JPH01175299A - Cooling structure of integrated circuit - Google Patents

Cooling structure of integrated circuit

Info

Publication number
JPH01175299A
JPH01175299A JP33595987A JP33595987A JPH01175299A JP H01175299 A JPH01175299 A JP H01175299A JP 33595987 A JP33595987 A JP 33595987A JP 33595987 A JP33595987 A JP 33595987A JP H01175299 A JPH01175299 A JP H01175299A
Authority
JP
Japan
Prior art keywords
cold plate
plate
integrated circuit
cooling medium
plate springs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33595987A
Other languages
Japanese (ja)
Inventor
Toshiaki Komatsu
小松　敏明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP33595987A priority Critical patent/JPH01175299A/en
Publication of JPH01175299A publication Critical patent/JPH01175299A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To realize a cooling system by a simple structure and replace a printed wiring board without interrupting temporarily the flow of the cooling medium, by disposing a pair of corrugated plate springs between printed wiring boards and inserting the passage of the cooling medium between the plate springs in such a way that is fulfils the intended function. CONSTITUTION:A pair of corrugated plate springs 4 which are supported by holding brackets 8 are disposed between integrated circuits 2 facing each other, with a small space therebetween at the upper part of the circuits. A cold plate 3 having a cooling medium therein is inserted between the plate springs 4. Heat produced in the integrated circuits 1 is transferred from the plate springs 4 which are pressed by the cold plate 3 to the cold plate 3 having the passage of the cooling medium, and then, the integrated circuits 1 are thus cooled. The printed wiring board 2 is replaced easily in such a way that the cold plate is drawn from the space between plate springs and accordingly the plate springs 4 does not press the integrated circuit 1, while leaving a hose 5 connected to the cold plate 3 as it is without interrupting the flow of cooling medium.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子機器等に実装されるプリント基板に搭載
された集積回路の冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an integrated circuit mounted on a printed circuit board mounted on an electronic device or the like.

〔従来の技術〕[Conventional technology]

従来、液体を媒冷とした冷却構造としては、第３図に示
す様にプリント基板２に搭載された集積回路１にはバネ
６によって熱伝導棒７が押圧され、集積回路で発生した
熱は熱電運棒７を経由し、コールドプレート３へ伝えら
れ、冷媒によって冷却されていた。Conventionally, as shown in FIG. 3, in a cooling structure using a liquid as a cooling medium, a heat conductive rod 7 is pressed by a spring 6 against an integrated circuit 1 mounted on a printed circuit board 2, and the heat generated in the integrated circuit is dissipated. The heat was transferred to the cold plate 3 via the heat transfer rod 7 and cooled by the refrigerant.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上述した従来の冷却構造は、プリント基板２の交換にお
いてコールドプレート３がプリント基板２等と相互に固
定されている為、コールドプレート３を冷やす冷媒等を
一時、断たなければならず、保守交換、あるいは操作性
、実装上に著しく欠点があった。In the conventional cooling structure described above, when replacing the printed circuit board 2, the cold plate 3 is fixed to the printed circuit board 2, etc., so the refrigerant etc. that cool the cold plate 3 must be temporarily cut off, and maintenance and replacement are required. , or there were significant shortcomings in operability and implementation.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の集積回路の冷却構造は、対向して実装された２
枚のプリント基板の間に重ねるように配置された一対の
波状の板バネと、この一対の板バネそれぞれの端部を保
持する保持金具と、冷媒流路が設けられ前記一対の板バ
ネの間に抜き出し可能なように挿入されて前記板バネを
前記２枚のプリント基板の対向する面に搭載された集積
回路に押し付けるコールドプレートと、前記冷媒流路に
連結されたホースとを含んで構成される。The integrated circuit cooling structure of the present invention has two
A pair of wavy leaf springs arranged in an overlapping manner between two printed circuit boards, a holding fitting that holds each end of the pair of leaf springs, and a coolant flow path provided between the pair of leaf springs. The cold plate includes a cold plate that is removably inserted into the cold plate and presses the leaf spring against an integrated circuit mounted on opposing surfaces of the two printed circuit boards, and a hose connected to the coolant flow path. Ru.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図および第２図はそれぞれ本発明の一実施例の斜視
図および断面図である。プリント基板２の両面に搭載さ
れた集積回路１が互いに対向し合うように２枚のプリン
ト基板２を実装し、対向する集積回路２の間に上部には
互いに微小間隔を保ち、保持金具８で支持した一対の波
状の板バネ４を配置している。板バネ４の間には内部に
冷媒流路を有するコールドプレート３を矢印Ａの方向に
挿入することにより、常時板バネ４が集積回路１を押圧
している。コールドプレート３内の冷媒流路には自在に
曲がるホース５を介して冷媒が流入され、また流出され
る。1 and 2 are a perspective view and a sectional view, respectively, of an embodiment of the present invention. Two printed circuit boards 2 are mounted so that the integrated circuits 1 mounted on both sides of the printed circuit board 2 face each other, and a small distance is maintained between the opposing integrated circuits 2 at the top with a holding metal fitting 8. A pair of supported wavy leaf springs 4 are arranged. A cold plate 3 having a refrigerant flow path inside is inserted between the leaf springs 4 in the direction of arrow A, so that the leaf springs 4 press the integrated circuit 1 at all times. A refrigerant flows into and out of the refrigerant flow path in the cold plate 3 via a freely bendable hose 5.

集積回路１が発生した熱は、コールドプレート３で押圧
された板バネ４から冷媒流路を有するコールドプレート
３へと伝えられ、集積回路１が冷却される。The heat generated by the integrated circuit 1 is transferred from the plate spring 4 pressed by the cold plate 3 to the cold plate 3 having a coolant flow path, and the integrated circuit 1 is cooled.

又、プリント基板２の交換はホース５をコールドブーレ
ート３に連結したまま冷媒を断つことなくコールドプレ
ート３を板バネ４間から引抜くことにより、板バネ４の
集積回路１への押圧をなくし、簡単に行うことが出来る
。Furthermore, when replacing the printed circuit board 2, the cold plate 3 is pulled out from between the leaf springs 4 while the hose 5 is connected to the cold boot plate 3 without cutting off the refrigerant, thereby eliminating the pressure of the leaf spring 4 on the integrated circuit 1. , can be easily done.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、集積回路の冷却を板バネ
とコールドプレートのみの簡単な構造で実現し、冷媒を
一時断つことなく、簡単に短時間でプリント基板の交換
を行うことが出来る効果がある。As explained above, the present invention realizes cooling of integrated circuits with a simple structure consisting only of leaf springs and cold plates, and has the advantage that printed circuit boards can be easily replaced in a short time without temporarily cutting off the coolant. There is.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図はそれぞれ本発明の一実施例の斜視
図および断面図、第３図は従来の集積回路の冷却構造の
断面図である。 １・・・集積回路、２・・・プリン１へ基板、３・・・
コールドプレート、４・・・板バネ、５・・・ホース、
６・・・バネ、７・・・熱伝導棒、８・・・保持金具。1 and 2 are a perspective view and a sectional view of an embodiment of the present invention, respectively, and FIG. 3 is a sectional view of a conventional cooling structure for an integrated circuit. 1...Integrated circuit, 2...Substrate to printer 1, 3...
Cold plate, 4... leaf spring, 5... hose,
6... Spring, 7... Heat conduction rod, 8... Holding metal fittings.

Claims (1)

【特許請求の範囲】[Claims] 対向して実装された２枚のプリント基板の間に重ねるよ
うに配置された一対の波状の板バネと、この一対の板バ
ネそれぞれの端部を保持する保持金具と、冷媒流路が設
けられ前記一対の板バネの間に抜き出し可能なように挿
入されて前記板バネを前記２枚のプリント基板の対向す
る面に搭載された集積回路に押し付けるコールドプレー
トと、前記冷媒流路に連結されたホースとを含むことを
特徴とする集積回路の冷却構造。A pair of wavy leaf springs are arranged in an overlapping manner between two printed circuit boards that are mounted facing each other, holding fittings that hold the ends of each of the pair of leaf springs, and a coolant flow path are provided. a cold plate that is removably inserted between the pair of leaf springs and presses the leaf spring against an integrated circuit mounted on opposing surfaces of the two printed circuit boards; and a cold plate that is connected to the coolant flow path. A cooling structure for an integrated circuit, comprising: a hose.
JP33595987A 1987-12-28 1987-12-28 Cooling structure of integrated circuit Pending JPH01175299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33595987A JPH01175299A (en) 1987-12-28 1987-12-28 Cooling structure of integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33595987A JPH01175299A (en) 1987-12-28 1987-12-28 Cooling structure of integrated circuit

Publications (1)

Publication Number Publication Date
JPH01175299A true JPH01175299A (en) 1989-07-11

Family

ID=18294243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33595987A Pending JPH01175299A (en) 1987-12-28 1987-12-28 Cooling structure of integrated circuit

Country Status (1)

Country Link
JP (1) JPH01175299A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159371A (en) * 2005-01-04 2005-06-16 Advantest Corp Heat transfer element
JP2008086344A (en) * 2006-09-29 2008-04-17 Aloka Co Ltd Transmission/reception circuit device of ultrasonic diagnostic device and its assembly method
JP2011171663A (en) * 2010-02-22 2011-09-01 Mitsubishi Electric Corp Resin-sealed electronic control device, and method of fabricating the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005159371A (en) * 2005-01-04 2005-06-16 Advantest Corp Heat transfer element
JP2008086344A (en) * 2006-09-29 2008-04-17 Aloka Co Ltd Transmission/reception circuit device of ultrasonic diagnostic device and its assembly method
JP2011171663A (en) * 2010-02-22 2011-09-01 Mitsubishi Electric Corp Resin-sealed electronic control device, and method of fabricating the same

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