TWI236170B - Flexible heat conducting structure - Google Patents

Abstract

A flexible heat conducting structure is comprising: a cold point insulator; a hot point insulator; the first chip module and the second chip module set on the cold point insulator and the hot point insulator, in which the first and second chip modules include many PN modules constructed by P semiconductor and N semiconductor, and the first and second chip modules connect electricity by a flexible conducting device. The flexible conducting device moves the hot point insulator far from the cold point insulator, disposing the hot point insulator to the outside of the computer system, then exhausting the heat to the outside of the computer system, and avoiding the greenhouse effect.

Description

1236170 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a flexible heat transfer structure, especially an improvement on a conventional refrigerated wafer. Flexible heat transfer structure for heat transfer. [Previous technology] According to the general, traditional heat dissipation components used to provide electronic heating elements to maintain their normal operation / Phoenix degree are mostly radiators, fans or heat pipes, etc .; However, due to the recent development of semiconductor technology, there are The generation of a thermoelectric module that uses electricity to transfer heat. After using the cooling chip to energize, it can produce cold and hot end faces with large temperature differences, so it can be used in central processing such as computers. Controller (CPU) or other electronic heating elements for heat dissipation. As shown in the first and second figures, it is a schematic diagram of the structure of a conventional cooling wafer and a three-dimensional appearance thereof. Among them, the cooling wafer 13 has a cold end insulator 10a and heat The terminal insulator 11a is a semiconductor chip group 12a sandwiched between the cold and non-terminal insulators 10a and 11a. The semiconductor chip group 12a is formed by arraying most of the PN modules 13a, and each of the PN modules 13a includes P. Type semiconductor 13〇 & and [^ -type semiconductor i3u, p, n-type semiconductor 130a, 13la are connected by a conductor 132 & to form a circuit L t! : After the source is positive and negative, the cold-end insulator 10a will absorb the heat of the surrounding environment and reduce its surface temperature, and conduct the heat to the hot-end insulator Ua through the pN module la. Will release heat to the outside and increase its surface temperature; M, ^ is attached to the surface of the heat source by the cold end insulator 1Qa # of the cooling chip la

1236170 V. Description of the invention (2) ′ to help the heat source to dissipate heat. Since the above-mentioned chip 1 a must rely on power consumption to conduct conduction, the ㈣ insulator 11a will not only bear the cold-end insulator 1Ga ^: placed outside, but also will generate a high s due to the loss of electrical energy, but in the past: = The cold and hot end insulators 10a and 11a must be in contact with the semiconductor chip stack library: the upper and lower clamps are placed on the body, because itb 'when the cooled chip la is actually inside the computer' its hot end insulator The internal greenhouse effect produced by Ua, even if other heat sinks are reused, "Cheng Yu said," and the end insulator 11 a for heat dissipation is only to blow the heat away. The two around the fit can't effectively carry the heat. Π 2 1 1 under the second computer keeps hoarding and keeps the electronic heating element at a higher temperature, & the cooling chip la cannot perform its due heat dissipation; 5 and: 7 know ' The above-mentioned conventional cooling chips have inconveniences and defects in actual use, and need to be improved. Research and distribution: People who learn that the above-mentioned defects can be improved are specially researched on the essence of the above-mentioned defects. Propose a reasonable design and effective improvement The purpose is to provide a flexible and heat-conducting conductive element as a cold chip. The hot-end insulators can be connected in a flexible position between the hot-end insulators and the cold and hot-end insulators. Relative heat emission to the computer = pieces and = 'so that the hot-end insulator can quickly remove electricity outside the system. Page 6 1236170 V. Description of the invention (3) Another object of the present invention is the structure, which can be borrowed. From this conductive _ ^ can provide a flexible heat transfer junction inside the computer case other components = 1 has flexible bending characteristics, depending on the relative position between the edge body, between the = position, and flexible changes The cold and hot end insulation has a small space and a limited field. It can also be applied to laptops, etc. In order to achieve the above purpose, the thermal structure, including the cold end insulator :: Provides a kind of flexible, cold and hot end帛 7 on the insulator, and the two chipsets that are respectively placed on the-and the second chipset are included and the second chipset, and the PN module of the first constitution, in which, the-to-semiconductor and N-type semiconductor The conductive element is used as the electrical string i; between the two f groups To move the insulation with a flexible hot end to the cold end :::: This conductive element arranges the end insulator outside the computer system :: 22: $ Good Department will heat another purpose. The above main purpose and [implementation] For the review committee of the industry to further understand the features and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention for reference and explanation only, not for To the present invention: The limiter. Please refer to the third, fourth and fifth drawings, which are respectively a three-dimensional exploded view, a three-dimensional combination view and another three-dimensional combination view of the present invention. The present invention provides a flexible Qu's heat transfer structure includes a cold end ^ edge body 1, a hot end insulator 2, a first chip group 3 and a second chip group 4;

1236170 V. Description of the invention (4) Among them: the cold and hot end insulators 1, 2 are flat, made of materials with good insulation and thermal conductivity, such as ceramics; and the first and second chipset 3, 4 are respectively placed on the cold and hot end insulators 丨 and 2; at the same time, the first and second chip sets 3 and 4 include arrays arranged in an array manner = pN modules 3 0 and 40, and each The PN modules 30 and 40 further include p-type semiconductors 300 and 400 and N-type semiconductors 301 and 401, and a conductive body 3 is provided between each of the p- and N-type semiconductors 30, 400, 301, and 401. 2, 402 are connected to form a complete circuit, and the conductor 30 2, 40 2 can be made of copper, aluminum or other metal conductors, made of satin. The present invention is mainly based on the fact that a flexible conductive element 5 is electrically connected in series between the first and second chip sets 3 ′ 4; the conductive element 5 may be a flexible row or a beam line, It has flexible bending characteristics, and can ensure the good current flow during the permitted bending process. The conductive element 5 has two plug ends 50, 51 for external insertion for electrical conduction. The PN modules 30 and 40 of the first and second chip sets 3 and 4 are respectively electrically integrated with a printed circuit board (PCB) 31 and 41, and the two printed circuit boards 31 and 41 are each soldered. A thin film circuit 3 10, 410 for the two plug ends 50, 51 of the conductive element 5 to be connected to the two thin film circuits 3 1 0, 4 1 0 respectively, so that the conductive element 5 is electrically connected in series. It is connected between the first and second chip sets 3 and 4 in this way. Therefore, the flexible heat transfer structure of the present invention can be obtained by the above-mentioned structure and composition. As shown in Figures 6 and 7, when the present invention is applied to a computer

Page 8 1236170 V. Description of the invention (5) When the central processing unit (CPU) 6 is installed, the back of the cold-end insulator 1 is closely adhered to the surface of the central processing unit 6, and the conductive element 5 and its < Flexural bending characteristics, the hot end insulator 2 is moved to the case 60 of the computer, so that the top surface of the hot end insulator 2 is attached to the wall surface of the case 60, so that the hot end insulator 2 can be kept away from the center The processor 6 and the cold-end insulator 丨, and at the same time, the heat generated by the hot-end insulator 2 and the heat transmitted by the cold-end insulator 1 can be dissipated outside the computer system through the face of the chassis 6 to avoid The heat accumulates in the computer case 60 and may cause a greenhouse effect inside it. As shown in Figure 28 and Figure 9, the top surface of the hot-end insulator 2 can also be attached to the back side of the case 60. Since many exhaust holes are provided on the back side of the general computer case 60, it can also cooperate with heat-dissipating elements such as a cooling fan, so it can help the hot-end insulator 2 to quickly remove heat, so as to reduce the case 6 Heat accumulation; of course, since the conductive element 5 has Flexure = curve characteristics, so it can also flexibly change the relative position between the cold and hot end insulators 1 and 2 depending on the configuration of other components inside the computer case 60. At the same time, it can also be applied to notebook computers As mentioned on the wire in places where the configuration space is narrow and limited, the present invention can indeed achieve the intended use, and solve the lack of provinces. Because of its novelty and progress, it fully meets the requirements of the invention: * In accordance with the Patent Law, please check and grant the patent in this case in order to protect the rights of the inventor. ’, But the above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention.

1236170 V. Description of Invention (6) The equivalent technology, means and other changes made in the content are all included in the scope of the present invention and are shared with Chen Ming.

11HH 1236170 Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic diagram of the structure of a conventional cooling wafer. The second figure is a three-dimensional appearance view of a conventional cooling wafer. The third picture is a three-dimensional exploded view of this creation. The fourth picture is a three-dimensional combination diagram of this creation. The fifth picture is another schematic diagram of the three-dimensional combination of this creation. The sixth figure is the structure diagram of this creation. The seventh diagram is a partial cross-sectional view of the state of use of this creation. The eighth figure is another structural diagram of this creation. The ninth picture is a partial cross-sectional diagram of another use state of this creation. [Element Representative Symbol] < Knowledge > Refrigerated wafer 1 a Cold end insulator 10a Hot end insulator 11a Semiconductor chip set 12a PN module 13a P-type semiconductor 130a N-type semiconductor 131a Conductor 132a < Invention > Cold End insulator 1 hot end insulator 2

1236170 Schematic illustration

Page 12 First chipset 3 PN module 30 P-type semiconductor 300 N-type semiconductor 301 Conductor 302 Printed circuit board 31 Thin-film circuit 310 Second chipset 4 PN module 40 P-type semiconductor 400 N-type semiconductor 401 Conductor 402 Printed circuit board 41 Thin-film circuit 410 Conductive element 5 Plug-in terminal 50 Plug-in terminal 51 Central processing unit 6 Chassis 60

Claims (1)

1236170 Scope of patent application 1 Insulator 6. Flexible heat transfer structure, including cold-end insulator, hot-end group and second S f ^ Do not bear the first chip P-type semiconductor on the cold-hot end insulator "R" means "blood / two", and the first and second chips are many and both contain multiple arrays with 1 main thousand v body and N-type tomb "where, = PN module composed of dead conductors; String ^. A flexible conductive element is used between a chip set, and the flexible heat transfer structure described in item 1 of the patent application scope of the basin, wherein the cold and hot end insulators are flat. Furthermore, the flexible heat transfer structure described in item 1 of the scope of Shenzhong 誃 A Shenli ', with ^ i ... end insulation system made of ceramic material. , Where the _: Γ Γ T is the flexible heat transfer structure described in item 1. _ The PN modules of the positive film group are arranged in an array, and the flexible heat transfer structure described in item 1 of the Ganshin claim patent scope ^ ", NS semiconductors are connected by a conductive body. 6 The flexible heat transfer structure described in item 5 of the declared patent scope, wherein the conductive system is made of copper. 7 The flexible heat transfer structure described in item 5 of the patent scope, The conductive system is made of aluminum. 8. The flexible heat transfer structure described in item 1 of the scope of patent application, wherein the conductive element is a flexible cable. 9. The flexible heat transfer structure described in item 1 of the scope of the patent application, wherein the conductive element is a beamline. 1 0. Flexible heat transfer junction as described in item 1 of the scope of patent application 11 1 1 1 S 1 page 13 1236170 Page 14