JPS63255984A - Optical semiconductor element package and manufacture thereof - Google Patents

Abstract

PURPOSE:To decide correctly the relative position of an optical semiconductor element and a window or a lens in the direction of an optical axis by a method wherein the vicinity of the fixed part of the window or the lens is subjected to position control by means of a stopper and so on to the optical semiconductor element in the direction of an optical axis. CONSTITUTION:A part 2', which protrudes as long as the necessary distance between a laser chip 5 and a lens 6 from a part fixed with the chip 5, is formed at the point of a submount 2 and the distance between the protruding part 2' of the submount and a lens fixed part 3' of a cap is made some smaller than the protrusion amount of a projection 4. Here, when pressure and voltage are applied in the directions shown by arrows, the cap member in the vicinity of the lens 6 is subjected to position control at the protruding part 2' of the submount and in contrast to this, resistance welding vicinities 21 are deformed by the pressure and resistance welding parts are fixed. Thereby, a laser collimator positioned correctly in the direction of an optical axis can be manufactured by a simple method of resistance welding.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an optical semiconductor element package used in optical communications and the like, and a method for manufacturing the same.

(Prior Art) Optical semiconductor devices such as light emitting devices and light receiving devices used in optical communications are usually hermetically sealed to prevent deterioration due to oxidation. The general structure of this hermetically sealed package is such that an optical semiconductor element is fixed to a submount or a header, and a transparent window or a cap with a lens is fixed thereto by resistance welding.

Although the above-mentioned conventional method has the advantage that the hermetic seal is sufficiently achieved by the simple method of resistance welding, however, the relative position of the optical semiconductor element and the window or lens, especially the Regarding the optical axis direction, accurate positioning is not always sufficient, and for example, there is a problem that it is difficult to obtain a laser collimator or the like to obtain a parallel beam.

That is, FIG. 6 is a diagram illustrating the configuration of a conventional semiconductor laser collimator.
Alternatively, a protruding projection 16 is provided on either of the caps 15, and current and pressure are applied via the projection pin 16 to fix the two. In particular, when fixing is carried out in a conventional manner using the above-mentioned members, a projector.

Since it is difficult to keep the deformation of the lens 16 constant, even if the position of the lens 6 in the cap and the laser chip 5 on the submount 17 are set accurately in advance, the laser 5 and There was a problem in that the relative position with respect to the lens 6 in the optical axis direction could not be determined accurately.

(Problems to be Solved by the Invention) As described above, in the conventional optical semiconductor element package, the relative position of the optical semiconductor element and the window or lens, in particular,
Regarding the optical axis direction, there was a problem in that accurate positioning was difficult.

An object of the present invention is to provide an optical semiconductor element package in which the relative position of an optical semiconductor element and a window or lens can be accurately determined in the optical axis direction, and a method for manufacturing the same.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve such an object, the optical semiconductor device package according to the present invention has a structure in which the vicinity of the fixed portion of the window or lens is
The structure is such that the position of the optical semiconductor element is regulated in the optical axis direction by, for example, a stopper or the like.

Furthermore, in the optical semiconductor device package according to the present invention, by applying pressure during the resistance welding process of the transparent window or the cap with the lens, the parts other than the fixed part of the window or the lens are
For example, it is manufactured by deforming a portion such as the vicinity of a resistance weld.

(Function)' In the optical semiconductor device package according to the present invention, the vicinity of the fixing portion of the window or lens may, for example,
Since the structure is such that the position is regulated in the optical axis direction by a stopper, etc., if the position of the lens in the cap and the laser chip on the submount are set accurately in advance, the position in the optical axis direction will be automatically regulated. Furthermore, in the optical semiconductor device package according to the present invention, by applying pressure in the resistance welding process of the cap, parts other than the vicinity of the fixing part of the window or lens, such as the vicinity of the resistance welding part, can be Since the optical semiconductor device is manufactured by being deformed, an optical semiconductor device package having desired characteristics can be realized without causing misalignment between the optical semiconductor device and the window or lens in the optical axis direction.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram for explaining the present invention in detail, and is a diagram showing the manufacturing method and configuration of a laser collimator. Figure 1 (a
), a laser chip 5 is accurately positioned and fixed at the tip of a submount 2 integrated with a header 1. At the tip of the submount 2, a portion 2 is formed that protrudes from the portion to which the laser chip 5 is fixed by the required distance between the laser chip 5 and the lens 6. A cap 3 with a lens 6 and a projection 4 attached thereto is installed on such a header 1 with a submount. At this time, the lens 6 is accurately aligned in the optical axis direction such that, for example, one end of the spherical surface of the lens is on the same plane as the cap bottom surface 3. Then, the protruding part 2 of the submount
' and the lens fixing part 3 of the cap is slightly smaller than the protruding part of the projection 4. (a)
When pressure and voltage are applied in the direction of the arrow in the drawing to the arrangement as shown in Φ), the position of the cap member near the lens 6 is regulated by the protrusion 2 of the submount, as shown in the figure. On the other hand, the vicinity 21 of the resistance weld is deformed by pressure, and the resistance weld is fixed.

With such a configuration, a laser collimator that is accurately positioned in the optical axis direction can be manufactured by a simple method of resistance welding.

FIG. 2 is a diagram for explaining another embodiment of the present invention, and similarly to FIG. 1, it is a diagram showing the manufacturing method and structure of a laser collimator. In FIG. 2, in addition to the submount 7, a stopper 8 for regulating the position of a member near the lens 6 is provided on the header 1. The manufacturing method is similar to that shown in FIG. 1, in which the resistance weld area 22 is deformed by applying pressure and voltage in the direction of the arrow in the drawing.

Moreover, FIGS. 3 to 5 are diagrams for explaining other embodiments of the present invention, and similarly to FIG. 1, they are diagrams showing the manufacturing method and structure of the laser collimator. In both Figures 3, 4, and 5, the submount 9 serves as a stopper, and in Figure 3,
The periphery 23 of the lens 6 fixing part is the header 14 in FIG.
In FIG. 5, the resistance welding portion 24 shown in FIG.

In the embodiments of the present invention, a laser diode is used as an optical semiconductor element, and a lens is used as a transparent window. The same applies.

〔Effect of the invention〕

As described above, the present invention can provide an optical semiconductor element package in which the relative position of an optical semiconductor element and a window or lens is accurate in the optical axis direction, and a method for manufacturing the same.

[Brief explanation of the drawing]

1 to 5 are diagrams for explaining an embodiment of the present invention, and FIG. 6 is a diagram for explaining a conventional example. 1.14...Header, 2.7,9.17...Submount, 3.10,12
, 15.26... Cap, 5... Laser chip, 4.11, 13, 16, 27... Projection,
6...Lens, 8...Stopper.

Claims (1)

[Claims] 1. Optical semiconductor elements such as a light emitting element and a light receiving element are built-in,
An optical semiconductor device package hermetically sealed with a transparent window or a cap with a lens, characterized in that the position of the vicinity of the fixed portion of the window or lens is regulated relative to the optical semiconductor device in the optical axis direction. Semiconductor element package. 2. The cap with a transparent window or lens is fixed to the header using resistance welding, and the pressure applied in the resistance welding process deforms the window or lens other than the area where it is fixed. A method for manufacturing a featured optical semiconductor device package.