JPS63261799A - 電子回路モジユ−ル - Google Patents
電子回路モジユ−ルInfo
- Publication number
- JPS63261799A JPS63261799A JP9642387A JP9642387A JPS63261799A JP S63261799 A JPS63261799 A JP S63261799A JP 9642387 A JP9642387 A JP 9642387A JP 9642387 A JP9642387 A JP 9642387A JP S63261799 A JPS63261799 A JP S63261799A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- cooling fin
- circuit module
- cooling
- cooling air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 55
- 238000009423 ventilation Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9642387A JPS63261799A (ja) | 1987-04-20 | 1987-04-20 | 電子回路モジユ−ル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9642387A JPS63261799A (ja) | 1987-04-20 | 1987-04-20 | 電子回路モジユ−ル |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63261799A true JPS63261799A (ja) | 1988-10-28 |
JPH0573279B2 JPH0573279B2 (enrdf_load_html_response) | 1993-10-14 |
Family
ID=14164575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9642387A Granted JPS63261799A (ja) | 1987-04-20 | 1987-04-20 | 電子回路モジユ−ル |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63261799A (enrdf_load_html_response) |
-
1987
- 1987-04-20 JP JP9642387A patent/JPS63261799A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0573279B2 (enrdf_load_html_response) | 1993-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10912233B2 (en) | Controller with heat sink clamping plate for enhanced thermal properties | |
US7589973B2 (en) | Air duct flow optimization device | |
US20170273218A1 (en) | Electronic device and method of assembling such a device | |
CN110785701A (zh) | 散热系统及摄影摄像设备 | |
JPS63261799A (ja) | 電子回路モジユ−ル | |
JP5619966B2 (ja) | 放熱構造 | |
JPH07131173A (ja) | 電子機器 | |
JPH0322951Y2 (enrdf_load_html_response) | ||
CN109275309B (zh) | 散热模块及包含其的主机板组件 | |
CN211184556U (zh) | 电子设备 | |
JPS63252499A (ja) | 電子回路モジユ−ル | |
JPS63292696A (ja) | 電子回路モジュ−ル | |
JPS63117499A (ja) | 電子回路モジユ−ル | |
JPS63292697A (ja) | 電子回路モジュ−ル | |
TW201826259A (zh) | 伺服器及其固態儲存裝置 | |
JPH0523593U (ja) | 電子回路モジユール | |
CN220981611U (zh) | 冷热侧粘合组装式半导体制冷装置 | |
JPS6257295A (ja) | 電子機器 | |
CN221842804U (zh) | 散热型线路板 | |
US11219137B2 (en) | Electronic device and power module thereof | |
JPS63284896A (ja) | 電子部品の実装構造 | |
KR100843759B1 (ko) | Pcb 냉각 시스템 | |
CN118829160A (zh) | 一种便携式双风道密闭散热机箱 | |
JP2002043489A (ja) | 電子部品の防塵フィルター | |
JPS6055699A (ja) | 電気機器筐体の冷却方法 |