JPS6324411B2 - - Google Patents

Info

Publication number
JPS6324411B2
JPS6324411B2 JP22300884A JP22300884A JPS6324411B2 JP S6324411 B2 JPS6324411 B2 JP S6324411B2 JP 22300884 A JP22300884 A JP 22300884A JP 22300884 A JP22300884 A JP 22300884A JP S6324411 B2 JPS6324411 B2 JP S6324411B2
Authority
JP
Japan
Prior art keywords
substrate
cooling
substrate holder
cooling gas
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22300884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61103531A (ja
Inventor
Izumi Nakayama
Toshio Kusumoto
Hiroshi Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP22300884A priority Critical patent/JPS61103531A/ja
Publication of JPS61103531A publication Critical patent/JPS61103531A/ja
Publication of JPS6324411B2 publication Critical patent/JPS6324411B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP22300884A 1984-10-25 1984-10-25 真空処理装置における基板の冷却機構 Granted JPS61103531A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22300884A JPS61103531A (ja) 1984-10-25 1984-10-25 真空処理装置における基板の冷却機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22300884A JPS61103531A (ja) 1984-10-25 1984-10-25 真空処理装置における基板の冷却機構

Publications (2)

Publication Number Publication Date
JPS61103531A JPS61103531A (ja) 1986-05-22
JPS6324411B2 true JPS6324411B2 (enEXAMPLES) 1988-05-20

Family

ID=16791379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22300884A Granted JPS61103531A (ja) 1984-10-25 1984-10-25 真空処理装置における基板の冷却機構

Country Status (1)

Country Link
JP (1) JPS61103531A (enEXAMPLES)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713960B2 (ja) * 1986-12-23 1995-02-15 日本電気株式会社 ドライエッチング装置
JPS63170468U (enEXAMPLES) * 1987-04-28 1988-11-07
FR2628985B1 (fr) * 1988-03-22 1990-12-28 Labo Electronique Physique Reacteur d'epitaxie a paroi protegee contre les depots
JP2002050809A (ja) 2000-08-01 2002-02-15 Anelva Corp 基板処理装置及び方法
JP5462272B2 (ja) * 2009-10-05 2014-04-02 キヤノンアネルバ株式会社 基板冷却装置、スパッタリング装置および電子デバイスの製造方法

Also Published As

Publication number Publication date
JPS61103531A (ja) 1986-05-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees