JPS63229835A - Probe device - Google Patents

Abstract

PURPOSE:To facilitate the operation of replenishment of ink, adjustment and the like of inking position, and to make it possible to arrange a plurality of inkers by a method wherein a marking part is arranged in front of a measuring part, and a position-adjusting part is arranged in the rear of the measuring part. CONSTITUTION:On a probe device 10, a marking part 12 on which a marking is performed on a defective IC chip by an inker is arranged in front of the measuring part 11 which performs a test measurement by contacting the probe 11b of a probe card 11a to the electrode pad of the IC chip formed on a semicon ductor wafer, and the position-adjusting part 13, which microscopically adjusts the position of the semiconductor wafer using a laser beam and the like, is arranged in the rear of the measuring part 11. Besides, the semiconductor wafer in a wafer housing part 15 is loaded on the measuring part 11 after a prealignment operation has been performed thereon by a loading-unloading part 14.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention is a probe device that performs electrical testing and measurement by bringing a probe into contact with an electrode of an IC chip formed on a semiconductor wafer. Regarding.

(Conventional technology) -Fi probe devices are mounted on the semiconductor wafer.

Electrical test measurements are performed by bringing the probe into contact with the electrodes of several IC chips formed one after another.

FIG. 2 shows the configuration of an example of such a conventional probe device, and the direction of arrow A in the figure indicates the forward direction of the probe device 1. As shown in FIG.

In front of the measurement section 2, which performs electrical test measurements by bringing the probes 2b of the probe card 2a into contact with the electrode pads of IC chips formed on a semiconductor wafer, there is a marking section that marks defective IC chips with an inker. Further ahead of the marking section 3, a position adjustment section 4 is disposed that finely adjusts the position of the semiconductor wafer using laser light or the like.

Further, a load/unload section 5 is arranged on the side of the measurement section 1, and a wafer storage section 6 is arranged further on the side of the load/unload section 5.

In addition, at the forefront of the probe device 1, an operating section 1a in which switches, indicator lamps, etc. are arranged is arranged.

In the conventional probe device having the above configuration, the semiconductor wafer accommodated in the wafer accommodating section 6 is transferred to the load/unload section 5.
After pre-alignment is performed by orientation flat detection etc., the data is loaded into the measurement unit 2.

Next, the semiconductor wafer loaded into the measurement section 2 is sent to the position adjustment section 4, where fine position adjustment is performed using a laser beam or the like.

After that, the semiconductor wafer is returned to the measurement section 2 again, where the probes 2b of the probe card 2a are brought into contact with the electrode pads of the IC chips formed in large numbers on the semiconductor wafer one after another to perform electrical test measurements. will be held.

At this time, if the IC chip is determined to be defective as a result of the test measurement, the semiconductor wafer is sent to the marking section 3, where marking is performed by inking with an inker.

In addition, at the time of trial@measurement, a test head of a tester for determining the quality of the IC chip is placed above the measurement section 2.

(Problems to be Solved by the Invention) In the conventional probe device described above, the marking section is arranged in a narrow space between the position adjustment section and the measurement section.

This is because the test head of the tester that determines the quality of the IC chip is placed above the measurement unit during test measurements.
The measuring section should be placed at a certain distance to the rear, and the distance from the frontmost part of the device to the center of the measuring section should be approximately 40 mm, for example, so that switches, indicator lamps, etc. placed at the very front of the device would not be covered by the test head. Also, during test measurements, in order to confirm the probe position of the probe card with a microscope, the distance between the measuring section and the center of the measuring section from the frontmost part of the device should be 500 rnn.
This is because it is not possible to arrange it so far back.

For this reason, the conventional probe device has disadvantages in that it is difficult to replenish ink for inking and to adjust the inking position, and in that it is difficult to arrange only one or two inkers.

The present invention has been made in response to such conventional circumstances, and allows operations such as replenishing ink for inking and adjusting the inking position to be performed more easily than conventional probe devices, and The present invention aims to provide a probe device in which a large number of inkers can be placed.

(Structure of the Invention (Means for Solving the Problems)) In other words, the present invention provides a position adjustment section for adjusting the position of a semiconductor wafer having IC chips formed on its surface, and a position adjustment section that adjusts the position of a semiconductor wafer to a predetermined position. a measuring unit that performs an electrical test measurement by bringing a probe into contact with an electrode pad of the IC chip on the semiconductor wafer; and marking a defective IC chip among the IC chips measured by the measuring unit. The probe apparatus is characterized in that the marking section is disposed in front of the measuring section, and the position adjusting section is disposed behind the measuring section.

(Function) In the probe device of the present invention, the marking section is arranged in front of the measurement section, and the position adjustment section is arranged behind the measurement section.

Therefore, the marking portion can be made wider, operations such as replenishment of ink for inking and adjustment of the inking position can be easily performed, and a large number of inkers can be arranged.

In addition, the measurement section is placed at the front, so that the switches, indicator lamps, etc. placed at the front of the device are not covered by the test head, and the measurement section is placed at the rear, allowing the position of the probe card's tip to be measured using a microscope. You will never be able to confirm it.

(Example) Hereinafter, an example of the probe device of the present invention will be described with reference to FIG.

In the probe device 10 of this embodiment, a probe card l is attached to an electrode pad of an IC chip formed on a semiconductor evaporator.
A marking section 12 for marking defective IC chips with an inker is arranged in front of the measuring section 11 that performs electrical test measurements by contacting the probe 11b of the probe 11b, and a marking section 12 for marking defective IC chips with an inker. A position adjustment section 13 is arranged that performs fine position adjustment of the semiconductor wafer using laser light or the like. Further, a loading/unloading section 14 is arranged on the side of the measuring section 11.
Further to the side of 4, a wafer accommodating section 15 is arranged. Note that the direction of arrow A in the figure indicates the forward direction of the probe device 210. Further, at the forefront of the glove device 10, an operation section 10a in which switches, indicator lamps, etc. are arranged.
is located.

In the probe device 10 of this embodiment having the above configuration, the semiconductor wafer accommodated in the wafer accommodating section 15 is pre-aligned by the loading/unloading section 14 by orientation flat detection, etc., and then transferred to the measuring section 11.
loaded into.

Next, the semiconductor wafer loaded into the measurement section 11 is sent to the position adjustment section 13, where V&bar position adjustment is performed using a laser beam or the like.

After that, the semiconductor wafer is returned to the measurement section 11 again,
Here, electrical test measurements are performed by bringing the probes 11b of the probe card 11a into contact with the electrodes of a large number of IC chips formed on the semiconductor wafer one after another.

At this time, if the IC chip is determined to be defective as a result of the test measurement, the semiconductor wafer is sent to the marking section 12, and marking is performed by inking with an inker in the marking section 12.

That is, in the probe device 10 of this embodiment, the marking section 12 is arranged in front of the measuring section 11, and the position adjusting section 13 is arranged behind the measuring section 11.

Therefore, operations such as replenishing ink for inking and adjusting the inking position can be easily performed from the front of the probe device 210. In addition, since the space of this marking section 12 can be widened, for example, 4 to 8
A large number of inkers such as tables can be arranged, for example, radially or in horizontal rows, and the inking time can be shortened.

Further, the distance B between the frontmost part of the probe device 10 and the center part of the measuring section 11 can be set to about 400111, for example, so that the measuring section 11 is arranged at the front and switches and display lamps are arranged at the frontmost part of the device. etc. are not covered by the test head, and the measurement unit 11 is not placed at the rear, making it impossible to confirm the probe position W 1 l b of the probe card 11a with a microscope.

[Effects of the Invention] As described above, in the probe device of the present invention, operations such as replenishing ink for inking and adjusting the inking position can be performed more easily than in the conventional probe device, and, Multiple inkers can be placed.

[Brief explanation of drawings]

FIG. 1 is a top view showing the structure of a probe device according to an embodiment of the present invention, and FIG. 2 is a top view showing the structure of a conventional probe device. DESCRIPTION OF SYMBOLS 10... Probe device, 11... Measurement part, 11a... Probe, 12... Marking part, 13... Position adjustment part .

Claims (1)

[Claims] (1) A position adjustment section that adjusts the position of a semiconductor wafer with an IC chip formed on its surface, and a probe placed on the electrode pad of the IC chip on the semiconductor wafer adjusted to a predetermined position by the position adjustment section. a measuring section that performs electrical test measurements by contacting the IC;
A probe device comprising a marking section that marks a defective IC chip among the chips, wherein the marking section is arranged in front of the measurement section and the position adjustment section is arranged behind the measurement section. .