JPS63241984A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS63241984A JPS63241984A JP7564787A JP7564787A JPS63241984A JP S63241984 A JPS63241984 A JP S63241984A JP 7564787 A JP7564787 A JP 7564787A JP 7564787 A JP7564787 A JP 7564787A JP S63241984 A JPS63241984 A JP S63241984A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pattern
- board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分Ｙｆ） この発明は改良されたプリント回路基板に関する。[Detailed description of the invention] (Industrial usage Yf) This invention relates to an improved printed circuit board.
（従来の技術）
従来のプリント回路基板はベークライト等の絶縁体より
なる基板材の表面に、銅板、導電性インク等の導体より
なる回路パターンが形成されてなるものであった。そし
て、このプリント回路基板の製造方法としては、例えば
銅板と基板材をホットプレスで積層した模この銅板面を
エツチングによって回路パターンに加工する方法や、あ
るいは基板材に導電性インクをスクリーン印刷したり無
電解メッキによって回路パターンを形成する方法等が多
用されている。(Prior Art) A conventional printed circuit board has a circuit pattern made of a conductor such as a copper plate or conductive ink formed on the surface of a substrate material made of an insulator such as Bakelite. Methods for manufacturing this printed circuit board include, for example, a method in which a copper plate and a board material are laminated by hot pressing and the surface of the copper plate is processed into a circuit pattern by etching, or a method in which conductive ink is screen printed on the board material. A method of forming a circuit pattern by electroless plating is often used.
（発明が解決しようとする問題点）
しかしながら、従来のプリント回路基板にあってはその
回路パターンが基板表面に凸状に形成されているため、
その回路パターンが損傷されやすいという問題を有して
いた。(Problems to be Solved by the Invention) However, in conventional printed circuit boards, the circuit pattern is formed in a convex shape on the board surface.
The problem was that the circuit pattern was easily damaged.
また、その配線作業の際、隣り合うハンダ打部同志がつ
ながるいわゆるハンダブリッジと呼ばれる固有の配線不
良がしばしば生じていた。Further, during the wiring work, a unique wiring defect called a so-called solder bridge, in which adjacent solder spots are connected, often occurs.
一方、その製造に際しては、と述したように多工程にわ
たる煩雑な工程によらねばならなかった。On the other hand, as mentioned above, the manufacturing process has to be complicated and involve multiple steps.
また、特にエツチングにより銅板面を回路パターンに加
工する方法にあってはその廃液処理が問題となる。In addition, particularly in the method of processing a copper plate surface into a circuit pattern by etching, disposal of the waste liquid becomes a problem.
この発明は上述したような問題点に鑑みて提案されたも
のであって、その目的とするところは、回路パターンが
外的損傷を受けにくくかつハンダブリッジが生じない改
良された新規な構造のプリント回路基板を提供すること
にある。This invention was proposed in view of the above-mentioned problems, and its purpose is to print a new and improved structure in which circuit patterns are less susceptible to external damage and do not cause solder bridges. Our goal is to provide circuit boards.
（問題点を解決するための手段）
上述の目的を達成するために、第一の発明のプリント回
路基板は、絶縁体よりなる基板材に回路パターン形状を
有するパターン溝部が形成され、前記パターン溝部の底
面部に導体部が形成されていることを特徴とするとする
ものである。(Means for Solving the Problems) In order to achieve the above-mentioned object, the printed circuit board of the first invention has a pattern groove portion having a circuit pattern shape formed in a substrate material made of an insulator, and a pattern groove portion having a circuit pattern shape. A conductor portion is formed on the bottom surface of the device.
第二の発明のプリント回路基板は、絶縁体よりなる基板
材に回路パターン形状を有するパターン溝部が形成され
、前記基板材の表面部ならびに前記パターン溝部の底面
部に導体部が形成されていることを特徴とするものであ
る。In the printed circuit board of the second invention, a pattern groove portion having a circuit pattern shape is formed in a substrate material made of an insulator, and a conductor portion is formed on a surface portion of the substrate material and a bottom surface portion of the pattern groove portion. It is characterized by:
（作用）
第一の発明のプリント回路基板においては、回路パター
ンはパターン溝部の底面部に形成された導体部より構成
されているので損傷を受けにい構造となっているのみな
らず、当該回路パターンは隣り合う回路パターンとパタ
ーン溝部の壁面によって隔てられているので配線作業の
際に隣り合うハンダ付は部同志が接続することはない。(Function) In the printed circuit board of the first invention, since the circuit pattern is composed of the conductor portion formed on the bottom surface of the pattern groove, it not only has a structure that is resistant to damage, but also has a structure that is resistant to damage. Since the pattern is separated from the adjacent circuit pattern by the wall surface of the pattern groove, adjacent soldered parts will not connect to each other during wiring work.
第二の発明のプリント回路基板においては回路パターン
は第一発明のプリント回路基板と同じくパターン溝部の
底面部に形成された導体部により構成されていて第一発
明と同様な作用を有する。In the printed circuit board of the second invention, the circuit pattern is constituted by a conductor portion formed on the bottom surface of the pattern groove like the printed circuit board of the first invention, and has the same effect as the first invention.
この第二発明のプリント回路基板では、さらにその基板
材表面部に形成された導体部をアース回路等に用いるこ
とで回路パターンを簡略化できるとともに、ノイズに強
い基板とすることができる。In the printed circuit board of the second invention, by further using the conductor portion formed on the surface of the board material for a ground circuit or the like, the circuit pattern can be simplified and the board can be made resistant to noise.
（実施例）
以下、この発明の実施例を図面に従って説明する。添付
の図面第１図は第一の発明の一実施例を示すプリント回
路基板の斜視図、第２図はその要部断面図、第３図は第
二の発明の一実施例を示すプリント回路基板の要部断面
図、第４図はこの発明方法を実施する射出成形機の要部
断面図、第５図はその可動側キャビティの一部拡大断面
図、第６図は成形状態を示した金型の一部拡大断面図で
ある。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. The attached drawings: Figure 1 is a perspective view of a printed circuit board showing an embodiment of the first invention, Figure 2 is a sectional view of the main part thereof, and Figure 3 is a printed circuit showing an embodiment of the second invention. FIG. 4 is a sectional view of the main parts of the substrate, FIG. 4 is a sectional view of the main parts of an injection molding machine that implements the method of this invention, FIG. 5 is a partially enlarged sectional view of the movable side cavity, and FIG. 6 shows the molding state. FIG. 3 is a partially enlarged sectional view of the mold.
第１図に図示したように、第一の発明のプリント回路基
板１０には、絶縁体よりなる基板材１１に回路パターン
形状を有するパターン溝部１５が形成されている。前記
パターン溝部１５には、第２図に図示したように、その
底面部１６に導体部２０が形成されて回路パターンが構
成される。As shown in FIG. 1, in the printed circuit board 10 of the first invention, a pattern groove 15 having a circuit pattern shape is formed in a substrate material 11 made of an insulator. As shown in FIG. 2, the pattern groove portion 15 has a conductor portion 20 formed on its bottom portion 16 to form a circuit pattern.
配線作業に際しては、図示したように、電子部品２５の
配線足２６がパターン溝部１５の底面部の回路パターン
２０にハンダ付けされ隣り合うハンダ付は部は互いに隔
離される。During the wiring work, as shown in the figure, the wiring legs 26 of the electronic component 25 are soldered to the circuit pattern 20 on the bottom surface of the pattern groove 15, and adjacent soldered parts are isolated from each other.
第３図には第二の発明のプリント回路基板の要部断面図
を図示した。このプリント回路基板３０は、基板材３１
の表面部３２に導体部３３が形成されかつ回路パターン
形状を有するパターン溝３５の底面部３６に導体部３８
が形成されたものである。このプリント回路基板３０に
おいては基板材表面部３２の導体部３３をアース回路と
して使用することで回路パターンを簡略化できる。FIG. 3 shows a sectional view of the main parts of the printed circuit board of the second invention. This printed circuit board 30 includes a substrate material 31
A conductor portion 33 is formed on the surface portion 32 of the pattern groove 35, and a conductor portion 38 is formed on the bottom portion 36 of the pattern groove 35 having a circuit pattern shape.
was formed. In this printed circuit board 30, the circuit pattern can be simplified by using the conductor part 33 of the board material surface part 32 as a ground circuit.
第４図にはこのプリント回路基板を製造する射出成形機
の金型型開き状態が図示される。FIG. 4 shows an open state of the injection molding machine for manufacturing this printed circuit board.
この実施例装置は、プリント回路基板形状を有する固定
側キャビティに対応する可動側キャビティに回路パター
ン形状の突条部を突設し、このキャビティ内に導体シー
トを配し、型締め後該キャビティに基板を構成する溶融
樹脂を射出注入して該樹脂の射出圧によって前記導体シ
ートを前記突条部に沿って切断分離し、底面部に導体部
が形成された回路パターン形状のパターン溝部を有する
プリント回路基板を得るようにしたものである。This embodiment device has a protruding strip in the shape of a circuit pattern protruding from a movable side cavity corresponding to a fixed side cavity having the shape of a printed circuit board, a conductive sheet is placed inside this cavity, and the mold is inserted into the cavity after mold clamping. A print having a pattern groove in the shape of a circuit pattern with a conductor part formed on the bottom surface by injecting molten resin constituting the substrate and cutting and separating the conductive sheet along the protruding part by the injection pressure of the resin. This is to obtain a circuit board.
すなわち、図に基づいて説明すると、固定盤４０に固設
された固定型４１にはプリント回路基板形状を有する固
定側キャビティ４３が形成されている。なお、固定側キ
ャビティ４３にはその内底面にピンを立設してプリント
回路基板の射出成形と同時に基板の部品取付用透孔部や
該基板固定用透孔部を形成するようにしてもよい。図の
符号４５は射出ノズル、４７はスプルーブシュである。That is, to explain based on the drawings, a fixed mold 41 fixed to a fixed platen 40 is formed with a fixed side cavity 43 having the shape of a printed circuit board. Note that pins may be provided upright on the inner bottom surface of the fixed side cavity 43 to form through-holes for mounting components on the board and through-holes for fixing the board at the same time as injection molding of the printed circuit board. . Reference numeral 45 in the figure is an injection nozzle, and 47 is a sprue bushing.
一方、可動盤５０に固設された可動型５１には前記固定
型４１の固定側キャビティ４３に対応する可動側キャビ
ティ５３が形成されている。′この可動側キャビティ５
３には回路パターン形状の突条部５５が突設される。該
突条部５５は、第５図に図示したように、その先端５７
をシャープエツジに形成することが好ましい。On the other hand, a movable mold 51 fixed to the movable platen 50 has a movable cavity 53 corresponding to the fixed cavity 43 of the fixed mold 41 . 'This movable side cavity 5
3 is provided with a projecting strip 55 in the shape of a circuit pattern. The protruding portion 55 has a tip 57 as shown in FIG.
It is preferable to form a sharp edge.
前記可動型５１のパーティング面５９には導体シー）６
０が配される。該導体シート６０は鋼材等の導電材料よ
りなるもので、例えば鋼材シートの場合その厚みは０．
５ｍｍ程度まで厚くすることができるので回路パターン
の電気特性に問題が生じることはない、また、該導体シ
ート６０の固定側キャビティ４３側には基板材樹脂への
接着剤層が形成されることがある０図の符号６５は前記
導体シート６０の送りローラ、６７はその巻取ローラで
ある。The parting surface 59 of the movable mold 51 is provided with a conductor sheet) 6
0 is assigned. The conductive sheet 60 is made of a conductive material such as steel, and in the case of a steel sheet, for example, the thickness is 0.
Since the thickness can be increased to about 5 mm, there will be no problem with the electrical characteristics of the circuit pattern, and an adhesive layer to the substrate material resin can be formed on the fixed side cavity 43 side of the conductor sheet 60. Reference numeral 65 in FIG. 0 is a feed roller for the conductive sheet 60, and 67 is a take-up roller thereof.
次に、第５図ならびに第６図に従ってこの射出成形機に
よるプリント回路基板の製造について説明すると、前述
したように可動型５１のパーティング面５９に導体シー
ト６０が配された後、型締めがなされ、キャビティに基
板を構成する溶融樹脂が注入される。樹脂が注入される
と、第５図十三点鎚線で図示したように、導体シー）６
０は、該樹脂の射出圧によって可動側キャビテイ面に強
く押圧され、突条部５５の縁であるシャープエツジ５７
によって該突条部に沿って切断されて、突条部５５の先
端部に残る導体シート部材６１とさらに可動側キャビテ
ィ５３の内底部５４へと分離する導体シート部材６３と
に分けられる。こうして、第６図に図示したように、基
板材７１には回路パターン形状のパターン溝部７５が形
成されるとともに、該パターン溝部７５の底面部７６に
導体部６１が形成されかつ基板材表面部７２に導体部６
３が形成されて、第二発明のプリント回路基板が得られ
る。なお、基板材表面部７２の導体部６３を研磨等によ
って除去すれば第一発明のプリント回路基板が得られる
。Next, the production of printed circuit boards using this injection molding machine will be explained according to FIGS. 5 and 6. As mentioned above, after the conductor sheet 60 is placed on the parting surface 59 of the movable mold 51, the mold is clamped. The molten resin constituting the substrate is injected into the cavity. When the resin is injected, the conductor sheet (6)
0 is strongly pressed against the movable side cavity surface by the injection pressure of the resin, and the sharp edge 57 which is the edge of the protrusion 55
The conductive sheet member 61 is cut along the protruding portion 55 and separated into the conductive sheet member 61 that remains at the tip of the protruding portion 55 and the conductive sheet member 63 that is further separated into the inner bottom portion 54 of the movable cavity 53. In this way, as shown in FIG. 6, a pattern groove 75 in the shape of a circuit pattern is formed in the substrate material 71, a conductor portion 61 is formed in the bottom surface 76 of the pattern groove 75, and a surface portion 72 of the substrate material is formed. conductor part 6
3 is formed to obtain the printed circuit board of the second invention. Note that by removing the conductor portion 63 on the surface portion 72 of the substrate material by polishing or the like, the printed circuit board of the first invention can be obtained.
（効果）
以上図示説明したように、第一の発明ならびに第二の発
明のプリント回路基板にあっては回路パターンが基板表
面より突出せず、従来基板のように回路パターンが外部
との接触等によって損傷を受けるおそれは大幅に減少す
る。(Effects) As illustrated and explained above, in the printed circuit boards of the first invention and the second invention, the circuit pattern does not protrude from the board surface, and unlike the conventional board, the circuit pattern does not come into contact with the outside. The risk of damage caused by
また、隣り合う回路パターン同志はパターン溝部の壁面
によって隔てられていて、従来のハンダ付は作業におい
てしばしば生じていたハンダブリッジによる配線不良も
解消される。Furthermore, adjacent circuit patterns are separated by the wall surface of the pattern groove, eliminating wiring defects due to solder bridges that often occur during conventional soldering operations.
さらに、第二の発明のプリント回路基板においてはパタ
ーン溝部底面部の導体部のほかに基板材の表面部に導体
部が形成されていて、上述した効果のほかにも基板材表
面部の導体部を例えばアース回路に利用することによっ
て回路パターンを大ｙ〈簡略化でき配線作業を簡便にで
きるという利点があり、加えてノイズにも強くすること
ができる。Furthermore, in the printed circuit board of the second invention, in addition to the conductor part on the bottom surface of the pattern groove, a conductor part is formed on the surface part of the board material, and in addition to the above-mentioned effects, the conductor part on the surface part of the board material For example, by using it in a ground circuit, there is an advantage that the circuit pattern can be greatly simplified and the wiring work can be simplified, and in addition, it can be made resistant to noise.
また実施例中で述べた製造方法にあっては、上述した本
発明によるプリント回路基板を基板材の射出成形時に一
時に製造するようにしたもので、従来方法のように煩雑
な工程を経ることなく時間と費用を大幅に節減すること
ができる。また、この発明の製造方法はエツチング等に
みられる腐食性の液剤の使用もなく極めて好都合なもの
である。Furthermore, in the manufacturing method described in the examples, the printed circuit board according to the present invention described above is manufactured all at once during the injection molding of the board material, and there is no need to go through the complicated steps as in the conventional method. It can save you a lot of time and money. Further, the manufacturing method of the present invention is extremely convenient since it does not require the use of corrosive liquids found in etching and the like.
第１図は第一の発明の一実施例を示すプリント回路基板
の塵視図、第２図はその要部断面図、第３図は第二の発
明の一実施例を示すプリント回路基板の要部断面図、第
４図はこの発明方法を実施する射出成形機の要部断面図
、第５図はその可動側キャビティの一部拡大断面図、第
６図は成形状態を示した金型の一部拡大断面図である。
１０・・・プリント回路基板、１１・・・基板材、１２
・・・基板材表面部、１５・・・パターン溝部、１６・
・・パターン溝部底面部、２０・・・導体部、３０・・
・プリント回路基板、３１・・・基板材、３２・・・基
板材表面部、３３・・・導体部、３５・・・パターン溝
部、３６・・・パターン溝部底面部、３８・・・導体部
、４０・・・固定盤、４１・・・固定型、４３・・・固
定側キャビティ、５０・・・可動盤、５１・・・可動型
、５３・・・可動側キャビティ、５５・・・突条部、５
７・・・突条部先端部、６０・・・導体シート。Fig. 1 is a perspective view of a printed circuit board showing an embodiment of the first invention, Fig. 2 is a cross-sectional view of its main parts, and Fig. 3 is a diagram of a printed circuit board showing an embodiment of the second invention. 4 is a sectional view of the main parts of an injection molding machine that implements the method of the present invention, FIG. 5 is a partially enlarged sectional view of the movable side cavity, and FIG. 6 is a mold showing the molding state. FIG. 2 is a partially enlarged cross-sectional view. 10... Printed circuit board, 11... Board material, 12
. . . Substrate material surface portion, 15 . . . Pattern groove portion, 16.
...Pattern groove bottom part, 20...Conductor part, 30...
- Printed circuit board, 31... Board material, 32... Board material surface part, 33... Conductor part, 35... Pattern groove part, 36... Pattern groove bottom part, 38... Conductor part , 40... Fixed plate, 41... Fixed type, 43... Fixed side cavity, 50... Movable plate, 51... Movable type, 53... Movable side cavity, 55... Projection Section, 5
7...Tip of protruding portion, 60...Conductor sheet.
Claims (1)
パターン溝部が形成され、前記パターン溝部の底面部に
導体部が形成されていることを特徴とするプリント回路
基板。 ２、絶縁体よりなる基板材に回路パターン形状を有する
パターン溝部が形成され、前記基板材の表面部ならびに
前記パターン溝部の底面部に導体部が形成されているこ
とを特徴とするプリント回路基板。Claims: 1. A printed circuit board, characterized in that a pattern groove having a circuit pattern shape is formed in a substrate material made of an insulator, and a conductor is formed at the bottom of the pattern groove. 2. A printed circuit board, characterized in that a pattern groove portion having a circuit pattern shape is formed in a substrate material made of an insulator, and a conductor portion is formed on a surface portion of the substrate material and a bottom surface portion of the pattern groove portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7564787A JPS63241984A (en) | 1987-03-27 | 1987-03-27 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7564787A JPS63241984A (en) | 1987-03-27 | 1987-03-27 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63241984A true JPS63241984A (en) | 1988-10-07 |
| JPH054837B2 JPH054837B2 (en) | 1993-01-20 |
Family
ID=13582258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7564787A Granted JPS63241984A (en) | 1987-03-27 | 1987-03-27 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63241984A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007096283A (en) * | 2005-08-29 | 2007-04-12 | Fujifilm Corp | Wiring substrate and method for manufacturing the same, and discharge delivery head |
| US8109612B2 (en) | 2005-08-29 | 2012-02-07 | Fujifilm Corporation | Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head |
-
1987
- 1987-03-27 JP JP7564787A patent/JPS63241984A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007096283A (en) * | 2005-08-29 | 2007-04-12 | Fujifilm Corp | Wiring substrate and method for manufacturing the same, and discharge delivery head |
| US8109612B2 (en) | 2005-08-29 | 2012-02-07 | Fujifilm Corporation | Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH054837B2 (en) | 1993-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4944908A (en) | Method for forming a molded plastic article | |
| JP2002368390A (en) | Hole filling apparatus for printed wiring board and method therefor, and method for manufacturing printed wiring board | |
| US5291179A (en) | Printed circuit board | |
| JPS63241984A (en) | Printed circuit board | |
| JPS6146049B2 (en) | ||
| JP3304065B2 (en) | Electronic substrate manufacturing method | |
| JPS63164294A (en) | Injection molding of printed circuit board | |
| JPH06204655A (en) | Printed circuit board and its manufacture | |
| JP3294312B2 (en) | Manufacturing method of jumper chip | |
| JPS6212101A (en) | Terminal hoop for resin sealed electronic component | |
| JPH04221879A (en) | Printed circuit board having jumper part and manufacture thereof | |
| JP3355482B2 (en) | Method of connecting metal plate to conductive part of member using mold resin | |
| JP2514858Y2 (en) | Resin burr removal device | |
| JP2596797B2 (en) | Method of forming cavity in printed wiring board | |
| JPH05166431A (en) | Manufacture for switch | |
| US5904975A (en) | Printed circuit board | |
| JPS5851593A (en) | Method of temporarily fixing electronic parts | |
| JPH01243495A (en) | Manufacture of circuit board | |
| KR200243011Y1 (en) | Masking tape roller of printed circuit board | |
| KR920010781B1 (en) | Process for plating a printed circuit board | |
| JPH10335798A (en) | Manufacture of flexible printed wiring board for hdd with solder bump | |
| JP2000012995A (en) | Mounting apparatus for terminal components on printed circuit board | |
| JPS6390808A (en) | Electronic component | |
| JPH04254364A (en) | Manufacture of semiconductor device and manufacture of lead frame | |
| JPS5921086A (en) | Method of producing printed circuit boared |