JPS63239167A - Ceramic joined body - Google Patents
Ceramic joined bodyInfo
- Publication number
- JPS63239167A JPS63239167A JP7353787A JP7353787A JPS63239167A JP S63239167 A JPS63239167 A JP S63239167A JP 7353787 A JP7353787 A JP 7353787A JP 7353787 A JP7353787 A JP 7353787A JP S63239167 A JPS63239167 A JP S63239167A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- nickel
- titanium
- bonding
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 48
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 41
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 239000010936 titanium Substances 0.000 claims description 19
- 229910052719 titanium Inorganic materials 0.000 claims description 19
- 238000009792 diffusion process Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 4
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052575 non-oxide ceramic Inorganic materials 0.000 claims description 3
- 239000011225 non-oxide ceramic Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明はセラミックス部材とセラミックス部材、あるい
はセラミックス部材と金属部材とを接合一体化したセラ
ミックス接合体に関する。DETAILED DESCRIPTION OF THE INVENTION [Purpose of the Invention (Industrial Application Field) The present invention relates to a ceramic bonded body in which a ceramic member and a ceramic member, or a ceramic member and a metal member are joined and integrated.
（従来の技術）
従来からセラミックス部材の長所を生かし、かつ欠点を
補うために、セラミックス部材に金属部材を接合したり
、セラミックス部材とセラミックス部材を接合したりし
て複合部材として利用するということがよく行われてい
る。(Prior Art) Conventionally, in order to take advantage of the advantages of ceramic components and compensate for their disadvantages, it has been common practice to bond metal components to ceramic components, or to bond ceramic components and ceramic components to use them as composite components. Well done.
このようなセラミックス−セラミックスまたはセラミッ
クス−金属間の接合方法としては種々の方法が知られて
おり、例えば接合すべき両者の間にチタンやジルコニウ
ム等の活性金属を添加して濡れ性を改善したろう材を挿
入し加熱して接合する方法が知られている。また、ろう
材を使用しないで接合すべき面とおしを当接させ、高温
、加圧下で固相拡散により接合する方法も知られている
。Various methods are known for joining ceramics to ceramics or ceramics to metals. For example, a solder which improves wettability by adding an active metal such as titanium or zirconium between the two to be joined is known. A method of joining by inserting materials and heating is known. Also known is a method in which the surfaces to be bonded are brought into contact with each other without using a brazing filler metal, and the bonding is performed by solid-phase diffusion at high temperature and under pressure.
（発明が解決しようとする問題点）
しかしながらこのような従来の接合方法において、ろう
材を使用して接合する方法は、接合温度が６００℃〜９
００℃と低く作業性はよいものの、得られる接合体の接
合界面に形成される中間層が低融点化合物層となるため
、接合体の高温における接合強度が低下するという問題
があった。また、固相拡散による接合法は、高温におけ
る接合強度は大きいものの高圧を必要とし、さらに接合
温度が１４００〜１６００℃と高すぎるため作業性が悪
いという問題があった。(Problems to be Solved by the Invention) However, in such conventional bonding methods, the method of bonding using a brazing material requires a bonding temperature of 600°C to 90°C.
Although the workability is good at a low temperature of 00° C., there is a problem that the bonding strength of the bonded body at high temperatures is reduced because the intermediate layer formed at the bonding interface of the resulting bonded body is a low melting point compound layer. Furthermore, although the bonding method using solid phase diffusion has a high bonding strength at high temperatures, it requires high pressure, and furthermore, the bonding temperature is too high at 1,400 to 1,600° C., resulting in poor workability.
本発明はこのような問題点を解決するためになされたも
ので、高温における接合強度が大きく、しかも接合温度
が従来の固相拡散接合の場合より低く、作業性の良好な
セラミックス接合体を提供することを目的とする。The present invention was made to solve these problems, and provides a ceramic bonded body that has high bonding strength at high temperatures, has a bonding temperature lower than that of conventional solid phase diffusion bonding, and has good workability. The purpose is to
［発明の構成］
（問題点を解決するための手段）
本発明のセラミックス接合体は、セラミックス部材とセ
ラミックス部材、あるいはセラミックス部材と金属部材
とが、これらの接合すべき面の間に存在させたニッケル
およびチタンとこれらの拡散により形成された中間接合
層を介して接合されてなることを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The ceramic bonded body of the present invention has a structure in which a ceramic member and a ceramic member, or a ceramic member and a metal member exist between surfaces to be joined. It is characterized by being bonded through an intermediate bonding layer formed by diffusion of nickel and titanium.
すなわち本発明は、セラミックス部材とセラミックス部
材、あるいはセラミックス部材と金属部材との接合すべ
き面の間に、ニッケルおよびチタンを存在させ加熱する
ことにより、ニッケル−チタン間の拡散により接合界面
にニッケル−チタン化合物を含有する中間接合層を形成
させ、この中間接合層によりセラミックス部材とセラミ
ックス部材、あるいはセラミックス部材と金反部材とを
接合させたセラミックス接合体である。That is, in the present invention, nickel and titanium are present between the surfaces to be joined between a ceramic member and a ceramic member, or between a ceramic member and a metal member, and heated, so that nickel and titanium are formed at the joining interface by diffusion between nickel and titanium. This is a ceramic bonded body in which an intermediate bonding layer containing a titanium compound is formed, and a ceramic member and a ceramic member, or a ceramic member and a metal fabric member are bonded by this intermediate bonding layer.
本発明に使用するセラミックス部材としては酸化物系セ
ラミックス、非酸化物系セラミックスを問わないが、十
分な高温強度を有する窒化ケイ素や炭化ケイ素等の非酸
化物系セラミックス部材が好ましい。The ceramic members used in the present invention may be oxide ceramics or non-oxide ceramics, but non-oxide ceramic members such as silicon nitride and silicon carbide having sufficient high temperature strength are preferred.
また、被接合部材間に存在させるニッケルおよびチタン
としては、それぞれ箔、粉体等の形態で介在させたり、
ニッケル−チタン合金として介在させることも可能であ
る。このニッケルとチタンの存在比率は、重量比で３０
ニア０〜９９：１の範囲が好ましく、特に好ましくは６
０：４０〜９６二４の範囲である。３０ニア０の範囲よ
りニッケルの量が少なくても９９：１よりニッケルの量
が多くても、Ｎ１−Ｔ ｉ ７９とセラミックスとの反
応が不十分となる。In addition, the nickel and titanium present between the members to be joined may be interposed in the form of foil, powder, etc., respectively.
It is also possible to intervene as a nickel-titanium alloy. The abundance ratio of nickel and titanium is 30 by weight.
The range of near 0 to 99:1 is preferred, particularly preferably 6
The range is 0:40 to 9624. Even if the amount of nickel is less than the range of 30:0 or greater than the range of 99:1, the reaction between N1-T i 79 and the ceramic will be insufficient.
なお、金属部材としてニッケルやニッケル合金を使用す
る場合には、チタンのみを介在させることにより接合体
を形成することも可能である。Note that when using nickel or a nickel alloy as the metal member, it is also possible to form a joined body by interposing only titanium.
本発明のセラミックス接合体の製造方法としては、上述
したように被接合部材間にニッケルとチタンとを、例え
ば箔の状態で挿入し、真空中または不活性ガス雰囲気中
で加熱することにより行われる。この加熱温度は、９０
０℃以上であれば使用するチタンとニッケルの組成比の
融点以下の温度でも接合が可能であり、これにより中間
接合層には、高融点のニッケル−チタン化合物が形成さ
れ、さらに高温強度が良好となる。As described above, the method for manufacturing the ceramic bonded body of the present invention is carried out by inserting nickel and titanium, for example, in the form of foil, between the members to be bonded, and heating them in a vacuum or in an inert gas atmosphere. . This heating temperature is 90
Bonding is possible even at temperatures above 0°C, below the melting point of the composition ratio of titanium and nickel used, and as a result, a nickel-titanium compound with a high melting point is formed in the intermediate bonding layer, which also has good high-temperature strength. becomes.
（作 用）
本発明のセラミックス接合体において、使用するニッケ
ル−チタンの共晶温度以下または融点以下という比較的
低い加熱温度で、ニッケル−チタン間の拡散により接合
が可能であり、さらに中間接合層に高融点のニッケル−
チタン化合物が形成され、高温における接合体の強度が
大きくなる。(Function) In the ceramic bonded body of the present invention, bonding is possible by diffusion between nickel and titanium at a relatively low heating temperature below the eutectic temperature or below the melting point of the nickel and titanium used, and furthermore, the bonding can be performed by diffusion between nickel and titanium. Nickel with a high melting point
A titanium compound is formed, increasing the strength of the bonded body at high temperatures.
（実施例） 次に本発明の実施例について説明する。(Example) Next, examples of the present invention will be described.
実施例１
まず、炭化ケイ素を主成分とするセラミックス部材、チ
タン箔、ニッケル箔をそれぞれアセトンを使用して超音
波洗浄した後、図面に示すように、外径１０ｎｎｘ ５
ｕの２個のセラミックス部材１の間にニッケル箔３を中
央にしてその両側面にチタン箔２をそれぞれ配置して積
層した。なお、ニッケルとチタンの存在比率は重量比で
約６６：３４となるようにした。Example 1 First, a ceramic member mainly composed of silicon carbide, a titanium foil, and a nickel foil were each ultrasonically cleaned using acetone, and then the outer diameter was 10 nn x 5 as shown in the drawing.
A nickel foil 3 was placed in the center between two ceramic members 1, and titanium foils 2 were placed on both sides of the nickel foil 3 and laminated therebetween. Note that the ratio of nickel to titanium was set to be about 66:34 by weight.
次いで、この積層物を接合面に約０．１２ＭＰａの荷重
をかけながら真空中において１１００℃で５分間加熱を
行ってセラミックス−セラミックス接合体を作製した。Next, this laminate was heated in vacuum at 1100° C. for 5 minutes while applying a load of about 0.12 MPa to the bonded surfaces to produce a ceramic-ceramic bonded body.
このようにして得たセラミックス−セラミックス接合体
の常温および８００°Ｃにおけるそれぞれのぜん断強度
を測定したところ、常温において５．４０ｋｑ／−と良
好な値を示し、また８００°Ｃにおいても４．５ｋｇ／
１７とほとんど強度低下を生じないことを確認した。When the shear strength of the thus obtained ceramic-ceramic bonded body was measured at room temperature and 800°C, it showed a good value of 5.40 kq/- at room temperature, and 4.40 kq/- at 800°C. 5kg/
17, it was confirmed that there was almost no decrease in strength.
また、本発明との比較のなめ、実施ＰＡ１と同一形状の
炭化ケイ素材を使用して、その接合面にＴｉ−Ｃｕ−八
ｇろう材を挿入して、真空中、８３０℃の条件で６分間
加熱して、セラミックス−セラミックス接合体を作製し
た。このセラミックス−セラミックス接合体を使用して
実施例１と同一条件でせん断強度を測定したところ、常
温では２０ｋａ／ｍｄと良好な値を示したものの、８０
０℃においてはほとんど強度は残らなかった。In addition, for comparison with the present invention, a silicon carbide material having the same shape as in Example PA1 was used, a Ti-Cu-8g brazing material was inserted into the joint surface, and the temperature was 60°C in a vacuum at 830°C. A ceramic-ceramic bonded body was produced by heating for a minute. When the shear strength of this ceramic-ceramic bonded body was measured under the same conditions as in Example 1, it showed a good value of 20 ka/md at room temperature, but 80 ka/md.
Almost no strength remained at 0°C.
実施例２〜９
第１表に示すように、実施例１におけるチタンとニッケ
ルの存在比率および加熱温度を変化させたものを他の条
件は実施例１と同一条件で、それぞれセラミックス−セ
ラミックス接合体を作製した０次いで、これらのセラミ
ックス−セラミックス接合体を使用して、それぞれ実施
例１と同一条件でせん断強度を測定した。その結果は第
１表に示す通りであった。Examples 2 to 9 As shown in Table 1, ceramic-ceramic joined bodies were prepared by changing the abundance ratio of titanium and nickel and the heating temperature in Example 1, but under the same conditions as Example 1. Then, using these ceramic-ceramic bonded bodies, the shear strength was measured under the same conditions as in Example 1. The results were as shown in Table 1.
（以下余白）
第１表
実施例１０〜１４
第２表に示すように、実施例１におけるチタンとニッケ
ルの存在比率および加熱温度を変化させたものをアルゴ
ンガス雰囲気中で加熱する以外は実施例１と同様にして
、それぞれセラミックス−セラミックス接合体を作製し
た０次いで、これらのセラミックス−セラミックス接合
体を使用して、それぞれ実施例１と同一条件でせん断強
度を測定した。その結果は第２表に示す通りであった。(Leaving space below) Table 1 Examples 10 to 14 As shown in Table 2, the examples are the same as in Example 1, except that the proportions of titanium and nickel and the heating temperature were changed and heated in an argon gas atmosphere. Ceramic-ceramic bonded bodies were produced in the same manner as in Example 1. Then, using these ceramic-ceramic bonded bodies, the shear strength was measured under the same conditions as in Example 1. The results were as shown in Table 2.
（以下余白）
第２表
［発明の効果］
以上説明したように本発明のセラミックス接合体によれ
ば、被接合部材間に存在させたニッケルとチタンの間の
拡散により接合後の中間接合層には、高融点のニッケル
−チタン化合物が形成されており、高温での接合強度が
高くなるとともに、接合温度も従来の固Ｍ１拡散接合の
場合に比べてはるかに低い温度で接合が可１ｍとなり、
作業性も良好となる。(Leaving space below) Table 2 [Effects of the Invention] As explained above, according to the ceramic bonded body of the present invention, the diffusion between the nickel and titanium present between the members to be bonded causes the intermediate bonding layer to A nickel-titanium compound with a high melting point is formed, which increases the bonding strength at high temperatures, and allows bonding to be performed for 1 m at a much lower bonding temperature than conventional solid M1 diffusion bonding.
Workability is also improved.
図面は本発明のセラミックス接合体の接合前の状態を示
す断面図である。
１・・・・・・・・・セラミックス部材２・・・・・・
・・・チタン箔The drawing is a sectional view showing the state of the ceramic bonded body of the present invention before bonding. 1... Ceramic member 2...
...Titanium foil
Claims (3)
セラミックス部材と金属部材とが、これらの接合すべき
面の間に存在させたニッケルおよびチタンとこれらの拡
散により形成された中間接合層を介して接合されてなる
ことを特徴とするセラミックス接合体。(1) A ceramic member and a ceramic member, or a ceramic member and a metal member are bonded via an intermediate bonding layer formed by nickel and titanium existing between the surfaces to be bonded and their diffusion. A ceramic bonded body characterized by:
されている特許請求の範囲第１項記載のセラミックス接
合体。(2) The ceramic bonded body according to claim 1, wherein a nickel-titanium compound is formed in the intermediate bonding layer.
である特許請求の範囲第１項または第２項記載のセラミ
ックス接合体。(3) The ceramic joined body according to claim 1 or 2, wherein the ceramic member is a non-oxide ceramic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353787A JPS63239167A (en) | 1987-03-27 | 1987-03-27 | Ceramic joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7353787A JPS63239167A (en) | 1987-03-27 | 1987-03-27 | Ceramic joined body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63239167A true JPS63239167A (en) | 1988-10-05 |
Family
ID=13521077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7353787A Pending JPS63239167A (en) | 1987-03-27 | 1987-03-27 | Ceramic joined body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63239167A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021504287A (en) * | 2017-11-29 | 2021-02-15 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Semiconductor processing equipment equipped with high temperature resistant nickel alloy joints and its manufacturing method |
-
1987
- 1987-03-27 JP JP7353787A patent/JPS63239167A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021504287A (en) * | 2017-11-29 | 2021-02-15 | コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド | Semiconductor processing equipment equipped with high temperature resistant nickel alloy joints and its manufacturing method |
| US11648620B2 (en) | 2017-11-29 | 2023-05-16 | Watlow Electric Manufacturing Company | Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same |
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