JP3416668B2 - Probing card - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probing card. 2. Description of the Related Art As is well known, a large number of semiconductor devices are formed on a semiconductor wafer by using a precision photographic transfer technique or the like.
Thereafter, the semiconductor device is cut into each semiconductor device. In the process of manufacturing such a semiconductor device, conventionally, using a probing apparatus, a test measurement of the electrical characteristics of the semiconductor device is performed in a state of a semiconductor wafer, and only a product determined as a non-defective product as a result of the test measurement is packaged. In order to improve productivity, it is sent to a post-process such as printing. The above-mentioned probing apparatus is provided with a wafer holder for sucking and holding a semiconductor wafer by, for example, a vacuum chuck or the like. On this wafer holder, a plurality of probing needles corresponding to the electrode pads of the semiconductor device are provided. Probing card is fixed. Then, the wafer holding table is moved in the XYZ-θ direction by the driving mechanism, and a probing needle is brought into contact with the electrode of the semiconductor device of the semiconductor wafer held by the wafer holding table, and the tester is moved through the probing needle. To perform the test measurement. In recent years, a probing apparatus has been developed in which a temperature control mechanism is provided on a wafer holding table to heat a semiconductor wafer mounted thereon and test and measure a semiconductor device formed on the semiconductor wafer at a high temperature. I have. However, the mounted semiconductor wafer is heated by the temperature control mechanism provided on the wafer holder, and the test measurement of the semiconductor device formed on the semiconductor wafer at a high temperature is performed. In the probing apparatus for performing the above, during a test measurement, a probing card provided at a position close to and opposed to the wafer holder causes thermal expansion due to heat from the wafer holder. However, the probing card is usually fixed around its periphery by a card holding mechanism, so that when the thermal expansion occurs, the whole probing card is deformed so as to warp. Therefore, the height (position in the Z-axis direction) of the probing needle of the probing card changes, and in some cases, this change is several tens of microns. Although the probing card is set at a position close to and opposed to the wafer holder during test measurement, when test measurement of one semiconductor wafer is completed, the wafer holder loads and unloads the semiconductor wafer. The probing card is separated from the wafer holder while the test wafer is unloaded from the wafer holder and the next semiconductor wafer is loaded onto the wafer holder. Becomes For this reason, during the loading and unloading of the semiconductor wafer, the probing card does not receive heat from the wafer holder, and the temperature of the probing card decreases. For this reason, in the test measurement of one semiconductor wafer, the temperature of the probing card is low immediately after the start of the test measurement, and the temperature of the probing card gradually increases.
The height of the probing needle changes according to this temperature change. Therefore, the contact between the probing needle and the electrode becomes insufficient, so that accurate test measurement cannot be performed.On the other hand, the probing needle and the electrode come into strong contact with each other, and the electrode pad and the like may be damaged. Problems sometimes occurred. To avoid such problems, set the probing card and the wafer holder close for a while at the start of test measurement so that the probing needle and the electrode are always in contact when the probing card is at a high temperature. However, a method of starting test measurement after the temperature of the probing card has risen has been adopted, and there has been a problem that the working efficiency is reduced. The present invention has been made in view of such a conventional situation, and can keep the temperature of a probing card constant without lowering the working efficiency, and can always perform a test with a uniform contact pressure and a high accuracy. An object of the present invention is to provide a probing card capable of performing measurement. [0009] Means for Solving the Problems That is, the invention of claim 1, corresponding to the electrode provided on the measured substrate, in a probing card having a plurality of probing needle board are arranged in the interior A heater and a temperature sensor are provided.
The probing card controlled by the control mechanism of the unit
Temperature control unit for heating the substrate according to the temperature of the substrate to be measured.
Having an outer diameter smaller than the outer diameter of the substrate.
A circular hole formed in a plate shape and provided in the center at the center portion
A temperature control unit provided with a circular hole corresponding to
Fixed to the upper or lower surface of the substrate, and
The probing needle is configured to be visible . In the probing card of the present invention having the above-described structure, for example, a temperature control provided with a heater and a temperature sensor fixed to the probing card. The mechanism keeps the temperature of the probing card constant at all times. For this reason, it is possible to prevent the temperature of the probing card from changing when the wafer holding table, which is a heat source, approaches or separates from the probing card. Can be prevented from changing in the height direction (z direction). Therefore, the temperature of the probing card can be kept constant without lowering the working efficiency, and a highly accurate test measurement can be always performed with a uniform contact pressure. Further, by making the temperature control mechanism smaller than the outer shape of the board, the utility terminals can be arranged on the printed board. An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 3, in the present embodiment, a disc-shaped printed board 2 made of, for example, a glass epoxy resin or a polyimide resin having high heat resistance is used as a board for the probing card 1. A circular hole 3 is provided in the center of the printed circuit board 2. On the lower surface of the printed circuit board 2, a probing needle fixing ring 4 which is formed in an inverted shape so as to protrude downward from the peripheral edge of the circular hole 3 is provided. Probing needle 5
Is supported. That is, these probing needles 5 are arranged corresponding to the electrode pads of the semiconductor device formed on the semiconductor wafer, one end of which is electrically connected to the electrode pattern formed on the printed circuit board 2 and the other. The end is configured to project obliquely downward so as to be able to contact the electrode pad of the semiconductor device. An intermediate portion of the probing needle 5 is supported by the probing needle fixing ring 4. A temperature control unit 6 formed, for example, in a ring shape is fixed to the upper or lower surface of the printed circuit board 2. The temperature control unit 6 is made of a material, for example, aluminum or the like, and has a heating mechanism therein, for example, a ceramic heater 6a formed in a plate shape, and one or a plurality of temperatures for detecting the temperature of the printed circuit board 2. A detector 6b is provided. The temperature detector 6b is set in a state of being in contact with or in proximity to the printed circuit board 2 in order to accurately detect the temperature of the printed circuit board 2. On the upper surface of the temperature control unit 6, a power supply terminal 6c and a temperature sensor terminal 6d are provided, and through these terminals, as shown in FIG.
The ceramic heater 6a and the temperature detector 6b are electrically connected to a temperature control power supply mechanism 10 provided in the probing apparatus main body. The temperature control power supply mechanism 10 adjusts the power supplied to the ceramics heater 6a with reference to the temperature detection signal from the temperature detector 6b, and adjusts the temperature of the probing card 1 to a predetermined temperature, e.g. It is configured so that it can be set to 〜80 ° C. The ceramic heater 6a and the temperature detector 6b and the temperature control power supply mechanism 1
The electrical connection with 0 can also be made via a utility terminal 14 usually provided on the probing card 1. As shown in FIG. 1, the peripheral portion of the probing card 1 having the above-described structure is fixed by a card fixing mechanism 11 provided in the main body of the probing apparatus. Also,
At the lower part of the card fixing mechanism 11, the semiconductor wafer 12 is sucked and held by, for example, a vacuum chuck or the like, and the semiconductor wafer 12 is driven in the xyz direction to drive the semiconductor wafer 1.
A wafer holder 13 is provided for sequentially contacting the electrode pads of the semiconductor device formed on the substrate 2 with the probing needles 5. The wafer holder 13 includes a heating mechanism (not shown), and is configured to heat the semiconductor wafer 12 to a predetermined temperature, for example, 60 to 80 ° C. In the probing apparatus of this embodiment having the above-described configuration, the wafer holding table 1 is sequentially moved from the wafer cassette provided in the cassette accommodating section by an autoloader (not shown).
The semiconductor wafer 12 is loaded and unloaded onto the wafer 3, and the wafer holding table 13 is moved in the xyz direction by a drive mechanism (not shown), so that the electrode pads of the semiconductor devices on the semiconductor wafer 12 are moved to the probing needles 5. The semiconductor devices are sequentially brought into contact with each other, and an electrical test measurement of the semiconductor device is performed by a tester (not shown) via the probing needle 5. At this time, the semiconductor wafer 12 is heated to a predetermined temperature, for example, 60 to 80 ° C. by a heating mechanism provided on the wafer holding table 13, and the probing card 1 is heated to a predetermined temperature by the temperature control unit 6 and the temperature control power supply mechanism 10. A series of measurement operations are performed while heating to a temperature, for example, 60 to 80 ° C. Therefore, for example, the wafer holding table 13
From below the probing card 1
Is moved to a position for loading and unloading, and even if the wafer holding table 13 and the probing card 1 are separated from each other, the probing card 1 is maintained at a predetermined temperature in the same manner as during measurement. That is, the wafer holder 1 serving as a heat source
3 can be prevented from changing the temperature of the probing card 1 by approaching or separating from the probing card 1. For this reason, it is possible to prevent the position of the probing needle 5 in the height direction (z direction) from fluctuating due to bending of the printed circuit board 2 due to a temperature change, etc., and the probing needle 5 is always brought into contact with the electrode pad of the semiconductor device at a predetermined pressure. , So that accurate test measurement can be performed. In addition, for example, prior to the start of measurement, the wafer holding table 13 is brought into close proximity to the probing card 1, and there is no need to heat the probing card 1, and there is no reduction in work efficiency. In the above embodiment, the case where the temperature control unit 6 is fixed to the printed circuit board 2 of the probing card 1 has been described. However, the temperature control unit 6 is fixed to the probing apparatus main body, and the probing card 1 is connected to the probing apparatus. The temperature control unit 6 may be configured to be in contact with the printed circuit board 2 when fixed to the main body. Further, in the above-described embodiment, the probing card 1 in which the probing needles 5 are arranged at an angle has been described. However, in recent years, a probing card in which the probing needles are arranged almost vertically has been developed with high integration of semiconductor devices. However, the present invention can be applied to such a probing card in the same manner as in the above embodiment. Further, in the probing apparatus configured to automatically replace the probing card 1 according to the type of the semiconductor device to be measured, the card stocker storing the probing card 1 is set to a predetermined temperature at which the measurement is to be performed in advance. By heating, measurement at a high temperature can be started in a shorter time. As described above, according to the probing card of the present invention, the temperature of the probing card can be kept constant without lowering the work efficiency, and the accuracy can be always maintained at a uniform contact pressure. Since a good test measurement can be performed, a decrease in work efficiency does not occur. Further, by making the temperature control mechanism smaller than the outer shape of the board, the utility terminals can be arranged on the printed board.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a main configuration of a probing cart according to an embodiment of the present invention. FIG. 2 is a plan view of the probing card of FIG. FIG. 3 is a perspective view of the probing card of FIG. 1; [Explanation of Signs] 1 ... Probing card, 2 ... Printed circuit board, 3 ...
... circular hole, 4 ... probing needle fixing ring, 5 ... probing needle, 6 ... temperature control unit, 6a ... ceramic heater, 6b ... temperature detector, 6c ... power supply terminal, 6d ... temperature Sensor terminals, 10: Temperature control power supply mechanism, 11: Card fixing mechanism, 12: Semiconductor wafer, 13: Wafer holder.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-53294 (JP, A) JP-A-2-192749 (JP, A) JP-A-3-1558764 (JP, A) JP-A-Heisei 4- 359445 (JP, A) JP-A-1-28739 (JP, A) JP-A-64-86077 (JP, A) JP-A-61-36565 (JP, U) (58) Fields investigated (Int. ⁷ , DB name) G01R 1/06-1/073 G01R 31/26 H01L 21/66

Claims (1)

(57) [Claim 1] In a probing card in which a plurality of probing needles are arranged on a substrate corresponding to electrodes provided on a substrate to be measured , a heater and a temperature sensor are provided inside. External control machine
The probing card is controlled by the
Temperature control unit that heats according to the temperature of the substrate
To form a plate having an outer diameter smaller than the outer diameter of the substrate.
In the center, corresponding to the circular hole provided in the substrate
A temperature control unit provided with a circular hole is mounted on the upper surface of the substrate.
Or fix it to the lower surface and make the probing needle visible from both sides of the substrate
A probing card characterized by being constituted .