JPS6325735Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an apparatus for bonding a synthetic resin tape to a thin circular plate (generally referred to as a wafer) made of silicon or the like during the semiconductor manufacturing process.

Semiconductor devices are manufactured on wafers,
In order to handle this efficiently and automatically in subsequent processes, prepare an outer frame with an inner circle larger than the outer circumference of the wafer, and tape the wafer from the back side to a set position within the frame to hold it in the outer frame. method is taken.
Conventionally, the work of applying this tape was done manually, but it was inefficient and had the disadvantage that the adhesive state was uneven.

This idea automates this process and enables uniform adhesion. Although the wafer is disk-shaped, it has a reference side (orientation flat) for determining its position, so it is necessary to determine its position using the reference side even in the process after tape bonding.

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, a wafer 1 is placed on a table 3 on the left side, with the reference side 2 kept in a fixed direction (to the right in the figure), with the surface on which the elements are made facing upward. Then flip this 180 degrees and place it on the mount table 4 next to it.
It is placed upside down and set in the center. As a result, the reference side 2 becomes the left side in the figure.

On the other hand, the outer frame 5, which is annular and has an opening in the center into which the wafer can enter, is fed with its reference side 6 in the same direction as the reference side 2 of the wafer 1 on the mounter table 4, and is set outside the wafer 1. be done. Here, the two reference sides 2 and 6 are parallel.

Note that the wafer 1 and the outer frame 5 can be bonded to the tape by heat bonding or bonding using an adhesive, but first, the bonding by heat bonding will be explained.

FIG. 2 shows a side view of the mounter table 4, with the wafer 1 and the outer frame 5 set on the table 4. As shown in FIG. Here, a long tape 7 having a width wider than the outer diameter of the outer frame 5 is placed horizontally on the mounter table 4 by guide rolls 8 and 9. Note that the tape 7 has its lower surface as an adhesive surface, and is wound intermittently from right to left in the figure. A heater (not shown) is installed inside the mounter table 4 to heat the wafer 1 and the outer frame 5, and when the temperature reaches a predetermined temperature, the mounter table 4 is pushed up to the position indicated by the dashed line 10 in the figure. At this time, the wafer 1 on the table 4 and the outer frame 5 push up the tape, and the tape becomes mid-height between the rolls 8 and 9. Next, the pressure roll 11 waiting outside the table 4 reciprocates from side to side to strongly press the tape 7 onto the heated wafer 1 and outer frame 5 to complete the adhesion. Thereafter, with the table 4 in the same position, an annular cutter 12 made to match the outer diameter of the table 4 is lowered and the tape 7 is cut out by the edge of the table 4 and the cutter 12. Note that since the width of the tape 7 is wider than the width of the table, that is, the outer frame 5, the uncut portion on the outer periphery of the tape returns to the position connecting the top surfaces of the rolls 8 and 9, and the table 4 protrudes from the punch hole of the tape. becomes. Thereupon, the combined wafer and outer frame are taken out by a take-out device (not shown), and a new wafer and outer frame are supplied onto the table 4, which is set, and the table 4 is lowered. When the downward movement is completed, the tape 7 is in the state shown by the solid line in FIG.
, and the automatic mounting process continues repeatedly.

In the above, the method of accurately positioning the wafer using the reference side can be achieved by conventionally known means, and the handling of the wafer, fixing on the table, etc. can also be accomplished by known means.

In the above, the wafer and tape were bonded by heating, but it is also possible to bond the wafer and tape by using an adhesive.
At that time, an adhesive applicator is provided on the lower surface of the tape to be supplied.

As described above, in this invention, the wafer is pushed up against the tape, and the film is pasted in a correctly stretched state, and the adhesion state is always uniform, without individual differences unlike when it is done manually.
It has the feature of being able to work continuously and automatically.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing the order of moving and mounting wafers, and FIG. 2 is a side view showing the state of the table and film. 1...Wafer, 4...Mounter table, 5...
... Outer frame, 7 ... Tape, 11 ... Pressure roller, 1
2...Circular cutter.

Claims (1)

[Scope of utility model registration request] A mounter table that can be moved up and down, has one blade on the outer periphery, and sets the wafer and outer frame on the top surface with both reference sides aligned parallel to each other, and a tape with the bottom surface as the adhesive surface is supplied on the top surface. , a tape feeding mechanism that intermittently winds the tape wider than the outer frame; a pressure roll that presses the tape from above when the table is positioned above the tape winding position; and an outer periphery of the table. A wafer tape mounter consisting of an annular cutter that can move up and down.