JPS63221093A - Method of mounting ic card - Google Patents
Method of mounting ic cardInfo
- Publication number
- JPS63221093A JPS63221093A JP62054376A JP5437687A JPS63221093A JP S63221093 A JPS63221093 A JP S63221093A JP 62054376 A JP62054376 A JP 62054376A JP 5437687 A JP5437687 A JP 5437687A JP S63221093 A JPS63221093 A JP S63221093A
- Authority
- JP
- Japan
- Prior art keywords
- card
- wire bonding
- base film
- resin base
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 5
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）発明の分野
この発明は、ＩＣカードにＩＣチップを実装するための
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of the Invention The present invention relates to a method for mounting an IC chip on an IC card.
（ロ）発明の背景
ＩＣカードにＩＣチップを実装する場合、従来は第２図
に丞すように、ワイヤボンディング用電極２１と接点端
子２２とをポリイミドなどの樹脂ベースフィルム２３の
上下に形成し、ボンディングワイヤ２４を用いてＩＣチ
ップ２５をボンディングし、その後樹脂２６でワイヤボ
ンディング部分を封止し、樹脂ベースフィルム２３を挟
みこむ状態で表面カバーシート２７、コアシート２８、
裏面カバーシート２９を圧着している。(B) Background of the Invention When mounting an IC chip on an IC card, conventionally, as shown in FIG. 2, wire bonding electrodes 21 and contact terminals 22 are formed above and below a resin base film 23 made of polyimide or the like. , an IC chip 25 is bonded using a bonding wire 24, and then the wire bonding part is sealed with a resin 26, and the resin base film 23 is sandwiched between the surface cover sheet 27, the core sheet 28,
A back cover sheet 29 is crimped.
従って、ワイヤボンディング用電極２１と接点端子２２
とを樹脂ベースフィルム２３の上下面に形成するから、
この基板の形態は両面基板となり、ワイヤボンディング
の際、樹脂ベースフィルム２３が超音波エネルギを吸収
したり、熱伝導が悪くなって、ワイヤボンディング部分
の信頼性が損われ、また歩留りの悪化が発生する問題が
あった。Therefore, the wire bonding electrode 21 and the contact terminal 22
are formed on the upper and lower surfaces of the resin base film 23,
The form of this board is a double-sided board, and during wire bonding, the resin base film 23 absorbs ultrasonic energy and heat conduction becomes poor, which impairs the reliability of the wire bonding part and causes a deterioration in yield. There was a problem.
加えて、上記両面基板を表面カバーシート２７、コアシ
ート２８で挟みつけた際の樹脂ベースフィルム２３との
接着性の問題がある。つまり上記シート２７．２８が直
接樹脂ペースフィルム２３を挟まないので、ワイヤボン
ディング用電極２１や接点端子２２の導体箔とシート２
７．２８の樹脂との接着力が弱く、さらには両面基板の
採用がＩＣカードのコストアップを招く欠点があった。In addition, there is a problem of adhesion with the resin base film 23 when the double-sided substrate is sandwiched between the surface cover sheet 27 and the core sheet 28. In other words, since the sheets 27 and 28 do not directly sandwich the resin paste film 23, the conductor foil of the wire bonding electrode 21 and the contact terminal 22 and the sheet 2
7.28 resin was weak, and the adoption of a double-sided substrate also had the disadvantage of increasing the cost of the IC card.
（ハ）発明の目的
この発明は上記の問題に鑑み、ワイヤボンディング用電
極と接点端子との間に樹脂材を介在させないようにした
ＩＣカードの実装方法の提供を目的とする。(c) Purpose of the Invention In view of the above problems, the present invention aims to provide an IC card mounting method in which no resin material is interposed between the wire bonding electrode and the contact terminal.
（ニ）発明の構成
この発明は、樹脂ベースフィルム上に金属片を形成した
チップキャリアフィルム基板を用いて、この金属片の表
裏を接点端子とワイヤボンディング用電極に使用するＩ
Ｃカードの実装方法であることを特徴とする。(D) Structure of the Invention This invention uses a chip carrier film substrate in which metal pieces are formed on a resin base film, and uses the front and back sides of the metal pieces as contact terminals and wire bonding electrodes.
It is characterized by being a method for mounting a C card.
（ホ）発明の作用
この発明によれば、ワイヤボンディング用電極と接点端
子がチップキャリアフィルム基板の金属片の表裏に形成
されるから、ワイヤボンディング用電極と接点端子との
間には従来の樹脂材に代わって金属片が位置し、ワイヤ
ボンディング時の超音波エネルギの樹脂基板による吸収
、熱伝導の悪化が避けられる。(E) Effect of the Invention According to this invention, since the wire bonding electrode and the contact terminal are formed on the front and back surfaces of the metal piece of the chip carrier film substrate, the conventional resin is used between the wire bonding electrode and the contact terminal. A metal piece is placed in place of the wire bonding material, which prevents absorption of ultrasonic energy by the resin substrate and deterioration of heat conduction during wire bonding.
また、チップキャリアフィルム基板のフィルム部分を表
面カバーシート、コアシートに挟みこむことができるの
で、該挾みこみ部分の接着性が向上する。Furthermore, since the film portion of the chip carrier film substrate can be sandwiched between the surface cover sheet and the core sheet, the adhesiveness of the sandwiched portion is improved.
（へ）発明の効果
従って、この発明によれば、ワイヤボンディング部分の
不良が発生せず、信頼性が高まり、歩留りを向上できる
。(f) Effects of the Invention Therefore, according to the present invention, defects do not occur in the wire bonding portion, reliability is increased, and yield can be improved.
チップキャリアフィルム基板の材質と、表面カバーシー
ト、コアシートの材質を同一にすることで接着力を大き
くして、ＩＣカードの信頼性を一層確かなものにし、
また両面基板の使用をなくすることによってコスト低減
を図ることができる等の、多大なメリットを有する。By making the material of the chip carrier film substrate, the surface cover sheet, and the core sheet the same, the adhesive force is increased and the reliability of the IC card is further ensured, and the use of double-sided substrates is eliminated. It has many advantages, such as being able to reduce costs.
（ト）発明の実施例 以下、この発明の一実施例を図面を用いて説明する。(g) Examples of the invention An embodiment of the present invention will be described below with reference to the drawings.
第１図はＩＣカードの要部断面を示し、樹脂ベースフィ
ルム１上に金属片２を形成したチップキャリアフィルム
基板１１が用いられる。この金属片２は例えばＣｕにＡ
ｌｌメッキを施こしたものから成り、この金属片形成部
分では上記樹脂ベースフィルム１が一部取除かれて、該
金属片２の上面（表面）が接点端子３に使用され、下面
（ｌｉ面）がワイヤボンディング用電極４として使用さ
れる。FIG. 1 shows a cross section of a main part of an IC card, in which a chip carrier film substrate 11 having a metal piece 2 formed on a resin base film 1 is used. This metal piece 2 is, for example, Cu, A
The resin base film 1 is partially removed from the metal piece forming part, and the upper surface (surface) of the metal piece 2 is used for the contact terminal 3, and the lower surface (li surface) is used for the contact terminal 3. ) is used as the wire bonding electrode 4.
そして、チップキャリアフィルム基板１１に■Ｃデツプ
５を、ボンディングワイヤ６をワイヤボンディング用電
極４につなぐようにボンディングし、このワイヤボンデ
ィング部分を樹脂７で封止したのち、チップキャリアフ
ィルム基板１１の樹脂ベースフィルム１を表面カバーシ
ート８とコアシート９で挟みつけ、表面カバーシート８
、コアシート９および裏面カバーシート１０を圧着して
固定する。Then, the C depth 5 is bonded to the chip carrier film substrate 11 so that the bonding wire 6 is connected to the wire bonding electrode 4, and this wire bonding part is sealed with resin 7. The base film 1 is sandwiched between the surface cover sheet 8 and the core sheet 9, and the surface cover sheet 8
, the core sheet 9 and the back cover sheet 10 are pressed and fixed.
このような実装方法によれば、ボンディングワイヤ６を
ボンディングすべきワイヤボンディング用電極４と接点
端子３との間に金属片２のみが介在され、樹脂層がない
ので、ワイヤボンディング時に超音波エネルギが樹脂ベ
ースフィルム１に吸収されたり、熱伝導が悪化すること
がなく、ボンディングワイヤ６をワイヤボンディング用
電極４に正確なワイヤボンディングを施こすことができ
る結果、高い信頼性が得られ、ボンディング不良による
ＩＣカードの歩留りの低下をなくすることができる。According to such a mounting method, only the metal piece 2 is interposed between the wire bonding electrode 4 to which the bonding wire 6 is to be bonded and the contact terminal 3, and there is no resin layer, so that ultrasonic energy is not transmitted during wire bonding. The bonding wire 6 can be accurately wire bonded to the wire bonding electrode 4 without being absorbed by the resin base film 1 or deteriorating heat conduction, resulting in high reliability and eliminating the possibility of bonding defects. It is possible to eliminate a decrease in the yield of IC cards.
また表面カバーシート８とコアシート９はチップキャリ
アフィルム基板１１の樹脂ベースフィルム１部分を挟み
つけるので、これら三者の材質が同一化し、接着力が大
きくなってＩＣカードの信頼性が高くなる。Further, since the surface cover sheet 8 and the core sheet 9 sandwich the resin base film 1 portion of the chip carrier film substrate 11, the materials of these three are made the same, and the adhesive force is increased, thereby increasing the reliability of the IC card.
さらに、従来のような両面基板の採用が不要となる結果
、ＩＣカードの製作コストも低減できるに至る。Furthermore, since it is no longer necessary to use a double-sided board as in the past, the manufacturing cost of the IC card can be reduced.
図面はこの発明の一実施例を示し、
第１図はＩＣカードの要部断面図、
第２図は従来方法で得られたＩＣカードの要部断面図で
ある。
１・・・樹脂ベースフィルム
２・・・金属片 ３・・・接点端子４・・・
ワイヤボンディング用電極
５・・・ＩＣチップ
６・・・ボンディングワイヤ
１１・・・チップキャリアフィルム基板第１図The drawings show an embodiment of the present invention; FIG. 1 is a sectional view of the main part of an IC card, and FIG. 2 is a sectional view of the main part of an IC card obtained by a conventional method. 1... Resin base film 2... Metal piece 3... Contact terminal 4...
Wire bonding electrode 5...IC chip 6...Bonding wire 11...Chip carrier film substrate Fig. 1
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62054376A JPS63221093A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62054376A JPS63221093A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63221093A true JPS63221093A (en) | 1988-09-14 |
Family
ID=12968956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62054376A Pending JPS63221093A (en) | 1987-03-09 | 1987-03-09 | Method of mounting ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63221093A (en) |
-
1987
- 1987-03-09 JP JP62054376A patent/JPS63221093A/en active Pending
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