JPS6321846A - Fremoving method for semiconductor element - Google Patents

Abstract

PURPOSE:To reduce an adhesive area of a semiconductor element with an adhesive tape thereby to easily remove a semiconductor element on an adhesive tape without irregularity by executing a secondary tape extending step for thermally extending the tape next to a primary tape extending step. CONSTITUTION:A heating stand 11 is fixedly mounted in a certain height on a base 12 in a heater unit 11a. An elevational slider 13 is pushed down, for example, by a presser 15 moved down (up) against a lifting force of a spring 14a by means of screw couples to move down to extend an adhesive tape 102 while pressing it to the upper surface of the stand 11. A tape ring 101 formed by extending the tape extended by 170% of an example having equal ductility to a conventional one by a primary tape extension is mounted, and the tape is extended by 200% at 50-60 deg.C as an example. Thus, the adhesive area of the tape of semiconductor elements 104, 104 adhered onto the tape can be reduced to uniformly and easily remove the element in a next step.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for taking out a semiconductor element, and is particularly applicable to a method for taking out a semiconductor element on an adhesive sheet when mounting a semiconductor element.

(Prior Art) Conventionally, when mounting semiconductor devices on a chip bed of a lead frame, a plurality of semiconductor devices attached to an adhesive tape at a distance from each other are sequentially suctioned with a vacuum nozzle and peeled off from the adhesive tape. The chips were then supported, transported onto a chip bed, and mounted. Note that the above-mentioned semiconductor element is produced by cutting a semiconductor wafer adhered to an adhesive tape along a scribe line, creating gaps between the semiconductor elements by expanding the adhesive tape that has been heated and expanded in advance, and cutting the adhesive surface (mainly the adhesive surface) of the semiconductor element. peel off the periphery of the surface).

- As an example, using TR7-5 (product name, published by Tsukasa Shokai Co., Ltd.) as an adhesive tape, it is necessary to use the vacuum nozzle (not shown) to ensure that the adhesive strength per semiconductor element is less than Igr.
This is necessary to separate the semiconductor element from the adhesive tape.

(Problems to be Solved by the Invention) In the above conventional method, there is uneven adhesion between the semiconductor element and the adhesive tape, and if some of the adhesive tape is peeled off with a vacuum nozzle and cannot be supported, the operating rate of the device will be reduced. This may cause a breakdown. Therefore, as shown in FIG. 2, a tape 102 is spread around a tape ring 101 and secured with a tape band l○3.
For 04.104...

By manipulating the adhesive tape from the underside with a nail 105, the adhesive area is reduced and peeling becomes easier.

Since the operation with these claws was based on the intuition of the operator, there was a lot of unevenness both in one process (within a lot) and in each process (between lots). This lowered the yield of extraction.

The present invention provides a method for extracting semiconductor elements that solves the above-mentioned conventional problems.

[Structure of the invention]

(Means for Solving the Problems) A method for taking out semiconductor elements according to the present invention heats and spreads an adhesive tape on a plurality of semiconductor elements adhesively supported on an adhesive tape to separate the semiconductor elements from each other. A second tape spreading step further heats and spreads the adhesive tape to reduce the adhesion area of the semiconductor element to the adhesive tape, and a vacuum nozzle sucks the semiconductor element on the adhesive tape. The method is characterized in that it includes a step of taking out a half-six-body element.

(Function) The present invention performs a second tape spreading process in which the adhesive tape is further heated and spread after the conventional first tape spreading process to increase the adhesive area between the semiconductor element and the adhesive tape. It is characterized by a reduction in the amount of metal, making it easier to take out the single conductor element in the next process.

(Example) An example of the present invention will be described below with reference to FIG. Fig. 1 shows a cross section of the tape spreading device used in the secondary tape spreading process. Ori,
A heater unit lla is installed inside, and a heater controller llb is attached to adjust the temperature of this heater unit. This heating table part 11 is surrounded by a vertical slide part 13, and a tape ring 101 is placed on the inner peripheral end of the vertical slide part, and an adhesive tape stretched on the tape ring is parallel to the heating table part and slightly spaced apart. It is elastically pushed up by the spring 14a of the guide 14 so that it is supported by the guide 14. In addition, this vertical slide portion 13
is located above this and is lowered (raised) against the upward force of the spring 14a by means of a pair of screws (not shown), for example.
The adhesive tape 102 is pushed down and lowered by the presser plate 15 , and the adhesive tape 102 is spread while being pressed against the upper surface of the heating stage section 11 . In addition, a tape slide ring 16 is disposed on the periphery of the upper surface of the heating stage portion 11 to assist in the sliding of the stretched tape.

A tape ring 101 made of adhesive tape that has been expanded by the first tape expansion to 170%, which is equivalent to conventional expansion, is attached using the tape spreading device taken up, and the adhesive tape is expanded to 170%, which is an example of 50% of the adhesive tape. A 200% spread is applied at ~60°C. Then, the adhesion area of the semiconductor elements 104, 104, .

The heating temperature, spreading rate, etc. of the present invention may be appropriately set depending on the adhesive performance of the adhesive tape, the size of the semiconductor element, etc.

〔Effect of the invention〕

According to this invention, in the process of taking out semiconductor elements on an adhesive tape, the taking out process can be carried out easily and evenly, so that the material yield and process operation rate are, for example, 90 to 90% compared to the conventional one.
This is a remarkable improvement from 5% to 96-98%.

[Brief explanation of drawings]

FIG. 1 is a front sectional view of a tape spreading device used in an embodiment of the present invention, and FIG. 2 is a front sectional view of the device used in a conventional method. 104・・・・・・・・・Semiconductor device 102・・・・・・Adhesive tape agent Patent attorney Inoue - Male 101: Tape rinse 1
I1 Ko 1'J Naruishi Hot pt4: Ga'Ibi14α Suji1ruγ1,! 52 T'lhi J lb: Slide relay 2'! 2; nu 1st figure (01: tape 1 102: mehe tape rD3: tape band 1OΦ: 4 scented body/element IQ!i: ga〈 Fig. 2

Claims (1)

[Claims] A first tape spreading step in which a plurality of semiconductor devices adhesively supported on the adhesive tape is heated and spread to separate the semiconductor devices from each other; A method for taking out a semiconductor device, including a second tape spreading step for reducing the adhesive area of the adhesive tape, and a semiconductor device taking out step for sucking and taking out the semiconductor device on the adhesive tape with a vacuum nozzle.