JPS632179B2 - - Google Patents
Info
- Publication number
- JPS632179B2 JPS632179B2 JP16455580A JP16455580A JPS632179B2 JP S632179 B2 JPS632179 B2 JP S632179B2 JP 16455580 A JP16455580 A JP 16455580A JP 16455580 A JP16455580 A JP 16455580A JP S632179 B2 JPS632179 B2 JP S632179B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- stereo
- power supply
- signal
- stereo demodulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04H—BROADCAST COMMUNICATION
- H04H20/00—Arrangements for broadcast or for distribution combined with broadcast
- H04H20/44—Arrangements characterised by circuits or components specially adapted for broadcast
- H04H20/46—Arrangements characterised by circuits or components specially adapted for broadcast specially adapted for broadcast systems covered by groups H04H20/53-H04H20/95
- H04H20/47—Arrangements characterised by circuits or components specially adapted for broadcast specially adapted for broadcast systems covered by groups H04H20/53-H04H20/95 specially adapted for stereophonic broadcast systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
- H04B1/1646—Circuits adapted for the reception of stereophonic signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04H—BROADCAST COMMUNICATION
- H04H40/00—Arrangements specially adapted for receiving broadcast information
- H04H40/18—Arrangements characterised by circuits or components specially adapted for receiving
- H04H40/27—Arrangements characterised by circuits or components specially adapted for receiving specially adapted for broadcast systems covered by groups H04H20/53 - H04H20/95
- H04H40/36—Arrangements characterised by circuits or components specially adapted for receiving specially adapted for broadcast systems covered by groups H04H20/53 - H04H20/95 specially adapted for stereophonic broadcast receiving
- H04H40/45—Arrangements characterised by circuits or components specially adapted for receiving specially adapted for broadcast systems covered by groups H04H20/53 - H04H20/95 specially adapted for stereophonic broadcast receiving for FM stereophonic broadcast systems receiving
- H04H40/63—Arrangements characterised by circuits or components specially adapted for receiving specially adapted for broadcast systems covered by groups H04H20/53 - H04H20/95 specially adapted for stereophonic broadcast receiving for FM stereophonic broadcast systems receiving for separation improvements or adjustments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Wire Bonding (AREA)
- Stereo-Broadcasting Methods (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16455580A JPS5789345A (en) | 1980-11-25 | 1980-11-25 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16455580A JPS5789345A (en) | 1980-11-25 | 1980-11-25 | Semiconductor integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5789345A JPS5789345A (en) | 1982-06-03 |
| JPS632179B2 true JPS632179B2 (es) | 1988-01-18 |
Family
ID=15795380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16455580A Granted JPS5789345A (en) | 1980-11-25 | 1980-11-25 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5789345A (es) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172847A (ja) * | 1983-03-19 | 1984-09-29 | Rohm Co Ltd | ステレオ復調回路 |
| EP0347853B1 (en) * | 1988-06-21 | 2000-02-02 | Sanyo Electric Co., Ltd. | Semiconductor integrated circuit |
| JPH06209535A (ja) * | 1993-01-07 | 1994-07-26 | Toyota Motor Corp | モータのコイル構造 |
-
1980
- 1980-11-25 JP JP16455580A patent/JPS5789345A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5789345A (en) | 1982-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4140878A (en) | Stereo demodulator system | |
| JPS632179B2 (es) | ||
| US4680792A (en) | Demodulator comprising an indicator circuit for use in common to cancellation of a pilot signal and an indication of a reception state | |
| US4047116A (en) | FM multiplex stereo demodulating circuit | |
| JPH0417490B2 (es) | ||
| JP3479334B2 (ja) | ステレオとデュアル音声信号認識用回路 | |
| JPS6247017B2 (es) | ||
| GB1536961A (en) | Frequency-modulated stereo-signal receivers | |
| JPH0354449Y2 (es) | ||
| US4751735A (en) | Stereo demodulation device | |
| JPS6238364Y2 (es) | ||
| JPS5813647Y2 (ja) | ステレオマルチプレツクス回路 | |
| JPS61147611A (ja) | 受信回路 | |
| JP3012741B2 (ja) | Ｆｍ／ａｍ受信回路 | |
| JPS6223161Y2 (es) | ||
| JP2810601B2 (ja) | Ｆｍ／ａｍ受信回路 | |
| JPH0355058B2 (es) | ||
| JPS6317257B2 (es) | ||
| JP2723187B2 (ja) | 音声多重復調回路 | |
| JPS6243381B2 (es) | ||
| JPS6241474Y2 (es) | ||
| JPH0452661B2 (es) | ||
| JPH0350451B2 (es) | ||
| JPS5915412B2 (ja) | Ｆｍ復調回路の出力伝送回路 | |
| JPH0355057B2 (es) |