JPH01293587A - Photoelectronic device - Google Patents

Abstract

PURPOSE:To enable the positioning of a stem and a cap in rotational direction to be made accurately and easily by providing a positioning part positioned by the same position regulation guide to a stem with a photo element at the main surface and a cap which is mounted to the main surface of the stem and which has a transparent window. CONSTITUTION:In a photoelectronic device consisting of a stem 1 with photo element 5 and 7 on the main surface and a cap 2 which is mounted to the main surface of the stem 1 and has a transparent window 11, positioning parts 15 positioned by a same positioning regulation guide 16 are provided at the above stem 1 and the cap 2 respectively. For example, a positioning part 15 consisting of a V-character shaped cavity is provided at the periphery edge of the stem 1 where the semiconductor laser element 5 and the optical element 7 for monitoring an astigmatism correction type semiconductor laser device are fixed and at the periphery edge of a flange 14 of the cap 2 with the slanted transparent window 11. Then, a position regulation guide 16 whose tip protrudes in V-shape is engaged to their positioning part 15 and welding is performed after performing relative positioning of the cap 2 for the stem 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology that is generally applicable and effective in manufacturing optoelectronic devices, and in particular, semiconductor laser devices in which the transparent window in the ceiling of the cap is an inclined surface.

(Prior art) Light source for optical communication or digital audio disk,
Semiconductor laser elements with various structures have been developed as light sources for information processing devices such as video disks. For example, as a light source for information processing devices such as digital audio discs and video discs, semiconductor lasers such as those described in "Nikkei Electronics," September 14, 1981 issue, pages 138 to 152, published by Nikkei McGraw-Hill, are known. ing.

Generally, in this type of semiconductor laser device, a semiconductor laser element (laser diode) is fixed to a heat sink provided at the center of the main surface of the stem via a submount, and a photodetector element attached to the main surface of the stem is used. The intensity of the laser beam is monitored. Further, the laser light to be used is emitted outside the pan cage through a transparent window into which a transparent body made of glass or the like is fitted in the ceiling portion of the cap attached to the stem surface.

In addition, in a semiconductor laser device having such a structure, as one method for correcting the astigmatism difference (astigmatism) of a laser diode (semiconductor laser), for example, there is a method described in "Oko Materials" published by Kogyo Kenkyukai, 1985. As described in the February issue, February 1, 1985, pages 268 to 72, the glass plate that makes up the transparent part is tilted at a predetermined angle with respect to the mirror surface of the laser chip. It has been known.

In addition, in a semiconductor laser device in which a transparent window is tilted in order to correct astigmatism, the applicant has proposed that the positioning portions provided on the stem and cap be mutually aligned in order to position the stem and cap in the rotational direction. proposed a structure that fits into the two (Japanese Patent Application No. 60-209967).

(Problems to be Solved by the Invention) In the production of conventional optoelectronic devices in which the transparent window is generally not an inclined surface, conditions for the combination welding position accuracy during welding in fixing the cap and stem, which are the main components, are Since the upper surface of the cap is flat, the position of the cap is only defined by the amount of deviation of the center of the cap with respect to the center of the stem, and there is no need to specify the rotational (θ) deviation in the direction of rotation of the cap.

However, in assembling the astigmatism correction type semiconductor laser device as described above, since there is a directionality between the laser beam emission direction and the glass plate (transparent window), the glass plate When fixing the attached cap to the stem, it is necessary to pay careful attention to its direction.

The present invention, similar to the above-mentioned Japanese Patent Application No. 60-209967,
This was made after a request for highly accurate positioning of the stem and cap in the rotational direction.

An object of the present invention is to provide an optoelectronic device that allows highly accurate positioning of a stem and a cap relative to each other in the rotational direction.

Another object of the present invention is to provide an optoelectronic device that allows easy rotational positioning of a stem and a cap.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this order is as follows.

That is, in the astigmatism correction type semiconductor laser device of the present invention, positioning portions are provided at two locations corresponding to the peripheries of the stem and the cap, respectively. This positioning portion is constituted by a 7-shape recess having the same angle and positioned by a position regulation guide whose tip has a 7-shape. Therefore, in assembling an astigmatism correction type semiconductor laser device, the stem and the cap are stacked so that their respective positioning portions each having a 7-shaped recess overlap each other, and the position control is such that the tip has a 7-shaped recess. The rotational position of the stem and cap is determined by fitting the guide. Also, the stem and cap are then secured together by welding.

(Function) According to the above-described means, the astigmatism correction type semiconductor laser device of the present invention is assembled so that the stem and the cap are stacked so that the positioning portions of the figure 7 recesses overlap, and Since position regulating guides whose tips protrude in a figure 7 shape are fitted into the overlapping positioning parts, the rotational direction positioning of the stem and the cap is performed with high precision.

In addition, the work of positioning the stem and cap in the rotational direction is
After roughly positioning the cap with respect to the stem, the tip of the position regulating guide is automatically inserted forward into the positioning part consisting of the figure 7 recess of the stem and cap, and this is done automatically, making the positioning work easier. There is a certain effect.

(Requires a lot of skill) The first circle is a perspective view showing an astigmatism correction type semiconductor laser device according to an embodiment of the present invention, the second figure is a plan view, and the third figure is a fixed part of the stem and cap. FIG. 4 is a perspective view showing the stem set on the sealing electrode; FIG. 5 is a cross-sectional view showing the cap and stem set on the sealing electrode; FIG. FIG. 2 is a cross-sectional view showing a sealed state of the stem and the cap.

In this embodiment, the semiconductor laser device 5 serves as a light source for a compact disc! An example in which the present invention is applied to (optoelectronic device) will be shown. As shown in FIG. 1, the semiconductor laser device consists of a plate-shaped stem which is the main component of the assembly, and a cap 2 hermetically fixed to the main surface of the stem 1.

The stem 1 is a circular metal plate with a thickness of several rl 1 m, and a copper heat sink 3 is fixed to the center of its main surface (-F surface) with a brazing material or the like. A semiconductor laser element (laser diode chip) 5 is fixed to the side surface of the heat sink 3 via a sub-7 14.

The laser diode chip 5 emits laser light 6 from its upper and lower emission surfaces, respectively.

On the other hand, a light receiving element 7 is fixed to the main surface of the stem 1, which receives the laser beam 6 emitted from the lower end of the laser diode chip 5 and monitors the optical output of the laser beam 6.

On the other hand, three rods 8 are fixed to the stem 1. One wire 8 is electrically and mechanically fixed to the back side of the stem 1, and the other two wires 8 pass through the stem 1 and are connected to the stem 1 through an insulator 9 such as glass. It is electrically insulated and fixed. The upper ends of two wooden boards 8 projecting from the main surface of the stem 1 are connected to respective electrodes of the laser diode chip 5 and the light receiving element 7 via wires 10, respectively.

Further, a metal cap 2 having a transparent window 11 is hermetically sealed on the main surface of the stem 1 by welding, and seals the laser diode chip 5 and the heat sink 3. The transparent window 11 is formed by airtightly closing a circular hole provided in the ceiling portion 12 of the cap 2 with a transparent glass plate 13. Furthermore, since the ceiling 12 is slanted, the glass plate 13 attached to the ceiling 12 is also slanted.

In such a semiconductor laser device, when a predetermined voltage is applied to the lead 8, the laser diode chip 5 emits a laser beam 6. Further, since the transparent window 11 is inclined, the laser beam 6 emitted outside the package is emitted after astigmatism correction is performed.

In such an astigmatism correction type semiconductor laser device, the transparent window 11 must be tilted in a constant state in relation to the laser diode chip 5, as described above. Therefore, when welding the cap 2 to the stem 1, prior to welding, the positioning of the stem 1 and the laser diode chip 5,
In other words, it is necessary to position the stem 1 to which the laser diode chip 5 is attached and the cap 2 in the rotational direction.

Therefore, in this embodiment, as shown in FIGS. 1 and 2, positioning portions 15 each consisting of a ■-shaped recess are provided at the periphery of the stem 1 and the periphery of the flange 14 of the cap 2. Welding is performed after positioning the stem 1 and the cap 2 using the positioning part 15.

That is, as shown in FIG. 2, the positioning portions 15 are provided on the stem 1 and the cap 2 at an interval of 180 degrees. Further, the ■-shaped recesses constituting the positioning portion 15 are each expanded at the same angle, and are provided so as to coincide with each other when the stem 1 and the cap 2 are overlapped. Then, a position regulating guide 16 whose tip protrudes in a V-shape moves forward and fits into these positioning parts 15, and the stem 1
The cap 2 is positioned relative to the cap 2.

Next, positioning and welding of the stem 1 and cap 2 will be explained.

For the stem 1 and cap 2, a welding jig 17 as shown in FIGS. 4 to 6 is used.

This welding jig 17 includes a cylindrical main body 18 and a main body 1
8, and a pair of position regulating guides 16 disposed on the main surface of the lower electrode 19 and slidably incorporated into the main body 18. As shown in FIG. 5, the cap 2 is inserted into the lower electric bridge 19 upside down. Lower electric scraper 19
The inner peripheral surface of the cap 2 serves as a guide for guiding the outer periphery of the cap 2 and positioning the cap 2 in the plane XY force directions. Therefore, with the cap 2 inserted into the lower electrode 19, the cap 2 is positioned in the plane XY force direction. Therefore, as shown in FIG. 5, with the pair of position regulating guides 16 on the lower electrode 19 moved forward to some extent, the cap 2 is placed on the lower electrode 19 at its positioning portion 1.
5 is placed so as to match the position regulation guide 16,
Positioning of the cap 2 in the rotational direction is also performed simultaneously with positioning in the plane XY force direction.

Next, the stem 1 to which the laser diode chip 5 is fixed and the wire 10 is connected is turned over and placed on the cap 2 attached to the welding jig 17.

At this time, the positioning part 15 of the stem 1 is also
Make it match 6.

Next, the position regulation guides 16 are moved forward relative to each other, and the V-shaped protrusion at the tip of the position regulation guide 16 is inserted into the positioning part 1.
Fit it into the ■-shaped recess of 5. Due to this fitting, if the stem 1 and the cap 2 are misaligned in their rotational directions, this is corrected by the position regulation guide 16, so that the rotational direction of the stem 1 and the cap 2 can be positioned with high precision. .

Next, as shown in FIG. 6, an upper electrode 20 is placed on the overlapping cap 2 and stem 1, and a predetermined voltage is applied between the lower electrode 19 and the lower electrode 20, so that the stem 1 Then, the cap 2 is welded. After welding, the upper cap 8i20 is removed, and the stem 1 with the cap 2 attached, that is, the semiconductor laser device, is taken out, and the assembly of the semiconductor laser device is completed.

The semiconductor laser device manufactured in this manner has a high degree of astigmatism correction.

According to such an embodiment, the following effects can be obtained.

(1) The astigmatism correction type semiconductor laser device of the present invention includes:
Since the stem and the cap are each provided with a positioning section that is regulated by the same position regulation guide, when assembling a semiconductor laser device, after roughly positioning the cap on the stem, the position regulation guide The positions of the positioning portions of the stem and the cap can be corrected at the same time, resulting in the effect that highly accurate positioning can be performed.

(2) According to (1) above, the astigmatism correction type semiconductor laser device of the present invention is assembled after the stem and cap are positioned with high precision and then welded.
The effect of increasing the reliability of astigmatism difference correction can be obtained.

(3) According to (1) above, in the assembly of the astigmatism correction type semiconductor laser device of the present invention, the stem and the cap can be manufactured with good reproducibility by fitting the respective positioning portions with the position regulating guides. Therefore, the effect of improving the yield can be obtained.

(4) According to (1) above, in assembling the astigmatism correction type semiconductor laser surface of the present invention, positioning in the rotational direction with respect to the stem and the cap is performed by the positioning portion provided on the stem and the cap. Since this can be done simply by fitting the regulation guide, it is easy to work and can be done in a short time, resulting in improved productivity.

(5) As a result of (3) and (4) above, the astigmatism correction type semiconductor laser device of the present invention has the advantage that it is possible to reduce manufacturing costs by improving yield and productivity in its manufacture. is obtained.

(6) According to the above (1) to (5), according to the present invention, a synergistic effect can be obtained in that the reliability of astigmatism correction is improved and a semiconductor laser device can be provided at a low cost.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, as shown in FIG. 7, the positioning portion 15 provided on the flange 14 of the cap 2 has a
Even if it is provided as a recess, the same effect as in the above embodiment can be obtained.

Further, it goes without saying that the number of positioning parts 15 provided on the stem 1 and the cap 2 may be larger, but when the stem 1 and the cap 2 are not concerned with positioning in the plane XY force direction but only in the direction of rotation, There may be one location for each.

In the above explanation, the invention made by the present inventor was mainly applied to a semiconductor laser device that serves as a light source for a compact disc, which is the field of application in which the invention was made, but the present invention is not limited thereto. ,
In addition to semiconductor laser devices in which astigmatism is a problem, or integrated optical devices (OEICs) having a semiconductor laser section, or optical devices such as the semiconductor laser device as in the above embodiment, other devices such as light receiving devices, etc. It can be applied to optoelectronic devices incorporating optical elements.

At least the present invention can be applied to techniques for positioning and fixing articles.

[Effects of the Invention] A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In the astigmatism correction type semiconductor laser device of the present invention, the flanges of the stem and the cap are provided with positioning portions in the shape of a square mark so as to overlap with each other, and in the positioning prior to welding the stem and the cap, When the flanges of the caps are overlapped, position regulating guides whose tips protrude in a 7-shape shape are fitted into these positioning portions to perform positioning in the rotational direction, allowing highly accurate positioning. Therefore, by welding performed after such positioning, the inclination direction of the transparent window of the cap with respect to the laser diode chip is always formed with good reproducibility, resulting in a semiconductor laser device with high reliability in astigmatism correction.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an astigmatism correction type semiconductor laser device according to an embodiment of the present invention, Fig. 2 is a plan view thereof, and Fig. 3 is a partially enlarged view showing the fixed portion of the stem and cap. 4 is a perspective view showing the stem set for sealing, FIG. 5 is a sectional view showing the cap and stem being placed on the sealing bridge, and FIG. 6 is the same stem. FIG. 7 is a sectional view showing the sealed state of the cap, and FIG. 7 is a plan view showing a cap according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Stem, 2... Cap, 3... Heat sink, 4... Submount, 5... Semiconductor laser element (laser diode chip), 6... Laser light, 7
... Light receiving element, 8 ... Lead, 9 ... Insulator, 1
0...Wire, 11...Transparent window, 12...Ceiling, 13...Glass), 14...Flange, 15...
...(Vertical positioning part, 16...Position regulation guide, 17.
...Welding jig, 18... Main body, 19... Lower electrode, Fig. 5 Fig. 6 Fig. 7 \0 1 1 \ -゛-J

Claims (1)

[Claims] 1. An optoelectronic device consisting of a stem having an optical element on its main surface and a cap attached to the main surface of the stem and having a transparent window, wherein the stem and the cap are positioned by the same position regulating guide. An optoelectronic device characterized in that it has a respective section. 2. The optoelectronic device according to claim 1, wherein the positioning portion is formed of a V-shaped groove having the same angle, and is provided so as to correspond to the peripheral edge of the stem and the flange edge of the cap, respectively.