JPS6322677Y2 - - Google Patents
Info
- Publication number
- JPS6322677Y2 JPS6322677Y2 JP1983010663U JP1066383U JPS6322677Y2 JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2 JP 1983010663 U JP1983010663 U JP 1983010663U JP 1066383 U JP1066383 U JP 1066383U JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- external
- resin body
- insulator
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983010663U JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983010663U JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117160U JPS59117160U (ja) | 1984-08-07 |
| JPS6322677Y2 true JPS6322677Y2 (cg-RX-API-DMAC7.html) | 1988-06-22 |
Family
ID=30142101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983010663U Granted JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117160U (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023021938A1 (ja) * | 2021-08-18 | 2023-02-23 | ローム株式会社 | 半導体装置 |
| US12224218B2 (en) * | 2022-02-11 | 2025-02-11 | Wolfspeed, Inc. | Semiconductor packages with increased power handling |
| JPWO2024095788A1 (cg-RX-API-DMAC7.html) * | 2022-11-04 | 2024-05-10 |
-
1983
- 1983-01-28 JP JP1983010663U patent/JPS59117160U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59117160U (ja) | 1984-08-07 |