JPS6324700A - Radio frequency equipment - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to high frequency equipment using a double-sided printed wiring board.

BACKGROUND OF THE INVENTION Conventional high frequency shield structures have been constructed as shown in FIGS. 4 to γ.

The description will be given below based on the drawings.

FIGS. 4a and 4b show a metal shield plate 1 in which through-hole holes 13 are formed on the wall surface of a single-sided printed wiring board 11 by electroplating, chemical plating, etc. to reduce interference between electric circuits.
The board soldering portion 14 of No. 2 and the ground pattern are soldered together.

6a and 6b, a through hole 16 is formed in a double-sided printed wiring board 15, and the ground patterns on both sides are made conductive using a connecting lead wire 17 as shown in FIG. The shield plate 120 is soldered to the board soldering portion 14.

In FIG. 6, the soldered portion 1B& of the metal shield plate 18 was passed through the slit hole 19 of the double-sided printed wiring board 15 and soldered later.

Problems to be Solved by the Invention Of these conventional methods, the double-sided printed wiring board 11 provided with the through-hole holes 13 is expensive, and due to the reliability of the conduction of the through-hole holes 13, the material and through-hole formation are expensive. There are legal restrictions, and manual soldering with the high frequency shield plate 12 is required to provide a shielding effect.

Furthermore, although the structure shown in FIG. 6 can be realized at a lower cost than the structure shown in FIG. Become.

Furthermore, in the case shown in FIG. 6, the high frequency shield plate 18
Depending on the height of the board, dip soldering is possible on both the top and bottom surfaces, but problems remained in the soldering strength and reliability of the connection due to the difference in thermal expansion coefficient between the printed wiring board 15 and the metal shield plate 18. .

The present invention solves the above problems without using a double-sided printed wiring board with one through hole.

The purpose of the present invention is to achieve conduction between ground patterns on both sides and shielding between circuits relatively easily and at low cost with a structure with high soldering reliability.

Means for Solving the Problem In order to solve this problem, the present invention protrudes a part of the metal shield plate, inserts this protrusion into a through hole penetrating the wiring board, and inserts the tip of the protrusion. The bent part is soldered to make it conductive to the high frequency grounding pattern.

action The present invention provides electroplating with the above-described configuration.

Without forming through holes by chemical plating or the like, it is possible to realize high frequency shielding between components and circuits using both high frequency grounding patterns and a high frequency shield plate.

Furthermore, by soldering the bent portion of the protruding portion of the first metal shield plate, the soldering strength can be increased, and the soldering reliability can also be increased.

Embodiment Below - An embodiment of the present invention will be described based on the accompanying drawings.

FIG. 1 shows a high frequency circuit device using a double-sided copper-clad laminated printed wiring board according to the present invention.

Generally, such high-frequency circuit devices are amplifier circuits.

There are many examples in which circuit devices having functions such as oscillation circuits and high frequency switching circuits are made into units, and FIG. 1 is a perspective view thereof.

In Fig. 1, 1 is a plug for high frequency signal connection;
Reference numeral 2 denotes a casing for unitizing the mechanical and electrical circuits of the high frequency circuit, and a printed wiring board 3 having double-sided copper-clad lamination is mounted on this casing 2.

On the upper surface of the printed wiring board 3, semiconductors, chip resistors, capacitors, etc. (not shown) constituting an electric circuit are mounted. The lower surface of the printed wiring board 3 has a high-frequency ground pattern formed on almost the entire surface except for the component insertion hole.

Reference numeral 4 denotes a metal shield plate that provides electrical high-frequency shielding between electric circuits or between one component, and as shown in Fig. 2, a U-shaped metal piece 5 is integrally formed in a part thereof to protrude. . In addition, in order to insert the U-shaped metal piece 6 into the printed wiring board 3, a U-shaped metal piece 6 is inserted through the high-frequency grounding pattern on the component mounting surface, that is, the circuit pattern surface, and into the high-frequency grounding pattern surface on the back side of the board 3. A pair of parallel slit holes 8 corresponding to the shaped metal piece 6 are formed.
Insert the metal piece 5 into the metal piece 6, squeeze and bend the tip of the metal piece 6 so that it touches the high frequency grounding pattern 7 on the back of the board 3,
Dip solder 9 on the side of the constriction part. Note that 6 is also a grounding pattern.

Next, if there is a component to be inserted on the constriction side, insert the component, and apply dip solder 10 to the circuit mounting pattern surface on the shield plate insertion side, and connect the high frequency ground pattern 7 to 2.
This can be achieved without manual soldering while increasing the shielding effect with just one soldering.

Furthermore, by tightening and soldering the tip of the U-shaped metal piece 5 as shown in FIG. 3, there is an effect that the deterioration of soldering strength, which was conventional, is eliminated.

Effects of the Invention As described above, according to the present invention, it is possible to improve the shielding effect of high-frequency circuits without using expensive products having through-holes formed by electroplating, chemical plating, etc., and to improve soldering reliability. can also be increased.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a high-frequency device according to an embodiment of the present invention, and FIG.
The figure is an enlarged perspective view of the metal shield plate, Figure 3 is a cross-sectional view showing the assembled structure of the metal shield plate and printed wiring board, and Figure 4 is an enlarged perspective view of the metal shield plate.
Each turtle in Figures 6 to 6. b is a perspective view and an enlarged sectional view of a conventional example. 3...Printed wiring board, 4...Metal shield plate, 6...Metal piece (projection). Name of agent: Patent attorney Toshio Nakao and 1 other person/-
--Frame box Z-4 body J-11 double-sided stamp Kite distribution board 4-, Fake sticker) Figure 1 Figure 2 Figure 3 and Figure 4 Figure 5

Claims (1)

[Claims] A circuit pattern and a high-frequency grounding pattern are formed on one side of a double-sided printed wiring board, and circuit components are mounted thereon, and a high-frequency grounding pattern is formed on almost the entire surface of the other side,
A metal shield plate for partitioning the mounted circuit components for high frequency shielding is provided on the one surface, a part of the metal shield plate protrudes, and this protrusion is inserted into a slit hole penetrating the wiring board. A high-frequency device is inserted, the tip of this protrusion is bent so that it comes into contact with the high-frequency grounding pattern, and this bent part is soldered to make it conductive to the high-frequency grounding pattern.