JPS63199656A - Electric conduction-transfer type recording head - Google Patents
Electric conduction-transfer type recording headInfo
- Publication number
- JPS63199656A JPS63199656A JP3098487A JP3098487A JPS63199656A JP S63199656 A JPS63199656 A JP S63199656A JP 3098487 A JP3098487 A JP 3098487A JP 3098487 A JP3098487 A JP 3098487A JP S63199656 A JPS63199656 A JP S63199656A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- recording
- electroless
- recording head
- ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910018104 Ni-P Inorganic materials 0.000 claims abstract description 3
- 229910018536 Ni—P Inorganic materials 0.000 claims abstract description 3
- 239000011810 insulating material Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- -1 iron group metals Chemical class 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 7
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 5
- 229910020515 Co—W Inorganic materials 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリンタ等の記録装置の記録ヘッドに関し、
詳しくは通電発熱型の熱転写リボンを使用する通電転写
型記録装置の記録ヘッドに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a recording head of a recording device such as a printer,
More specifically, the present invention relates to a recording head of an electrical transfer type recording device that uses an electrically heated thermal transfer ribbon.
通電転写型記録装置の熱転写リボンに通電する記録ヘッ
ドは、特開昭６０−２１４９７２号公報に示されるよう
に、スクリーン印刷法により、セラミック基板上にタン
グステン、モリブデン、又はタングステンとモリブデン
の混合物等のメタライズ層を形成した後、フォトエツチ
ングにより複数の記録電極を形成する。As shown in Japanese Unexamined Patent Application Publication No. 60-214972, the recording head of the current transfer type recording device, which supplies electricity to the thermal transfer ribbon, prints tungsten, molybdenum, or a mixture of tungsten and molybdenum, etc. on a ceramic substrate using a screen printing method. After forming the metallized layer, a plurality of recording electrodes are formed by photoetching.
しかしながら、このものはメタライズ層中に焼成時に基
板より侵入するガラス質が多く、フォトエツチングによ
る記録電極の微細化に限界があり、またこのガラス部分
の混在により通電特性が悪く、印字画質の低下を招く、
また、基板のセラミック材料の中にはメタライズが困難
なものが多く、基板材料が限定されるという欠点がある
。また、ガラス質の混在により記録電極の緻密性が低く
、耐久性に乏しい。However, with this method, there is a lot of glass that enters the metallized layer from the substrate during firing, which limits the miniaturization of recording electrodes by photoetching.Additionally, the mixture of glass parts has poor current conduction characteristics, resulting in a decrease in printed image quality. invite,
Further, many of the ceramic materials for the substrate are difficult to metalize, and there is a drawback that the substrate materials are limited. Furthermore, due to the presence of glass, the density of the recording electrode is low, resulting in poor durability.
更に、通電転写法によれば、インクリボンとの摺動によ
り生じたリボンのカーボン等が記録電極間の隙間に付着
堆積し、通電特性が悪化（短絡）し、長寿命の印字画質
の維持が困難となる等の欠点がある。Furthermore, according to the current transfer method, carbon, etc. of the ribbon generated by sliding with the ink ribbon adheres and accumulates in the gap between the recording electrodes, deteriorating current conductivity (short circuit) and making it difficult to maintain print quality over a long life. There are drawbacks such as difficulty.
本発明は上記点に鑑みてなされたもので、記録電極の微
細化を実現でき、通電特性も良好に維持でき、耐久性も
優れた通電転写型の記録ヘッドを提供することを目的と
する。The present invention has been made in view of the above points, and an object of the present invention is to provide a current transfer type recording head that can realize finer recording electrodes, maintain good current conduction characteristics, and has excellent durability.
〔問題点を解決するための手段〕
上記目的を達成するための本発明の構成は、熱溶融性イ
ンクと導電抵抗層を備えたリボンの導電抵抗層に通電し
、この通電部にジュール熱を発生させインクを溶融して
記録紙に転写する通電転写型記録装置の記録ヘッドにお
いて、前記導電抵抗層に通電するための記録電極をｌ”
ｅ、 ｃｏ、 Ｎｉ等の鉄族金属とＭｏ、Ｗ、Ｒｅ等の
高融点金属とからなる合金めっきで形成し、更にこれら
の記録電極の少なくとも先端部を前記リボンとの接触端
面を除いて絶縁性物質で被覆したことを特徴とする。[Means for Solving the Problems] The configuration of the present invention for achieving the above object is to apply electricity to the conductive resistance layer of the ribbon including the heat-melting ink and the conductive resistance layer, and apply Joule heat to this current-carrying part. In a recording head of a current transfer type recording device that generates ink, melts it, and transfers it to a recording paper, a recording electrode for supplying current to the conductive resistance layer is l''.
The recording electrodes are formed by alloy plating made of iron group metals such as e, co, and Ni and high melting point metals such as Mo, W, and Re, and furthermore, at least the tip portions of these recording electrodes are insulated except for the end surfaces in contact with the ribbon. It is characterized by being coated with a sexual substance.
ヘッド基板上にフォトレジストにより複数の記録電極の
ネガパターンを形成した後、めっき法により記録電極を
形成するので、微細化を実現でき、かつ緻密であるから
通電特性も良好なものができる。After forming a negative pattern of a plurality of recording electrodes on the head substrate using photoresist, the recording electrodes are formed by plating, so that miniaturization can be achieved, and since the electrodes are dense, good current conduction characteristics can be achieved.
更に、合金めっきは時効処理により硬度の調節が可能（
Ｈｖ４００〜１３００）であるため、基板材質に合わせ
た硬度（耐摩耗性）を選択でき、基板と記録電極の摩耗
段差を生じることがなくなり、通電特性が良好に維持さ
れる。なお、合金めっきの厚みは数μｍ〜５０μｍ程度
である。Furthermore, the hardness of alloy plating can be adjusted by aging treatment (
Hv400 to 1300), the hardness (wear resistance) can be selected in accordance with the substrate material, and there is no difference in wear between the substrate and the recording electrode, and good current conduction characteristics are maintained. Note that the thickness of the alloy plating is approximately several μm to 50 μm.
また、記録電極の少なくとも先端部をリボンとの接触端
面を除いて絶縁性物質で被覆したので、リボンとの摺動
により生じたリボンのカーボン等が記録電極間に付着堆
積することがなくなり、通電特性が良好に維持される。In addition, since at least the tip of the recording electrode is coated with an insulating material except for the end surface in contact with the ribbon, carbon of the ribbon generated by sliding with the ribbon is prevented from adhering and depositing between the recording electrodes. Properties are well maintained.
また、記録電極の少なくとも先端部をリボンとの接触端
面を除いて絶縁性物質で被覆したので、記録電極とヘッ
ド基板との密着性が良好となり、記録電極の剥離等を生
じることがなくなり、耐久性に優れる。In addition, since at least the tip of the recording electrode is coated with an insulating material except for the end surface in contact with the ribbon, the adhesion between the recording electrode and the head substrate is good, eliminating the possibility of peeling of the recording electrode and increasing durability. Excellent in sex.
（１）ヘッド基板２の材料はＡｌｔ’ｓとＭｇＯを主成
分とするセラミック（通称スピネル）を用い、負電極用
となる下層めっきとして、無電解Ｃｕめっきを基板２上
に厚さ２μｍ施した後、基板２上に環化ゴム系フォトレ
ジストを３μｍの厚さで塗布した０次にフォトレジスト
を露光し、記録電極のネガパターンを作成した。そして
、無電解Ｃｕめっきをエツチングし、記録電極パターン
を形成した０次に、電解Ｃｏ−Ｗ合金めっきを無電解Ｃ
Ｕめっきパターン３上に３０μｍの厚さで析出させ記録
電極４を形成した。Ｃｏ−Ｗ合金めっきの液組成は硫酸
コバル）０．０３モル／１、酒石酸アンモニウム０．２
６モル／ｌ、タングステン酸ナトリウム０．２３モル／
１で、めっき条件はＰＨ７〜９、液温７０℃、電流密度
１〜３０−Ａ／ｄｍ”である。(1) The head substrate 2 is made of ceramic (commonly known as spinel) whose main components are Alt's and MgO, and electroless Cu plating is applied to the substrate 2 to a thickness of 2 μm as the lower layer plating for the negative electrode. Thereafter, a cyclized rubber-based photoresist was applied to a thickness of 3 μm on the substrate 2, and the zero-order photoresist was exposed to light to create a negative pattern of the recording electrode. Then, the electroless Cu plating is etched to form a recording electrode pattern. Next, the electroless Co-W alloy plating is etched using electroless Cu plating.
Recording electrode 4 was formed by depositing on U plating pattern 3 to a thickness of 30 μm. The liquid composition of Co-W alloy plating is cobal sulfate) 0.03 mol/1, ammonium tartrate 0.2
6 mol/l, sodium tungstate 0.23 mol/l
1, the plating conditions were pH 7 to 9, liquid temperature 70°C, and current density 1 to 30 A/dm''.
そして更に、記録電極４の先端部のうちリボンと接触す
る端面５以外の部分をプラズマ溶射法により、基板２と
同材質のセラミック（通称スピネル）６で溶射被覆した
。これにより、リボンとの摺動により生じたリボンのカ
ーボン等が記録電極４間に付着堆積することがなくなり
、通電特性が良好に維持される。また、記録電極４とヘ
ッド基板２との密着性が良好となり、記録電極４の剥離
等を生じることがなくなり、耐久性に優れる。なお、上
記セラミック６は、記録電極４の少なくとも先端部をリ
ボンとの接触端面を除いて被覆すればよい。Furthermore, a portion of the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon was coated with a ceramic (commonly known as spinel) 6 made of the same material as the substrate 2 by plasma spraying. This prevents carbon and the like of the ribbon generated by sliding with the ribbon from adhering and accumulating between the recording electrodes 4, and good current conduction characteristics are maintained. Further, the adhesion between the recording electrode 4 and the head substrate 2 is improved, and peeling of the recording electrode 4 does not occur, resulting in excellent durability. Note that the ceramic 6 may cover at least the tip of the recording electrode 4 except for the end surface in contact with the ribbon.
そして更に、Ｃｏ−Ｗ合金めっきの時効温度と硬度の関
係から、３５０℃でＩＨｒ時効処理を施した。これによ
り、上記セラミック（通称スピネル）と同じ硬度（Ｈｖ
８００）にした。Furthermore, IHr aging treatment was performed at 350°C due to the relationship between aging temperature and hardness of Co-W alloy plating. As a result, it has the same hardness (Hv) as the above ceramic (commonly known as spinel).
800).
なお、負電極用となる下層めっき３は無電解ＣＵめっき
に限らず、その他Ｎｔ−Ｂ、 Ｎｉ −Ｐ。Note that the lower layer plating 3 for the negative electrode is not limited to electroless CU plating, but may also include Nt-B, Ni-P.
Ｎｉ −Ｗ−Ｐ、 Ｃｏ−Ｐ、 Ｃｏ −Ｗ−Ｐ等の無
電解合金めっき等を用いることができる。Electroless alloy plating such as Ni-WP, Co-P, Co-WP, etc. can be used.
（２）ヘッド基板２の材料は市販の銅張りエポキシ樹脂
板（１，５ｍｔ、銅１８μｍ）を用いた０次に、銅（１
８μｍ）をエツチングにより３μｍとした。そして、上
記実施例（１）と同様の手法により、銅の記録電極パタ
ーンを形成した後、銅パターン３上にＣｏ−Ｗ合金めっ
きを３０μｍの厚さで析出させ、記録電極４を形成した
。(2) The material of the head board 2 is a commercially available copper-clad epoxy resin plate (1.5mt, copper 18μm), which is made of copper (1.5mt, copper 18μm).
8 μm) was reduced to 3 μm by etching. Then, a copper recording electrode pattern was formed by the same method as in Example (1) above, and then Co--W alloy plating was deposited to a thickness of 30 μm on the copper pattern 3 to form the recording electrode 4.
更に、記録電極４の先端部のうちリボンと接触する端面
５以外の部分をエポキシ系樹脂６で被覆した。なお、被
覆材としてはエポキシ系樹脂の他、ポリイミド系、ポリ
アミド系、フェノール系等の耐熱性樹脂を用いることが
できる。このようにして、上記実施例（１）と同様に通
電特性が良好に維持され、また耐久性に優れる。なお、
上記樹脂は記録電極４の少なくとも先端部をリボンとの
接触端面を除いて被覆すればよい。Further, a portion of the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon was coated with an epoxy resin 6. In addition to epoxy resins, heat-resistant resins such as polyimide, polyamide, and phenol resins can be used as the covering material. In this way, as in Example (1) above, the current conduction characteristics are maintained well and the durability is excellent. In addition,
The resin may cover at least the tip of the recording electrode 4, except for the end surface in contact with the ribbon.
また、銅張リエボキシ樹脂板の他、Ｃｕ、Ｎｉ等の箔を
基板２に接着したもの等を用いることができる。Further, in addition to a copper-clad revoxy resin board, a board made of Cu, Ni, or the like foil bonded to the substrate 2 can be used.
なお、上記実施例（１）、 （２）のヘッド基板２の
材料としては” ｇｏｓ ＋ Ｓ ｉ Ｏ□、又はＭ
ｇＯの単体、若しくはこれらの混合物、あるいは上記セ
ラミックの他、ポリイミド、エポキシ、ポリアミド、フ
ェノール等の耐熱性を有する樹脂等が適当である。In addition, the material of the head substrate 2 in the above embodiments (1) and (2) is "gos + S i O□, or M
In addition to the above-mentioned ceramics, gO alone, a mixture thereof, and heat-resistant resins such as polyimide, epoxy, polyamide, and phenol are suitable.
また、記録電極４の先端部のうちリボンと接触する端面
５以外の部分の絶縁性物質の被覆方法として、セラミッ
ク被覆方法としては上記溶射法の他、真空蒸着法、スパ
ッター法等でもよく、また樹脂被覆方法としては浸漬法
、スプレー法等が好ましい。In addition, as a method for coating the insulating material on the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon, the ceramic coating method may be vacuum evaporation, sputtering, etc. in addition to the above-mentioned thermal spraying method. Preferred resin coating methods include dipping, spraying, and the like.
以上の実施例により作製した記録ヘッド１は、従来のス
クリーン印刷法によるメタライズ法では記録電極のピン
チ３００μｍ１幅１００μｍ（３本／１ｍ）がほぼ限界
であったのに対し、記録電極１６本／龍の微細化が可能
となり、更に通電特性が良好で、従来品に比べて印字画
質が著しく向上し、カーボン等による短絡を生じること
もな（、記録電極の剥離等も生じない。The recording head 1 manufactured according to the above embodiment has 16 recording electrodes/1 m, whereas the conventional screen printing metallization method had a recording electrode pinch of 300 μm 1 width 100 μm (3 electrodes/1 m). In addition, it has good current conduction characteristics, significantly improves print quality compared to conventional products, and does not cause short circuits due to carbon or the like (and does not cause peeling of recording electrodes, etc.).
この記録ヘッド１は、第４図に示すように、その記録電
極４の端面５を熱溶融性インクを備えた熱転写リボン７
の一面に接触させ、記録電極４に選択的に通電すること
によりリボン７の導電抵抗層に部分的に電流を流し、こ
の部分にジュール熱を発生させて、その部分のリボン７
のインクを溶融させ、リボン７の記録電極４と反対側の
面に密着している記録紙８に転写するものである。９は
記録紙８の搬送ロールである。As shown in FIG. 4, this recording head 1 has an end surface 5 of its recording electrode 4 connected to a thermal transfer ribbon 7 containing heat-melting ink.
By contacting one surface of the ribbon 7 and selectively energizing the recording electrode 4, a current is applied to a portion of the conductive resistance layer of the ribbon 7, generating Joule heat in this portion.
The ink is melted and transferred onto the recording paper 8 that is in close contact with the surface of the ribbon 7 opposite to the recording electrode 4. 9 is a transport roll for the recording paper 8.
以上説明したように本発明によれば、記録ヘッドの基板
上に形成する複数の記録電極の微細化が可能となり、通
電特性も良好で、高画質の記録が可能となり、また通電
特性も良好に維持でき、記録電極の＠離も生ぜず、耐久
性も優れるものである。As explained above, according to the present invention, it is possible to miniaturize the plurality of recording electrodes formed on the substrate of the recording head, and the current conduction characteristics are good, making it possible to record high image quality, and the current conduction characteristics are also good. It can be maintained, does not cause separation of recording electrodes, and has excellent durability.
図面は本発明の一実施例を示し、第１図は絶縁性物質被
覆前の記録ヘッド端部の一部を示す斜視図、第２図は絶
縁性物質被覆後の記録ヘッド端部の一部を示す正面図、
第３図は同側断面図、第４図は通電転写型記録装置の一
部を示す説明図である。
ｌは記録ヘッド、２はヘッド基板、３は下地層、４は記
録電極、５は端面、６は絶縁性物質被覆、７はリボン、
８は記録紙。The drawings show an embodiment of the present invention; FIG. 1 is a perspective view showing a part of the end of the recording head before being coated with an insulating material, and FIG. 2 is a perspective view showing a part of the end of the recording head after being coated with an insulating material. A front view showing
FIG. 3 is a sectional view of the same side, and FIG. 4 is an explanatory diagram showing a part of the current transfer type recording apparatus. 1 is a recording head, 2 is a head substrate, 3 is a base layer, 4 is a recording electrode, 5 is an end surface, 6 is an insulating material coating, 7 is a ribbon,
8 is recording paper.
Claims (4)
電抵抗層に通電し、この通電部にジュール熱を発生させ
インクを溶融して記録紙に転写する通電転写型記録装置
の記録ヘッドにおいて、前記導電抵抗層に通電するため
の記録電極をＦｅ、Ｃｏ、Ｎｉ等の鉄族金属とＭｏ、Ｗ
、Ｒｅ等の高融点金属とからなる合金めっきで形成し、
更にこれらの記録電極の少なくとも先端部を前記リボン
との接触端面を除いて絶縁性物質で被覆したことを特徴
とする通電転写型記録ヘッド。(1) A recording head of a current transfer type recording device that applies electricity to the conductive resistance layer of a ribbon that includes heat-melting ink and a conductive resistance layer, and generates Joule heat in this current-carrying section to melt the ink and transfer it to recording paper. The recording electrode for supplying current to the conductive resistance layer is made of iron group metals such as Fe, Co, and Ni, and Mo, W.
, formed by alloy plating consisting of a high melting point metal such as Re,
Furthermore, an electrical transfer type recording head characterized in that at least the tip portions of these recording electrodes are coated with an insulating material except for the end surfaces that contact the ribbon.
を特徴とする通電転写型記録ヘッド。(2) An electrical transfer type recording head characterized in that the insulating material is ceramic or resin.
なることを特徴とする特許請求の範囲第１項記載の通電
転写型記録ヘッド。(3) The current transfer type recording head according to claim 1, wherein the head substrate is made of ceramic or heat-resistant resin.
っき又はＮｉ−Ｂ、Ｎｉ−Ｐ、Ｎｉ−Ｗ−Ｐ、Ｃｏ−Ｐ
、Ｃｏ−Ｗ−Ｐ等の無電解合金めっきを施したことを特
徴とする特許請求の範囲第１項記載の通電転写型記録ヘ
ッド。(4) Electroless Cu plating or Ni-B, Ni-P, Ni-W-P, Co-P as the lower layer plating of the alloy plating
2. The current transfer type recording head according to claim 1, wherein the recording head is plated with an electroless alloy such as Co-W-P.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3098487A JPS63199656A (en) | 1987-02-13 | 1987-02-13 | Electric conduction-transfer type recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3098487A JPS63199656A (en) | 1987-02-13 | 1987-02-13 | Electric conduction-transfer type recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199656A true JPS63199656A (en) | 1988-08-18 |
Family
ID=12318895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3098487A Pending JPS63199656A (en) | 1987-02-13 | 1987-02-13 | Electric conduction-transfer type recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199656A (en) |
-
1987
- 1987-02-13 JP JP3098487A patent/JPS63199656A/en active Pending
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