JPS63209852A - Energization transfer recording head - Google Patents
Energization transfer recording headInfo
- Publication number
- JPS63209852A JPS63209852A JP4369687A JP4369687A JPS63209852A JP S63209852 A JPS63209852 A JP S63209852A JP 4369687 A JP4369687 A JP 4369687A JP 4369687 A JP4369687 A JP 4369687A JP S63209852 A JPS63209852 A JP S63209852A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- recording
- recording head
- electrode
- transfer type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229910018104 Ni-P Inorganic materials 0.000 claims abstract description 6
- 229910018536 Ni—P Inorganic materials 0.000 claims abstract description 6
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910020674 Co—B Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229910052804 chromium Inorganic materials 0.000 abstract 2
- 239000011651 chromium Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- WHOPEPSOPUIRQQ-UHFFFAOYSA-N oxoaluminum Chemical compound O1[Al]O[Al]1 WHOPEPSOPUIRQQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリンタ等の記録装置の記録ヘッドに関し、
詳しくは通電発熱型の熱転写リボンを使用する３Ｍ１！
転写型記録装置の記録ヘッドに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a recording head of a recording device such as a printer,
For details, see 3M1, which uses an electrically heated thermal transfer ribbon!
The present invention relates to a recording head of a transfer type recording device.
通電転写型記録装置の熱転写リボンに通電する記録ヘッ
ドは、特開昭６０−２１４９７２号公報に示されるよう
に、スクリーン印刷法により、セラミック基板上にタン
グステン、モリブデン、又はタングステンとモリブデン
の混合物等のメタライズ層を形成した後、フォトエツチ
ングにより複数の記録電極を形成する。As shown in Japanese Unexamined Patent Application Publication No. 60-214972, the recording head of the current transfer type recording device, which supplies electricity to the thermal transfer ribbon, prints tungsten, molybdenum, or a mixture of tungsten and molybdenum, etc. on a ceramic substrate using a screen printing method. After forming the metallized layer, a plurality of recording electrodes are formed by photoetching.
しかしながら、このものはメタライズ層中に焼成時に基
板より侵入するガラス質が多く、フォトエツチングによ
る記録電極の微細化に限界があり、またこのガラス部分
の混在により通電特性が悪く、印字画質の低下を招く。However, with this method, there is a lot of glass that enters the metallized layer from the substrate during firing, which limits the miniaturization of recording electrodes by photoetching.Additionally, the mixture of glass parts has poor current conduction characteristics, resulting in a decrease in printed image quality. invite
また、基板のセラミック材料の中にはメタライズが困難
なものが多く、基板材料が限定されるという欠点がある
。また、ガラス質の混在により記録電極の緻密性が低く
、耐久性に乏しい。Further, many of the ceramic materials for the substrate are difficult to metalize, and there is a drawback that the substrate materials are limited. Furthermore, due to the presence of glass, the density of the recording electrode is low, resulting in poor durability.
本発明は上記点に鑑みてなされたもので、記録電極の微
細化を実現でき、通電特性も良好に維持でき、耐久性も
優れた通電転写型の記録ヘッドを提供することを目的と
する。The present invention has been made in view of the above points, and an object of the present invention is to provide a current transfer type recording head that can realize finer recording electrodes, maintain good current conduction characteristics, and has excellent durability.
上記目的を達成するための本発明の構成は、熱溶融性イ
ンクと導電抵抗層を備えたリボンの導電抵抗層に通電し
、この通電部にジュール熱を発生させインクを溶融して
記録紙に転写する通電転写型記録装置の記録ヘッドにお
いて、前記導電抵抗層に通電するための記録電極を硬質
Ｃｒめっきで形成したことを特徴とする。The configuration of the present invention for achieving the above object is to apply electricity to a conductive resistance layer of a ribbon provided with heat-melting ink and a conductive resistance layer, and generate Joule heat in this current-carrying portion to melt the ink and transfer it to recording paper. In the recording head of a current transfer type recording device for transferring, a recording electrode for supplying current to the conductive resistance layer is formed by hard Cr plating.
ヘッド基板上に形成した負電極用下地層の記録電極パタ
ーン上に硬質Ｃｒめっきを施して記録電極を形成するの
で、微細化を実現でき、かつ緻密であるから通電特性も
良好なものができる。Since the recording electrode is formed by hard Cr plating on the recording electrode pattern of the negative electrode base layer formed on the head substrate, it is possible to achieve finer structure and to have good current conduction characteristics because it is dense.
ヘッド基板２の材料はＡ １ ｚ Ｏ３とＭｇＯを主成
分とするセラミック（通称スピネル）を用い、負電極用
となる下層めっきとして、無電解Ｎｉ−Ｐめっきを基板
２上に厚さ２μｍ施した後、基板２上に環化ゴム系フォ
トレジストを３μｍの厚さで塗布した。次にフォトレジ
ストを露光し、記録電極のネガパターンを作成した。そ
して、無電解Ｎｉ−Ｐめっきをエツチングし、記録電極
パターンを形成した。次に、硬質Ｃｒめっきを無電解Ｎ
ｉ−Ｐめっきパターン３上に２０μｍの厚さで析出させ
記録電極４を形成した。このときのめっき条件は次のと
おりである。The material of the head substrate 2 is ceramic (commonly known as spinel) whose main components are A 1 z O 3 and MgO, and electroless Ni-P plating is applied to the substrate 2 to a thickness of 2 μm as the lower layer plating for the negative electrode. Thereafter, a cyclized rubber photoresist was applied onto the substrate 2 to a thickness of 3 μm. The photoresist was then exposed to light to create a negative pattern for the recording electrode. Then, the electroless Ni--P plating was etched to form a recording electrode pattern. Next, hard Cr plating was applied with electroless N
Recording electrode 4 was formed by depositing on i-P plating pattern 3 to a thickness of 20 μm. The plating conditions at this time were as follows.
浴組成： Ｋ＊Ｃｒ ｔｏｑ ３０ ｇ ／
ＩＣｒｙ、 ２６０ｇ／ｊ！ＫｔＳｉＦｉ
１０ｇ／Ｊ
Ｈ２ＳＣ）４ １ ｇ／ｌ
浴温： ５６℃
電流密度： ４０Ａ／ｄｙｙ１”
そして更に、記録電極４の先端部のうちリボンと接触す
る端面５以外の部分をプラズマ溶射法により、基板２と
同材質のセラミック（通称スピネル）６で溶射被覆した
。これにより、記録電極４間の隙間がセラミック６で充
填され、リボンとの摺動により生じたリボンのカーボン
等が記録電極４間に堆積することがなくなり、通電特性
が良好に維持される。また、記録電極４がセラミック６
で被覆されて記録電極４とヘッド基板２との密着性が良
好となり、記録電極４の剥離等を生じることがなくなり
、耐久性に優れる。なお、上記セラミック６は、記録電
極４の少なくとも先端部をリボンとの接触端面を除いて
被覆すればよい。Bath composition: K*Cr toq 30 g/
ICry, 260g/j! KtSiFi
10 g/J H2SC) 4 1 g/l Bath temperature: 56° C. Current density: 40 A/dyy1” Then, the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon is coated with the substrate 2 by plasma spraying. Ceramic (commonly known as spinel) 6 made of the same material as the recording electrode 4 is coated by thermal spraying.As a result, the gap between the recording electrodes 4 is filled with the ceramic 6, and carbon, etc. from the ribbon generated by sliding with the ribbon is deposited between the recording electrodes 4. The recording electrode 4 is made of ceramic 6.
As a result, the adhesion between the recording electrode 4 and the head substrate 2 is improved, and peeling of the recording electrode 4 does not occur, resulting in excellent durability. Note that the ceramic 6 may cover at least the tip of the recording electrode 4 except for the end surface in contact with the ribbon.
なお、ヘッド基板２の材料としてはＡ １ ｚ○、。The material of the head substrate 2 is A1z○.
Ｓｉｎｇ、又はＭｇＯの単体、若しくはこれらの混合物
等、あるいは上記セラミックの他、ポリイミド、エポキ
シ、ポリアミド、フェノール等の耐熱性を有する樹脂等
が適当である。Sing, MgO alone, or a mixture thereof, or in addition to the above-mentioned ceramics, heat-resistant resins such as polyimide, epoxy, polyamide, and phenol are suitable.
また、記録電極４の被覆材としては、上記セラミックの
他、絶縁性を有する他の物質例えばポリイミド、エポキ
シ、ポリアミド、フェノール等の耐熱性を有する樹脂等
が適当である。In addition to the ceramic described above, other insulating materials such as heat-resistant resins such as polyimide, epoxy, polyamide, and phenol are suitable as the covering material for the recording electrode 4.
また、負電極用となる下層めっき３は無電解Ｎｉ−Ｐめ
っきに限らず、その他無電解Ｃｕめっき又はＮｉ −Ｂ
、 Ｎｉ −Ｗ−Ｐ、 Ｃｏ−Ｐ、 Ｃｏ −Ｂ、
Ｃｏ−Ｗ−Ｐ等の無電解合金めっき、更には耐摩耗性を
付与するためにそれらにＡ１．Ｏ，。In addition, the lower layer plating 3 for the negative electrode is not limited to electroless Ni-P plating, but may also be electroless Cu plating or Ni-B plating.
, Ni-W-P, Co-P, Co-B,
Electroless alloy plating such as Co-W-P, and A1. O.
ＣｒｘＣｔ 、Ｃｒｚ０３ 、ＷＣ，ＢＮ、Ｓ ｉ Ｃ
。CrxCt, Crz03, WC, BN, S i C
.
５ｉｓＮ４等の硬質粒子を分散させた複合めっき等を用
いることができる。Composite plating in which hard particles such as 5isN4 are dispersed can be used.
また、無電解めっきに換えて、Ｃｕ箔又はＮｉ箔等の通
電性のある箔を基板２に接着してもよく、例えば銅張り
プリント基板等を用いることもできる。Further, instead of electroless plating, a conductive foil such as a Cu foil or a Ni foil may be adhered to the substrate 2, and for example, a copper-clad printed circuit board or the like may be used.
また、記録電極４の先端部のうちリボンと接触する端面
５以外の部分の絶縁性物質の被覆方法として、セラミッ
ク被覆方法としては、上記溶射法の他、真空蒸着法、ス
パッター法等でもよく、また樹脂被覆方法としてはフィ
ルムの接着、又は浸漬法、スプレー法による接着剤樹脂
の塗布等が好ましい。Further, as a method of coating the insulating material on the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon, the ceramic coating method may be a vacuum evaporation method, a sputtering method, etc. in addition to the above-mentioned thermal spraying method. Preferable resin coating methods include film adhesion, dipping, spraying, and the like.
以上の実施例により作製した記録ヘッド１は、従来のス
クリーン印刷法によるメタライズ法では記録電極のピン
チ３００μｍ５幅１００μｍ（３本／ ＊璽）がほぼ限
界であったのに対し、記録電極１６本／ｆｉの微細化が
可能となり、通電特性も良好で、従来品に比べて印字画
質が著しく向上し、記録電極のＩ＋離等を生じることが
ない。The recording head 1 manufactured according to the above embodiment has 16 recording electrodes/mark, whereas the conventional screen printing metallization method had a recording electrode pinch of 300 μm5 width 100 μm (3 wires/*mark). It is possible to miniaturize fi, the current conduction characteristics are good, the printed image quality is significantly improved compared to conventional products, and there is no occurrence of I+ separation of the recording electrode.
この記録ヘッドｌは、第４図に示すように、その記録電
極４の端面５を熱熔融性インクを備えた熱転写リボン７
の一面に接触させ、記録電極４に選択的に通電すること
によりリボン７の導電抵抗層に部分的に電流を流し、こ
の部分にジュール熱を発生させて、その部分のリボン７
のインクを溶融させ、リボン７の記録電極４と反対側の
面に密着している記録紙８に転写するものである。９は
記録紙８の搬送ロールである。As shown in FIG. 4, this recording head 1 has an end surface 5 of its recording electrode 4 connected to a thermal transfer ribbon 7 containing hot-melt ink.
By contacting one surface of the ribbon 7 and selectively energizing the recording electrode 4, a current is applied to a portion of the conductive resistance layer of the ribbon 7, generating Joule heat in this portion.
The ink is melted and transferred onto the recording paper 8 that is in close contact with the surface of the ribbon 7 opposite to the recording electrode 4. 9 is a transport roll for the recording paper 8.
以上説明したように本発明によれば、記録ヘッドの基板
上に形成する複数の記録電極の微細化が可能となり、通
電特性も良好で、高画質の記録が可能となり、また通電
特性も良好に維持でき、記録電極の剥離も生ぜず、耐久
性も優れるものである。As explained above, according to the present invention, it is possible to miniaturize the plurality of recording electrodes formed on the substrate of the recording head, and the current conduction characteristics are good, making it possible to record high image quality, and the current conduction characteristics are also good. It can be maintained, the recording electrode does not peel off, and the durability is excellent.
図面は本発明の一実施例を示し、第１図は絶縁性物質被
覆前の記録ヘッド端部の一部を示す斜視図、第２図は絶
縁性物質被覆後の記録ヘッド端部の一部を示す正面図、
第３図は同側断面図、第４図は通電転写型記録装置の一
部を示す説明図である。
ｌは記録ヘッド、２はヘッド基板、３は下地層、４は記
録電極、５は端面、６は絶縁性物質被覆、７はリボン、
８は記録紙。The drawings show an embodiment of the present invention; FIG. 1 is a perspective view showing a part of the end of the recording head before being coated with an insulating material, and FIG. 2 is a perspective view showing a part of the end of the recording head after being coated with an insulating material. A front view showing
FIG. 3 is a sectional view of the same side, and FIG. 4 is an explanatory diagram showing a part of the current transfer type recording apparatus. 1 is a recording head, 2 is a head substrate, 3 is a base layer, 4 is a recording electrode, 5 is an end surface, 6 is an insulating material coating, 7 is a ribbon,
8 is recording paper.
Claims (6)
電抵抗層に通電し、この通電部にジュール熱を発生させ
インクを溶融して記録紙に転写する通電転写型記録装置
の記録ヘッドにおいて、前記導電抵抗層に通電するため
の記録電極を硬質Ｃｒめっきで形成したことを特徴とす
る通電転写型記録ヘッド。(1) A recording head of a current transfer type recording device that applies electricity to the conductive resistance layer of a ribbon that includes heat-melting ink and a conductive resistance layer, and generates Joule heat in this current-carrying section to melt the ink and transfer it to recording paper. An electric transfer type recording head characterized in that a recording electrode for supplying current to the conductive resistance layer is formed by hard Cr plating.
なることを特徴とする特許請求の範囲第１項記載の通電
転写型記録ヘッド。(2) The current transfer type recording head according to claim 1, wherein the head substrate is made of ceramic or heat-resistant resin.
解Ｃｕめっき又はＮｉ−Ｐ、Ｎｉ−Ｂ、Ｎｉ−Ｗ−Ｐ、
Ｃｏ−Ｐ、Ｃｏ−Ｂ、Ｃｏ−Ｗ−Ｐ等の無電解合金めっ
き若しくはそれらに硬質粒子を分散させた複合めっきを
ヘッド基板に施してなることを特徴とする特許請求の範
囲第１項記載の通電転写型記録ヘッド。(3) Electroless Cu plating or Ni-P, Ni-B, Ni-W-P, as a base layer for the negative electrode of the hard Cr plating,
Claim 1, characterized in that the head substrate is coated with electroless alloy plating such as Co-P, Co-B, Co-W-P, or a composite plating in which hard particles are dispersed therein. Electric transfer type recording head.
子がＡｌ＿２Ｏ＿３、Ｃｒ＿３Ｃ＿２、Ｃｒ＿２Ｏ＿３
、ＷＣ、ＢＮ、ＳｉＣ、Ｓｉ＿３Ｎ＿４等であることを
特徴とする特許請求の範囲第３項記載の通電転写型記録
ヘッド。(4) The hard particles dispersed in the composite plating as the base layer are Al_2O_3, Cr_3C_2, Cr_2O_3
, WC, BN, SiC, Si_3N_4, etc., as claimed in claim 3.
箔又はＮｉ箔等の通電性のある箔をヘッド基板に接着し
てなることを特徴とする特許請求の範囲第１項記載の通
電転写型記録ヘッド。(5) Cu as a base layer for the negative electrode of the hard Cr plating.
2. The current transfer type recording head according to claim 1, wherein a conductive foil such as foil or Ni foil is bonded to the head substrate.
の接触端面を除いてセラミック又は樹脂等の絶縁性物質
で被覆したことを特徴とする特許請求の範囲第１項記載
の通電転写型記録ヘッド。(6) An electrical transfer type recording head according to claim 1, characterized in that at least the tip end of the recording electrode is coated with an insulating material such as ceramic or resin, except for the end surface in contact with the ribbon. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369687A JPS63209852A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369687A JPS63209852A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63209852A true JPS63209852A (en) | 1988-08-31 |
Family
ID=12670992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4369687A Pending JPS63209852A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63209852A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199669A (en) * | 1984-03-23 | 1985-10-09 | Seiko Epson Corp | Printing device |
-
1987
- 1987-02-26 JP JP4369687A patent/JPS63209852A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199669A (en) * | 1984-03-23 | 1985-10-09 | Seiko Epson Corp | Printing device |
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