JPS63219599A - Formation of cermet layer on surface of member - Google Patents

Abstract

PURPOSE:To easily form a cermet layer of a uniform thickness contg. hard ceramics and having superior toughness on the surface of a metal member, by plating the surface with a metal contg. dispersed ceramic particles, further plating it with an active metal and carrying out sintering. CONSTITUTION:A composite plated layer of Ag, Ni, Au, Cu or other metal contg. uniformly dispersed fine particles of diamond, boron nitride, other nitride, carbide, oxide or other ceramics is formed on the surface of a member of steel, copper or other metal having a complex shape. The member having the composite plated layer is further plated with an active metal such as Ti, Zr, V, Nb, Ta or Si or an alloy of such metals and the resulting layer is melted and bonded to the composite plated layer by heating in a vacuum furnace. A sintered layer of hard cermet having a ceramic particles-metal composite structure is simply formed.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method of forming a sintered layer of cermet on the surface of a portion H made of metal or ceramic using a so-called composite plating method. It is.

<Prior Art> The following method is available for forming a sintered layer of Shun-Met on the surface of a member.

1. A method of joining a cermet sintered body to a component by brazing.

2. After forming a cermet or ceramic layer on the surface of the component by thermal spraying, fill the pores of the sprayed layer with N1-P.
, a method of densification even when impregnated with a low melting point molten metal such as Ni-B alloy.

With the former method, it is difficult to form a thin layer with a complex shape, and with the latter method, it is difficult to form a thin layer with a complex shape, and with the latter method, it is difficult to form a thin layer with a complex shape, and with the latter method, it is difficult to form a thin layer with a complex shape.
It is difficult to use materials such as pipe inner surface or die (J-bond), and the densified layer is brittle, making it difficult to adjust the surface roughness.

<Problems to be Solved by the Invention> The present invention has been made in view of the above problems, and it is possible to coat the surface of a member with a complex shape with a uniform thickness and excellent toughness, and also with die A? The present invention provides a new method for forming a sintered layer of cermets made of carbon dioxide, BN, M-carbon silica, alumina, zirconia, etc., and any ceramic.

<Means to solve the problem> The means of the present invention consists of the following configuration.

A composite plating layer in which ceramic particles are dispersed on a plated metal base is formed on the surface of the member, an active metal or an alloy of active metal is diffused and alloyed into the plated metal base, and the Hiramic particles and the base plated metal are sintered. It consists of tying V.

<Function> The active metal alloy has the property of bonding to all ceramics such as diamond, BN, nitrides, carbides, oxides, etc.

\However, in composite plating, the ceramic particles are embedded in the base plating metal, and even if they are heat-treated, in most cases the base plating metal and the ceramic particles do not bond. .

In order to avoid bonding between the plating base and ceramic particles, it is necessary to change the composition of the plating base to a component that will bond to the ceramic.

Therefore, in the present invention, the composition of the plated metal base is changed to an alloy composition of active metal, and the plated metal base is combined with ceramic particles.

In the present invention, the following method is used to change the plating metal base to an active metal alloy composition.

1. Composite plating of active metal or active metal compound powder [165] Simultaneously eutectoid on the plating base, U, and diffusion alloying on the plating base by heat treatment.

2. Before plating, a layer of active metal is deposited on the surface of the member, and after plating, a diffusion heat treatment is performed to form a diffusion alloy between the active metal layer and the plating base.

After plating, the active metal layer is coated, painted or overlaid on the surface of the plating film, and alloyed with the plating base by heat treatment.

The above method transforms the plating base into an active metal alloy.

Alloyed I! The temperature may be either a temperature at which a solid state or a melt is formed, but a temperature at which a melt is formed is most preferable.゛Base metals for composite plating include Ni, Cu, Aa, Au, and S.
n, In, etc. can be used alone or in the form of alloy plating, and there are no particular restrictions.

In addition, if the final alloy component after diffusion becomes a multi-component system,
The base metal of this composite plating layer is alloy-plated, or another metal layer is provided on or under the plating layer by plating or other means (for example, coating, painting, m-laying, etc.).

For example, when the final composition is A (J-Cu-Ti) and AU is used as the composite plating base, a Cu layer is further provided on or under the composite plating layer by plating or other means.

Adjustment of the component composition after diffusion is controlled by the thickness of the plating layer or coating layer, or the eutectoid m.

The active metal is a so-called conventional active metal, for example 1' i
, Zr, V, Nb, Ta, , S i , - etc. as jf
It can be used in the form of a lj form, an alloy thereof, or a compound (for example, a hydride) that converts into a metal during heat treatment.

<Example>・ Example 1 (Die-7 Mondo Cermet) 40 x 40 x 1
On one side of a 0jwI steel plate, a 100 μm composite plating was applied with a powder mixture of #80 diamond powder and 325 mesh under hydride (1) using A (J as the base metal for plating).

Next, 20 micrometers of Cu was further plated on this composite plating layer, and this was heat-treated at 850° C. for 10 minutes in a vacuum furnace.

The diamond powder was fused to the steel plate by an Ao-CI-Ti alloy.

Example 2 (Silicon nitride cermet 1-) 30X30X1
A 0 m copper root was composite plated with about 20 microns of silicon nitride powder with an average thickness of 10 microns using AU.

Next, a 5 micron -1 foil was placed on top of this plating layer, and this was heated in a vacuum oven to 850'C for 5 minutes.

The nitride powder was fused to the copper handle.

The alloy composition consisted of partially molten copper, AG, and TiB.

Example 3 (Alumina cermet) 10X50X1# (7) 42% Nr On a temporary 70m plate, 1'O micron less Ti powder was plated with Ni plating.

Next, #400 alumina abrasive particles were eutectoid plated with A (J) on this plating layer.

This was heat treated at 950°C for 7 minutes.

Alumina abrasive particles were fused to a 42 alloy plate.

Example 4 (Zirconia Sumet) A Kovar plate of 10 x 50 x 2 Ml11 was composite plated with about 10 microns of zirconia powder and Cu to a thickness of about 1 micron.

Next, a paste having a mixing ratio of (95Ao:5T i ) was applied thereon and heat treated at 870° C. for 5 minutes in a vacuum furnace.

The zirconia powder was fused to the Kovar plate by a molten He-Cu-Ti alloy.

<Effects of the Invention> 1) Any ceramic can be used to form a cermet matrix as long as it is bonded to an active metal.

2) Since plating is used, thin layers with complex shapes can be freely formed.

3) The bonding metal has toughness.

4) It is affordable.

Claims (1)

[Claims] A composite plating layer in which ceramic particles are dispersed in a plated metal base is formed on the surface of the member, an active metal or an alloy of active metal is diffused and alloyed into the plated metal base, and the ceramic particles and the base plated metal are sintered. A method for forming a cermet layer on the surface of a member, the method comprising: