JPS63232938A - 研磨方法 - Google Patents

研磨方法

Info

Publication number
JPS63232938A
JPS63232938A JP6480187A JP6480187A JPS63232938A JP S63232938 A JPS63232938 A JP S63232938A JP 6480187 A JP6480187 A JP 6480187A JP 6480187 A JP6480187 A JP 6480187A JP S63232938 A JPS63232938 A JP S63232938A
Authority
JP
Japan
Prior art keywords
workpiece
nose
polishing
tape
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6480187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0541387B2 (OSRAM
Inventor
Toyohiko Hiyoshi
日吉　豊彦
Mikio Iwata
岩田　三樹男
Kazuo Watanabe
和雄 渡辺
Shinkichi Okawa
大河　真吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP6480187A priority Critical patent/JPS63232938A/ja
Publication of JPS63232938A publication Critical patent/JPS63232938A/ja
Priority to US07/535,982 priority patent/US4993190A/en
Priority to US07/839,702 priority patent/US5157878A/en
Publication of JPH0541387B2 publication Critical patent/JPH0541387B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP6480187A 1987-03-19 1987-03-19 研磨方法 Granted JPS63232938A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6480187A JPS63232938A (ja) 1987-03-19 1987-03-19 研磨方法
US07/535,982 US4993190A (en) 1987-03-19 1990-06-08 Polishing apparatus
US07/839,702 US5157878A (en) 1987-03-19 1992-02-24 Polishing method with error correction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6480187A JPS63232938A (ja) 1987-03-19 1987-03-19 研磨方法

Publications (2)

Publication Number Publication Date
JPS63232938A true JPS63232938A (ja) 1988-09-28
JPH0541387B2 JPH0541387B2 (OSRAM) 1993-06-23

Family

ID=13268707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6480187A Granted JPS63232938A (ja) 1987-03-19 1987-03-19 研磨方法

Country Status (1)

Country Link
JP (1) JPS63232938A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04310369A (ja) * 1991-04-05 1992-11-02 Amada Washino Co Ltd 自動定寸研削装置
JP2004174665A (ja) * 2002-11-27 2004-06-24 Ricoh Co Ltd 曲面加工方法および曲面加工装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112848U (OSRAM) * 1980-12-26 1982-07-13
JPS57149947U (OSRAM) * 1981-03-16 1982-09-20
JPS60114457A (ja) * 1983-11-26 1985-06-20 Nippon Kogaku Kk <Nikon> 球面創成研削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112848U (OSRAM) * 1980-12-26 1982-07-13
JPS57149947U (OSRAM) * 1981-03-16 1982-09-20
JPS60114457A (ja) * 1983-11-26 1985-06-20 Nippon Kogaku Kk <Nikon> 球面創成研削装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04310369A (ja) * 1991-04-05 1992-11-02 Amada Washino Co Ltd 自動定寸研削装置
JP2004174665A (ja) * 2002-11-27 2004-06-24 Ricoh Co Ltd 曲面加工方法および曲面加工装置

Also Published As

Publication number Publication date
JPH0541387B2 (OSRAM) 1993-06-23

Similar Documents

Publication Publication Date Title
US5791969A (en) System and method of automatically polishing semiconductor wafers
US5643044A (en) Automatic chemical and mechanical polishing system for semiconductor wafers
US4993190A (en) Polishing apparatus
JP2004298985A (ja) レンズ球面研磨装置
US5157878A (en) Polishing method with error correction
JP2002028864A (ja) Ｃｎｃねじ研削盤
JPS63232938A (ja) 研磨方法
JP4283993B2 (ja) 無段階に調整される工作機械の駆動バイト・スピンドルにおけるバイトの固定装置
JPS63232964A (ja) 修正研摩装置
JPS63232941A (ja) 研摩装置
JPH0543453B2 (OSRAM)
JPS63232942A (ja) 研摩材供給装置
JPS63232940A (ja) 研摩装置
JPS63232939A (ja) 研摩装置
JPH01205972A (ja) 研摩装置
JPH0623409Y2 (ja) ダイス研磨装置
JPS5937194B2 (ja) 自動研削装置
JPS61156022A (ja) 自動眼鏡玉摺装置
JPH11300594A (ja) ワイヤソー装置のワイヤ走行装置
JP3074580B2 (ja) バリ取り研削装置
JP2654310B2 (ja) テーパ部とストレート部とを有する加工物のセンターレス研削装置、および、同センターレス研削方法
JPS63232968A (ja) 研削装置
JPH09254002A (ja) 研磨方法および研磨装置
JP2929011B1 (ja) Ｃｎｃ円筒研削盤に於ける砥石ドレッシング方法
KR100716405B1 (ko) 가공물 연마 장치