JPS63254740A - 半導体のオ−プナ−装置 - Google Patents
半導体のオ−プナ−装置Info
- Publication number
- JPS63254740A JPS63254740A JP8891687A JP8891687A JPS63254740A JP S63254740 A JPS63254740 A JP S63254740A JP 8891687 A JP8891687 A JP 8891687A JP 8891687 A JP8891687 A JP 8891687A JP S63254740 A JPS63254740 A JP S63254740A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- chip
- package
- semiconductor
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000243 solution Substances 0.000 claims abstract description 16
- 238000012856 packing Methods 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims abstract description 10
- 239000007924 injection Substances 0.000 claims abstract description 10
- 239000007921 spray Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 239000007788 liquid Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891687A JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891687A JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63254740A true JPS63254740A (ja) | 1988-10-21 |
| JPH0458182B2 JPH0458182B2 (US07223432-20070529-C00017.png) | 1992-09-16 |
Family
ID=13956248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8891687A Granted JPS63254740A (ja) | 1987-04-13 | 1987-04-13 | 半導体のオ−プナ−装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63254740A (US07223432-20070529-C00017.png) |
-
1987
- 1987-04-13 JP JP8891687A patent/JPS63254740A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458182B2 (US07223432-20070529-C00017.png) | 1992-09-16 |
