JPS63226047A - Conduction cooling structure for semiconductor element - Google Patents
Conduction cooling structure for semiconductor elementInfo
- Publication number
- JPS63226047A JPS63226047A JP62058722A JP5872287A JPS63226047A JP S63226047 A JPS63226047 A JP S63226047A JP 62058722 A JP62058722 A JP 62058722A JP 5872287 A JP5872287 A JP 5872287A JP S63226047 A JPS63226047 A JP S63226047A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat sink
- printed board
- printed plate
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000005452 bending Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔＆ 挙）
半導体素子の伝導冷却構造であって、プリント板と半導
体素子をフレキシブルプリント板等を用いて電気的に接
続するとともに両者の間にスプリングを挿入し、さらに
プリント板に所定の間隔を隔ててヒートシンクを設け、
該ヒートシンクに半導体素子を密着するように押圧する
ようにしたことにより、簡単な構造で良好な冷却を可能
とする。[Detailed description of the invention] [& enumeration] A conductive cooling structure for a semiconductor element, in which a printed board and a semiconductor element are electrically connected using a flexible printed board, etc., and a spring is inserted between the two, and Heat sinks are provided at predetermined intervals on the printed board,
By pressing the semiconductor element into close contact with the heat sink, good cooling can be achieved with a simple structure.
本発明は半導体素子の伝導冷却構造に関するものである
。The present invention relates to a conduction cooling structure for semiconductor devices.
従来大型コンピュータ等では、例えば１５ａａ角程度の
大きさのプリント板に発熱量の大きい（例えばｌ０Ｗ）
ＩＣ，ＬＳＩ等の半導体素子を１０個程度搭載したユニ
ットを用いるようになって来ているためその冷却が重要
な課題となっている。Conventionally, in large computers, etc., a printed board with a size of about 15 AA square has a large amount of heat (for example, 10 W).
As units equipped with about 10 semiconductor elements such as ICs and LSIs are being used, cooling them has become an important issue.
第２図は従来の大型コンピュータの半導体素子の伝導冷
却構造を示す図である。同図ａに示すものは、プリント
板１に実装されたＩＣ，ＬＳＩ等の半導体素子２の上面
よりヒートシンク３に設けられたピストン４をスプリン
グ５で押圧接触させ、素子２を冷却するようになってい
る。また同図すに示すものはヒートシンク３に伝熱板６
を有するベローズ７を設け、ヒートシンク３内に冷却媒
体を流し、その圧力とベローズ７の張力で伝熱板６を半
導体素子２に押圧し冷却するようになっている。そして
上記ａ、ｂ共、ユニットの保守上しばしばヒートシンク
３を半導体素子２から切放す必要があるため、ヒートシ
ンク３はプリント板１に対してボルト８等で着脱自在に
取付けられている。FIG. 2 is a diagram showing a conventional conduction cooling structure for semiconductor elements of a large-sized computer. In the device shown in FIG. 1A, a piston 4 provided on a heat sink 3 is brought into pressure contact with the upper surface of a semiconductor element 2 such as an IC or LSI mounted on a printed circuit board 1 by a spring 5 to cool the element 2. ing. In addition, the one shown in the same figure has a heat transfer plate 6 on the heat sink 3.
A cooling medium is flowed into the heat sink 3, and the heat exchanger plate 6 is pressed against the semiconductor element 2 by the pressure of the cooling medium and the tension of the bellows 7, thereby cooling the semiconductor element 2. In both a and b, since it is often necessary to separate the heat sink 3 from the semiconductor element 2 for maintenance of the unit, the heat sink 3 is detachably attached to the printed board 1 with bolts 8 or the like.
上記従来の半導体素子の伝導冷却構造において、第２図
ａに示すものは、構造が複雑であり、またヒートシンク
３とピストン４との間にあるすきまにより熱の伝導が阻
害されるという欠点があり、第２図すに示すものは熱伝
導は良いが構造が複雑であるという欠点がある。Among the conventional conduction cooling structures for semiconductor devices, the structure shown in FIG. , the one shown in Figure 2 has good thermal conductivity but has the disadvantage of a complicated structure.
本発明はこのような点にかんがみて創作されたもので、
構造が簡単で一冷却効率の良い半導体素子の伝導冷却構
造を提供することを目的としている。The present invention was created in view of these points.
It is an object of the present invention to provide a conductive cooling structure for a semiconductor element that has a simple structure and high cooling efficiency.
このため本発明においては第１図に例示するように、プ
リント板１０に実装した半導体素子１１を、該プリント
板１０に所定の間隔を隔てて着脱自在に設けられたヒー
トシンク１４により冷却する半導体素子の伝導冷却構造
において、上記プリント板１０と半導体素子１１をフレ
キシブルな導体１２を用いて電気的に接続するとともに
、該半導体素子１１とプリント板１０との間にスプリン
グ１３を挿入し、該スプリング１３により前記半導体素
子１１を前記ヒートシンク１４に押圧密着させるように
付勢したことを特徴としている。For this reason, in the present invention, as illustrated in FIG. 1, a semiconductor element 11 mounted on a printed board 10 is cooled by a heat sink 14 that is detachably provided on the printed board 10 at a predetermined interval. In the conduction cooling structure, the printed board 10 and the semiconductor element 11 are electrically connected using a flexible conductor 12, and a spring 13 is inserted between the semiconductor element 11 and the printed board 10. It is characterized in that the semiconductor element 11 is biased so as to be brought into close contact with the heat sink 14 by pressure.
半導体素子１１をフレキシブルな導体１２でプリント板
に接続し、スプリング１３によりヒートシンク１４に押
圧することにより、半導体素子１１をヒートシンク１４
に密着させることができ良好な伝導冷却が可能となる。By connecting the semiconductor element 11 to a printed board with a flexible conductor 12 and pressing it against the heat sink 14 with a spring 13, the semiconductor element 11 is connected to the heat sink 14.
This allows for good conduction cooling.
第１図は本発明の実施例を示す図である。 FIG. 1 is a diagram showing an embodiment of the present invention.
本実施例は同図に示すように、プリント板１０に搭載さ
れた半導体素子１１はそのプリント板１０との電気的接
続にフレキシブルプリント板等のフレキシブルな導体１
２を用いて接続されている。In this embodiment, as shown in the figure, a semiconductor element 11 mounted on a printed board 10 is electrically connected to the printed board 10 using a flexible conductor 1 such as a flexible printed board.
It is connected using 2.
また該半導体素子１１とプリント板１０との間にはスプ
リング１３が挿入されていて、プリント板１０に着脱自
在に取付けられているヒートシンク１４に半導体素子１
１を押圧できるようになっている。なお１５はプリント
板１０を遊動可能に挿通して半導体素子１１に取付けら
れた案内棒で該半導体素子１１の位置決めを確実にする
ために設けたもので、多小の位置ずれを許容する場合は
該案内棒１５はなくとも良い。Further, a spring 13 is inserted between the semiconductor element 11 and the printed board 10, and the semiconductor element 1 is attached to a heat sink 14 which is detachably attached to the printed board 10.
You can now press 1. Reference numeral 15 denotes a guide rod which is inserted through the printed circuit board 10 so as to be freely movable and is attached to the semiconductor element 11, and is provided to ensure the positioning of the semiconductor element 11.If a slight positional deviation is allowed, The guide rod 15 may be omitted.
このように構成された本実施例は、半導体素子１１がプ
リント板ＩＯにフレキシブルな導体１２で接続されてい
るためフレキシブルな導体１２の撓める範囲で動くこと
ができ、且つスプリング１３により矢印Ａ方向に付勢さ
れているためヒートシンク１４に押圧されて密着する。In this embodiment configured in this way, the semiconductor element 11 is connected to the printed board IO by the flexible conductor 12, so it can move within the bending range of the flexible conductor 12, and the spring 13 allows it to move in the direction of arrow A. Since it is biased in the direction, it is pressed against the heat sink 14 and comes into close contact with it.
従って半導体素子１１の冷却は効率良く行なわれること
になる。Therefore, the semiconductor element 11 is efficiently cooled.
以上述べてきたように、本発明によれば、極めて簡易な
構成により半導体素子の冷却を効率良く行なうことがで
き、実用的には極めて有用である。As described above, according to the present invention, a semiconductor element can be efficiently cooled with an extremely simple configuration, and is extremely useful in practice.
第１図は本発明の実施例を示す図、 第２図は従来の半導体素子の冷却構造を示す図である。 第１図において、 １０はプリント板、 １１は半導体素子、 １２はフレキシブルな導体、 １３はスプリング、 １４はヒートシンク、 １５は案内棒である。 本発明の実施例を示す図 １０・・・プリント板 １〕・・・半導体素子 １２・・°フレキシブルな導体 １３・・・スプリング １４・・・ヒートシンク １５・・・案内棒 （ａ） 従来の半導体素子の伝導冷却構造を示す図第２図 １・・・プリント板 ２・・・半導体素子 ３・・・ヒートシンク ４・・・ピストン ５・・・スプリング ６・・伝熱板 ７・ ・ベローズ ８・・・〆ルト FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing a conventional cooling structure for a semiconductor device. In Figure 1, 10 is a printed board, 11 is a semiconductor element; 12 is a flexible conductor; 13 is a spring, 14 is a heat sink, 15 is a guide rod. Diagram showing an embodiment of the present invention 10...Printed board 1]...Semiconductor element 12...°Flexible conductor 13...Spring 14...Heat sink 15... Guide rod (a) Figure 2 shows the conduction cooling structure of a conventional semiconductor device. 1...Printed board 2...Semiconductor element 3...Heat sink 4...Piston 5...Spring 6.Heat transfer plate 7. Bellows 8...〆ruto
Claims (1)
を、該プリント板（１０）に所定の間隔を隔てて着脱自
在に設けられたヒートシンク（１４）により冷却する半
導体素子の伝導冷却構造において、 上記プリント板（１０）と半導体素子（１１）をフレキ
シブルな導体（１２）を用いて電気的に接続するととも
に、該半導体素子（１１）とプリント板（１０）との間
にスプリング（１３）を挿入し、該スプリング（１３）
により前記半導体素子（１１）を前記ヒートシンク（１
４）に押圧密着させるように付勢したことを特徴とした
半導体素子の伝導冷却構造。[Claims] 1. Semiconductor element (11) mounted on printed board (10)
In a conductive cooling structure for a semiconductor element, in which the printed board (10) and the semiconductor element (11) are cooled by a heat sink (14) removably provided at a predetermined interval on the printed board (10), the printed board (10) and the semiconductor element (11) are A spring (13) is inserted between the semiconductor element (11) and the printed board (10), and the spring (13) is electrically connected using a conductor (12).
The semiconductor element (11) is connected to the heat sink (1) by
4) A conductive cooling structure for a semiconductor element, characterized in that it is biased so as to be brought into close contact with the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62058722A JPS63226047A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62058722A JPS63226047A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63226047A true JPS63226047A (en) | 1988-09-20 |
Family
ID=13092392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62058722A Pending JPS63226047A (en) | 1987-03-16 | 1987-03-16 | Conduction cooling structure for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63226047A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108702853A (en) * | 2015-12-31 | 2018-10-23 | 迪讯技术有限责任公司 | Self-adjusting heat sink system for set-top box assembly |
-
1987
- 1987-03-16 JP JP62058722A patent/JPS63226047A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108702853A (en) * | 2015-12-31 | 2018-10-23 | 迪讯技术有限责任公司 | Self-adjusting heat sink system for set-top box assembly |
| CN108702853B (en) * | 2015-12-31 | 2020-06-02 | 迪讯技术有限责任公司 | Self-adjusting heat sink system, electronic device and assembling method thereof |
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