JPS6325502B2 - - Google Patents
Info
- Publication number
- JPS6325502B2 JPS6325502B2 JP57106150A JP10615082A JPS6325502B2 JP S6325502 B2 JPS6325502 B2 JP S6325502B2 JP 57106150 A JP57106150 A JP 57106150A JP 10615082 A JP10615082 A JP 10615082A JP S6325502 B2 JPS6325502 B2 JP S6325502B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- package
- case
- alloy
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 56
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 56
- 238000007789 sealing Methods 0.000 claims description 41
- 238000003466 welding Methods 0.000 claims description 25
- 229910000838 Al alloy Inorganic materials 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910021364 Al-Si alloy Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910018137 Al-Zn Inorganic materials 0.000 claims 1
- 229910018573 Al—Zn Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 ferrous metals Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57106150A JPS58223350A (ja) | 1982-06-22 | 1982-06-22 | アルミニウムパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57106150A JPS58223350A (ja) | 1982-06-22 | 1982-06-22 | アルミニウムパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58223350A JPS58223350A (ja) | 1983-12-24 |
| JPS6325502B2 true JPS6325502B2 (fr) | 1988-05-25 |
Family
ID=14426304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57106150A Granted JPS58223350A (ja) | 1982-06-22 | 1982-06-22 | アルミニウムパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58223350A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519184A (en) * | 1994-05-20 | 1996-05-21 | Litton Systems, Inc. | Reusable laser welded hermetic enclosure and method |
| JPH10230379A (ja) * | 1997-02-20 | 1998-09-02 | Kobe Steel Ltd | アルミニウム合金製容器の製造方法 |
| JP4846282B2 (ja) * | 2005-06-29 | 2011-12-28 | ミヤチテクノス株式会社 | 電子部品パッケージ封止方法及び装置 |
| JP5259152B2 (ja) * | 2007-09-28 | 2013-08-07 | 株式会社東芝 | 電池セル、バッテリパックおよび電池セル製造方法 |
| DE102013002628B4 (de) * | 2013-02-18 | 2014-09-04 | Tesat-Spacecom Gmbh & Co.Kg | Gehäuse und Verfahren zum Verbinden zweier Gehäuseteile |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147135A (ja) * | 1982-02-26 | 1983-09-01 | Fujitsu Ltd | アルミ合金パツケ−ジ |
-
1982
- 1982-06-22 JP JP57106150A patent/JPS58223350A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147135A (ja) * | 1982-02-26 | 1983-09-01 | Fujitsu Ltd | アルミ合金パツケ−ジ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58223350A (ja) | 1983-12-24 |
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