JPS6325884B2 - - Google Patents
Info
- Publication number
- JPS6325884B2 JPS6325884B2 JP24920284A JP24920284A JPS6325884B2 JP S6325884 B2 JPS6325884 B2 JP S6325884B2 JP 24920284 A JP24920284 A JP 24920284A JP 24920284 A JP24920284 A JP 24920284A JP S6325884 B2 JPS6325884 B2 JP S6325884B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- multilayer printed
- wiring board
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- 239000011888 foil Substances 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 7
- 241000562569 Riodinidae Species 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000013067 intermediate product Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24920284A JPS61125711A (ja) | 1984-11-26 | 1984-11-26 | 多層印刷配線板の孔穿設位置検出法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24920284A JPS61125711A (ja) | 1984-11-26 | 1984-11-26 | 多層印刷配線板の孔穿設位置検出法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61125711A JPS61125711A (ja) | 1986-06-13 |
| JPS6325884B2 true JPS6325884B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-05-27 |
Family
ID=17189426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24920284A Granted JPS61125711A (ja) | 1984-11-26 | 1984-11-26 | 多層印刷配線板の孔穿設位置検出法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61125711A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899440A (en) * | 1986-12-31 | 1990-02-13 | Systems Analysis And Integration | Method and apparatus for locating targets on a panel and performing work operations thereon |
| JPH0271957A (ja) * | 1988-09-01 | 1990-03-12 | Matsushita Electric Works Ltd | 穴加工方法及び装置 |
| US5611147A (en) * | 1993-02-23 | 1997-03-18 | Faro Technologies, Inc. | Three dimensional coordinate measuring apparatus |
| JP4844714B2 (ja) * | 2005-08-22 | 2011-12-28 | ミツミ電機株式会社 | 多層配線基板 |
| CN108811333A (zh) * | 2018-06-22 | 2018-11-13 | 胜宏科技（惠州）股份有限公司 | 一种提高背钻孔品质的方法 |
| CN111113549B (zh) * | 2019-12-16 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | 超厚芯板冲孔系统及超厚芯板冲孔方法 |
-
1984
- 1984-11-26 JP JP24920284A patent/JPS61125711A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61125711A (ja) | 1986-06-13 |