。(1) Zn10-40wt%, P0.005-0.07
0wt%, Sn0.05-1.0wt%, the balance C
A high strength conductive copper alloy consisting of u and unavoidable impurities.
０ｗｔ％、Ｓｎ０．０５〜１．０ｗｔ％を含み、さらに
Ｂ、Ｎｉ、Ｓｉ、Ｆｅ、Ｐｂ、Ｃｏ、Ｃｒ、Ｍｎ、Ｔｅ
、Ｉｎ、Ｔｉ、Ｚｒ、Ｈｆ、Ｂｅ、Ｍｇ、Ａｇ、Ｃｄ、
Ｇｅ、Ａｓ、Ｓｂの内何れか１種又は２種以上を合計０
．００５〜２．０ｗｔ％含み、残部Ｃｕ及び不可避的不
純物からなる高力導電銅合金。(2) Zn10-40wt%, P0.005-0.07
0wt%, Sn0.05-1.0wt%, and further contains B, Ni, Si, Fe, Pb, Co, Cr, Mn, Te
, In, Ti, Zr, Hf, Be, Mg, Ag, Cd,
A total of 0 of any one or two or more of Ge, As, and Sb
．． A high-strength conductive copper alloy containing 0.005 to 2.0 wt% and the balance consisting of Cu and inevitable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16778486A JPS6326320A (en) | 1986-07-18 | 1986-07-18 | High power conductive copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16778486A JPS6326320A (en) | 1986-07-18 | 1986-07-18 | High power conductive copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6326320A true JPS6326320A (en) | 1988-02-03 |
Family
ID=15856046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16778486A Pending JPS6326320A (en) | 1986-07-18 | 1986-07-18 | High power conductive copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6326320A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6264764B1 (en) * | 2000-05-09 | 2001-07-24 | Outokumpu Oyj | Copper alloy and process for making same |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| US6585833B1 (en) * | 2000-03-14 | 2003-07-01 | Brush Wellman, Inc. | Crimpable electrical connector |
| WO2007091690A1 (en) * | 2006-02-10 | 2007-08-16 | Mitsubishi Shindoh Co., Ltd. | Raw material brass alloy for casting of semi-molten alloy |
| JP2008208466A (en) * | 2008-05-15 | 2008-09-11 | Dowa Metaltech Kk | Copper alloy for connector, and method for producing the same |
| JP2012126933A (en) * | 2010-12-13 | 2012-07-05 | Mitsubishi Materials Corp | Copper alloy for electronic and electric apparatus |
| CN103131894A (en) * | 2013-03-15 | 2013-06-05 | 宁波金田铜业(集团)股份有限公司 | High-elasticity and high-conductivity copper alloy and production method thereof |
| CN103484714A (en) * | 2013-09-16 | 2014-01-01 | 苏州金仓合金新材料有限公司 | Novel vertical continuous casting unleaded copper base alloy pipe and preparation method thereof |
| CN103484715A (en) * | 2013-09-16 | 2014-01-01 | 苏州金仓合金新材料有限公司 | Novel rolled unleaded copper base alloy bar and preparation method thereof |
| JP2015034333A (en) * | 2013-07-10 | 2015-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic/electric equipment, copper alloy thin sheet for electronic/electric equipment, and conductive part and terminal for electronic/electric equipment |
| US9493858B2 (en) | 2011-08-13 | 2016-11-15 | Wieland-Werke Ag | Copper alloy |
| DE102021116817A1 (en) | 2021-03-25 | 2022-09-29 | Shanghai Wuxing Copper Co., Ltd | Tin-brass alloy and method of making same |
-
1986
- 1986-07-18 JP JP16778486A patent/JPS6326320A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| US6585833B1 (en) * | 2000-03-14 | 2003-07-01 | Brush Wellman, Inc. | Crimpable electrical connector |
| US6264764B1 (en) * | 2000-05-09 | 2001-07-24 | Outokumpu Oyj | Copper alloy and process for making same |
| WO2007091690A1 (en) * | 2006-02-10 | 2007-08-16 | Mitsubishi Shindoh Co., Ltd. | Raw material brass alloy for casting of semi-molten alloy |
| JP2007211310A (en) * | 2006-02-10 | 2007-08-23 | Sanbo Copper Alloy Co Ltd | Raw material brass alloy for casting half-melted alloy |
| JP2008208466A (en) * | 2008-05-15 | 2008-09-11 | Dowa Metaltech Kk | Copper alloy for connector, and method for producing the same |
| JP2012126933A (en) * | 2010-12-13 | 2012-07-05 | Mitsubishi Materials Corp | Copper alloy for electronic and electric apparatus |
| US9493858B2 (en) | 2011-08-13 | 2016-11-15 | Wieland-Werke Ag | Copper alloy |
| CN103131894A (en) * | 2013-03-15 | 2013-06-05 | 宁波金田铜业(集团)股份有限公司 | High-elasticity and high-conductivity copper alloy and production method thereof |
| CN103131894B (en) * | 2013-03-15 | 2015-06-03 | 宁波金田铜业(集团)股份有限公司 | High-elasticity and high-conductivity copper alloy and production method thereof |
| JP2015034333A (en) * | 2013-07-10 | 2015-02-19 | 三菱マテリアル株式会社 | Copper alloy for electronic/electric equipment, copper alloy thin sheet for electronic/electric equipment, and conductive part and terminal for electronic/electric equipment |
| CN103484714A (en) * | 2013-09-16 | 2014-01-01 | 苏州金仓合金新材料有限公司 | Novel vertical continuous casting unleaded copper base alloy pipe and preparation method thereof |
| CN103484715A (en) * | 2013-09-16 | 2014-01-01 | 苏州金仓合金新材料有限公司 | Novel rolled unleaded copper base alloy bar and preparation method thereof |
| DE102021116817A1 (en) | 2021-03-25 | 2022-09-29 | Shanghai Wuxing Copper Co., Ltd | Tin-brass alloy and method of making same |
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