JPS6322622B2 - - Google Patents
Info
- Publication number
- JPS6322622B2 JPS6322622B2 JP57067378A JP6737882A JPS6322622B2 JP S6322622 B2 JPS6322622 B2 JP S6322622B2 JP 57067378 A JP57067378 A JP 57067378A JP 6737882 A JP6737882 A JP 6737882A JP S6322622 B2 JPS6322622 B2 JP S6322622B2
- Authority
- JP
- Japan
- Prior art keywords
- amorphous silica
- resin
- semiconductor
- cooling fin
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6737882A JPS58184745A (ja) | 1982-04-23 | 1982-04-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6737882A JPS58184745A (ja) | 1982-04-23 | 1982-04-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58184745A JPS58184745A (ja) | 1983-10-28 |
| JPS6322622B2 true JPS6322622B2 (enrdf_load_stackoverflow) | 1988-05-12 |
Family
ID=13343285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6737882A Granted JPS58184745A (ja) | 1982-04-23 | 1982-04-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184745A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057955A (ja) * | 1983-09-09 | 1985-04-03 | Internatl Rectifier Corp Japan Ltd | 半導体装置の製造方法 |
| CN103827248A (zh) * | 2011-12-27 | 2014-05-28 | 松下电器产业株式会社 | 导热性树脂组合物 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54181877U (enrdf_load_stackoverflow) * | 1978-06-13 | 1979-12-22 | ||
| JPS5621448U (enrdf_load_stackoverflow) * | 1979-07-25 | 1981-02-25 |
-
1982
- 1982-04-23 JP JP6737882A patent/JPS58184745A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58184745A (ja) | 1983-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104064559A (zh) | 半导体装置 | |
| JPS59130449A (ja) | 絶縁型半導体素子用リードフレーム | |
| JPS6322622B2 (enrdf_load_stackoverflow) | ||
| JP2828358B2 (ja) | 半導体放熱構造 | |
| JP5368492B2 (ja) | パワー半導体装置 | |
| JP2005281467A (ja) | 高熱伝導性樹脂、および部材、ならびにそれらを用いた電気機器および半導体装置 | |
| KR102765860B1 (ko) | 열전소자 | |
| US3152293A (en) | Sealed semiconductor device and mounting means therefor | |
| JP2828553B2 (ja) | 半導体装置 | |
| JPH0337308B2 (enrdf_load_stackoverflow) | ||
| JP2023530348A (ja) | 半導体冷却チップ及びその製造方法 | |
| KR102794628B1 (ko) | 열전소자 | |
| CN217955573U (zh) | 一种防潮防湿的ntc热敏电阻结构 | |
| JPS5832423A (ja) | 半導体装置 | |
| JP7625607B2 (ja) | 熱電素子 | |
| CN118486669B (zh) | 一种液态环氧灌封的高鲁棒性功率模块 | |
| JPH06342860A (ja) | 半導体装置及びその製造方法 | |
| US3462654A (en) | Electrically insulating-heat conductive mass for semiconductor wafers | |
| JP6854989B1 (ja) | パワー半導体装置 | |
| JPH0337310B2 (enrdf_load_stackoverflow) | ||
| KR102795368B1 (ko) | 열전소자 | |
| JPS63170944A (ja) | 半導体装置 | |
| JPH11284103A (ja) | 樹脂モールド半導体装置 | |
| JP2922719B2 (ja) | 半導体素子収納用パッケージ | |
| JP2831219B2 (ja) | 半導体装置 |