JPS63233090A - 銅回路低温焼成基板の製造方法 - Google Patents

銅回路低温焼成基板の製造方法

Info

Publication number
JPS63233090A
JPS63233090A JP6868187A JP6868187A JPS63233090A JP S63233090 A JPS63233090 A JP S63233090A JP 6868187 A JP6868187 A JP 6868187A JP 6868187 A JP6868187 A JP 6868187A JP S63233090 A JPS63233090 A JP S63233090A
Authority
JP
Japan
Prior art keywords
copper circuit
green sheet
temperature
peak temperature
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6868187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0333677B2 (enrdf_load_stackoverflow
Inventor
義章 谷口
俊雄 吉原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Precision Corp
Original Assignee
Nidec Copal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Copal Corp filed Critical Nidec Copal Corp
Priority to JP6868187A priority Critical patent/JPS63233090A/ja
Publication of JPS63233090A publication Critical patent/JPS63233090A/ja
Publication of JPH0333677B2 publication Critical patent/JPH0333677B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP6868187A 1987-03-23 1987-03-23 銅回路低温焼成基板の製造方法 Granted JPS63233090A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6868187A JPS63233090A (ja) 1987-03-23 1987-03-23 銅回路低温焼成基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6868187A JPS63233090A (ja) 1987-03-23 1987-03-23 銅回路低温焼成基板の製造方法

Publications (2)

Publication Number Publication Date
JPS63233090A true JPS63233090A (ja) 1988-09-28
JPH0333677B2 JPH0333677B2 (enrdf_load_stackoverflow) 1991-05-17

Family

ID=13380713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6868187A Granted JPS63233090A (ja) 1987-03-23 1987-03-23 銅回路低温焼成基板の製造方法

Country Status (1)

Country Link
JP (1) JPS63233090A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248098A (ja) * 1989-02-20 1990-10-03 L'air Liquide 電気接続部材の製造方法
US5261950A (en) * 1991-06-26 1993-11-16 Ngk Spark Plug Co., Ltd. Composition for metalizing ceramics

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5711881A (en) * 1980-06-20 1982-01-21 Tdk Electronics Co Ltd Formation of electroconductive film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5711881A (en) * 1980-06-20 1982-01-21 Tdk Electronics Co Ltd Formation of electroconductive film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02248098A (ja) * 1989-02-20 1990-10-03 L'air Liquide 電気接続部材の製造方法
US5261950A (en) * 1991-06-26 1993-11-16 Ngk Spark Plug Co., Ltd. Composition for metalizing ceramics

Also Published As

Publication number Publication date
JPH0333677B2 (enrdf_load_stackoverflow) 1991-05-17

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