JPH01275063A - Energization transfer-type recording head - Google Patents
Energization transfer-type recording headInfo
- Publication number
- JPH01275063A JPH01275063A JP10525688A JP10525688A JPH01275063A JP H01275063 A JPH01275063 A JP H01275063A JP 10525688 A JP10525688 A JP 10525688A JP 10525688 A JP10525688 A JP 10525688A JP H01275063 A JPH01275063 A JP H01275063A
- Authority
- JP
- Japan
- Prior art keywords
- recording
- electrode
- head
- substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 10
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910020515 Co—W Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 ferrous metals Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 1
- 229910020674 Co—B Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910003296 Ni-Mo Inorganic materials 0.000 description 1
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリンタ等の記録装置の記録ヘッドに関し、
詳しくは通電発熱型の熱転写リボンを使用する通電転写
型記録装置の記録ヘッドに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a recording head of a recording device such as a printer,
More specifically, the present invention relates to a recording head of an electrical transfer type recording device that uses an electrically heated thermal transfer ribbon.
通電転写型記録装置の熱転写リボンに通電する記録ヘッ
ドは、特開昭６０−２１４９７２号公報に示されるよう
に、スクリーン印刷法により、セラミック基板２ａ（第
３図参照）上にタングステン、モリブデン、又はタング
ステンとモリブデンの混合物等のメタライズ層を形成し
た後、フォトエツチングにより複数の記録電極５ａを形
成する。As shown in Japanese Unexamined Patent Application Publication No. 60-214972, the recording head of the current transfer type recording device, which supplies electricity to the thermal transfer ribbon, prints tungsten, molybdenum, or After forming a metallized layer such as a mixture of tungsten and molybdenum, a plurality of recording electrodes 5a are formed by photoetching.
しかしながら、この記録ヘッドｌａは、記ｉ３電極５ａ
の側面にリボンカスが付着して記録電極５ａの側面間の
ヘッド基板２ａ上にリボンカスが堆積しやすく、そのた
め記録電極５３間に短絡を生じやす（、著しく印字画質
の低下を招く。However, in this recording head la, the i3 electrode 5a
Ribbon debris tends to adhere to the side surfaces of the recording electrodes 5a and accumulate on the head substrate 2a between the side surfaces of the recording electrodes 5a, which tends to cause short circuits between the recording electrodes 53 (resulting in a significant deterioration of print image quality).
また、基板２ａのセラミック材料の中にはメタライズが
困難なものが多く、基板２ａは硬さの高い（Ｈｖ８００
以上）材料に限定される。このため使用中に記録電極５
ａの摩耗が基板２ａより多くなって記録電極５ａの後退
を生じやすい。In addition, many of the ceramic materials of the substrate 2a are difficult to metalize, and the substrate 2a has a high hardness (Hv800
above) limited to materials. Therefore, during use, the recording electrode 5
The wear of the recording electrode 5a is greater than that of the substrate 2a, which tends to cause the recording electrode 5a to retreat.
また、メタライズ層中に焼成時に基板より侵入するガラ
ス質が多く、フォトエツチングによる記録電極５ａの微
細化に限界があり、またこのガラス質分の混在により通
電特性が悪＜゛、印字画質の低下を招く。また、ガラス
質の混在により記録電極５ａの緻密性が低く、耐久性に
乏しい。In addition, there is a large amount of glass that enters the metallized layer from the substrate during firing, which limits the miniaturization of the recording electrode 5a by photo-etching, and the presence of this glass causes poor current conduction characteristics and reduced print image quality. invite. Further, due to the presence of glass, the density of the recording electrode 5a is low, resulting in poor durability.
本発明は以上の点に鑑みてなされたもので、記！３電極
の耐久性の向上、微細化、通電特性の良好化などを図っ
た通電転写型の記録ヘッドを提供することを目的とする
。The present invention has been made in view of the above points, and is described below. The object of the present invention is to provide a current transfer type recording head in which three electrodes have improved durability, miniaturization, and improved current conduction characteristics.
本発明の構成は、熱溶融性インクと導電抵抗層を備えた
リボンの導電抵抗層に通電し、この通電部にジュール熱
を発生させインクを溶融して記録紙に転写する通電転写
型記録装置の記録ヘッドにおいて、前記導電抵抗層に通
電するための複数の記録電極を設けたヘッド基板の記録
電極間に凹溝を形成したことを特徴とする。これにより
、記録電極間の短絡を防止する。The configuration of the present invention is a current transfer type recording device that applies electricity to a conductive resistance layer of a ribbon that includes heat-melting ink and a conductive resistance layer, generates Joule heat in this current-carrying part, melts the ink, and transfers it to recording paper. The recording head is characterized in that a concave groove is formed between the recording electrodes of a head substrate provided with a plurality of recording electrodes for supplying current to the conductive resistance layer. This prevents short circuits between recording electrodes.
また、前記ヘッド基板材料としてはセラミック、耐熱性
樹脂などが用いられるが、記録電極の硬さと同等もしく
はそれより低いセラミックを用いるのが好ましい。これ
により、記録電極の後退を防止できる。ヘッド基板材料
としては記録電極の硬さよりも低過ぎる場合には耐久性
に劣る問題が生ずるので余り硬さの低い材料は使用でき
ないが、通常はＨｖ２００〜４００程度のセラミック、
例えば５ｉＯｆｆｉを主成分とするセラミック、チタン
酸アルミニウム、窒化アルミニウム等の低硬度セラミッ
ク（通称マシナブルセラミック）が好ましい。Ceramics, heat-resistant resins, and the like are used as the head substrate material, and it is preferable to use ceramics whose hardness is equal to or lower than that of the recording electrodes. This can prevent the recording electrode from retreating. As the material for the head substrate, if the hardness is lower than that of the recording electrodes, there will be a problem of poor durability, so materials with very low hardness cannot be used, but ceramics with a Hv of about 200 to 400,
For example, low-hardness ceramics (commonly known as machinable ceramics) such as ceramics containing 5iOffi as a main component, aluminum titanate, and aluminum nitride are preferable.
また、前記記録電極はスパッター、茎着法、イオンブレ
ーティング等によって形成してもよいが、めっきで形成
するのが好ましい。これにより、記録電極の微細化、緻
密化が図れる。めっきとしては、Ｆｅ、Ｎｉ、Ｃｏ等の
鉄属金属とＷ、Ｍｏ。Further, the recording electrode may be formed by sputtering, stem deposition, ion blating, etc., but it is preferable to form it by plating. This allows the recording electrode to be made finer and more dense. The plating includes ferrous metals such as Fe, Ni, and Co, as well as W and Mo.
Ｒｅ等の高融点金属との合金めっき（例えばＮ１−Ｗ、
Ｃｏ −Ｗ、 Ｎｉ −Ｍｏ、 Ｇｏ−Ｍｏ等の合金
めっき）、これらに粒子を分散させた複合合金めっき、
Ｎｉ −Ｐ、 Ｃｏ−Ｐ、 Ｆｅ−Ｐ等の合金めっき
、これらに粒子を分散させた複合合金めっき、もしくは
硬質Ｃｒめっきなどが好ましい、上記複合合金めっきの
分散粒子としては、１．０゜、Ｃｒ１Ｃｔ 、ＣｒｚＯ
ｓ 、ＷＣ，Ｓ ｉＣ，Ｓ ｉ３Ｎ４等の硬質粒子又は
／及びＢＮ、Ｍｏ５ｔ等の潤滑性粒子が用いられる。Alloy plating with high melting point metal such as Re (e.g. N1-W,
Co-W, Ni-Mo, Go-Mo alloy plating), composite alloy plating with particles dispersed therein,
Alloy plating such as Ni-P, Co-P, Fe-P, composite alloy plating with particles dispersed therein, or hard Cr plating is preferable.The dispersed particles of the composite alloy plating are preferably 1.0°, Cr1Ct, CrzO
Hard particles such as S, WC, SiC, Si3N4 and/or lubricating particles such as BN and Mo5t are used.
リボンカスは記録電極間に形成されたヘッド基板の凹溝
に落ち、記録電極の側面に付着堆積しにくくなる。その
結果、記録電極間の短絡が防止でき、通電特性を良好に
維持できる。Ribbon debris falls into the grooves of the head substrate formed between the recording electrodes, and becomes difficult to adhere to and accumulate on the side surfaces of the recording electrodes. As a result, short circuits between the recording electrodes can be prevented and good current conduction characteristics can be maintained.
また、ヘッド基板材料として記録電極の硬さと同等もし
くはそれより低いセラミックを用いると、記録電極がヘ
ッド基板と同等もしくは基板以上の耐摩耗性を備えるた
め、記録電極の後退を生じることがなくなり、通電特性
は良好に維持される。In addition, if a ceramic material with a hardness equal to or lower than that of the recording electrode is used as the material for the head substrate, the recording electrode will have wear resistance equal to or higher than that of the head substrate, which will prevent the recording electrode from retreating and will not cause the current to flow. Properties are well maintained.
また、記録電極をめっきで形成すると、微細化を実現で
き、かつ緻密であるから通電特性も良好なものができる
。Furthermore, if the recording electrode is formed by plating, it can be made finer and denser, resulting in better current conduction characteristics.
第１図は本発明の一実施例を示し、記録ヘッド端部の一
部を示す斜視図である。FIG. 1 shows an embodiment of the present invention, and is a perspective view showing a part of the end portion of the recording head.
ヘッド基板２の材料は５ｉｆｔを主成分とするセラミッ
ク（通称マシナブルセラミック）を用いた。セラミック
の組成を下記に示す。The head substrate 2 is made of ceramic whose main component is 5ift (commonly known as machinable ceramic). The composition of the ceramic is shown below.
Ｓｉ０□ ６４％
ＡｌｚＯｓ ２５％
に、０ ５％
その他 ６％
この基板２の硬さはＨＶ３８０であった。まず、基板２
の表面に無電解（ｕめっきを施した後、この表面にダイ
シングマシンにより幅３０μｍ、Ｅさ２０μｍの凹溝３
を所定のピッチで複数形成した。次に、フォトエツチン
グにより前記複数の凹を薄３間に無電解Ｃｕめっき層４
の記録電極用パターンを形成した。続いて、これを通電
用電極として硬質Ｃｒめっきを約１１０ｌ１の厚さで析
出させて、複数の記録電極５を形成した。記録電極５の
硬さはＨ，９３０であった。Si0□ 64% AlzOs 25%, 0 5% Others 6% The hardness of this substrate 2 was HV380. First, board 2
After electroless (U plating) is applied to the surface of
A plurality of them were formed at a predetermined pitch. Next, by photo-etching, the plurality of recesses are formed by forming an electroless Cu plating layer 4 between the thin layers 4 and 3.
A pattern for recording electrodes was formed. Subsequently, hard Cr plating was deposited to a thickness of about 110 l1 to form a plurality of recording electrodes 5 as current-carrying electrodes. The hardness of the recording electrode 5 was H,930.
なお、通電用電極となる下層めっき４としては、無電解
Ｃｕめっきの他、Ｎ１−Ｐ、 Ｎｉ −Ｂ、 Ｎｉ −
Ｗ−Ｐ、 Ｃｏ−Ｐ、 Ｃｏ−Ｂ、 Ｃｏ −Ｗ
−Ｐ等の無電解合金めっき、更にはそれらにＡＲｚＯ３
、Ｃｒ５Ｃｚ 、Ｃｒｚ０５ 、ＷＣ，ＢＮ、Ｓ ｉ
Ｃ。In addition, as the lower layer plating 4 that becomes the current-carrying electrode, in addition to electroless Cu plating, N1-P, Ni -B, Ni -
W-P, Co-P, Co-B, Co-W
- Electroless alloy plating such as P, and furthermore, ARzO3
, Cr5Cz, Crz05, WC, BN, S i
C.
５ｉｆｆＮ４等の硬質粒子を分散させた複合めっき等を
用いることもできる。また、めっきに換えてスバフター
、蒸着法、イオンブレーティング等を用いることもでき
る。また、無電解めっき等に換えて、Ｃｕ箔又はＮｉ箔
等の通電性のある箔を基板２に接着してもよく、例えば
銅張りプリント基板等を用いることもできる。Composite plating in which hard particles such as 5iffN4 are dispersed may also be used. Moreover, instead of plating, a buffeter, vapor deposition method, ion blating, etc. can also be used. Further, instead of electroless plating or the like, a conductive foil such as Cu foil or Ni foil may be bonded to the substrate 2, and for example, a copper-clad printed circuit board or the like may be used.
以上の実施例により作製した記録へノド１は、従来の通
電転写型記録ヘッドにみられた記録電極の後退、リボン
カスの付着堆積による短絡等を生しることがないため、
耐久性が著しく向上して、通電特性゛は良好に維持され
る。更に、従来のスクリーン印刷法によるメタライズ法
では記録電極のピッチ３００／Ｊｍ、幅１００μｍ（３
本／ ｍ ｍ ）がほぼ限界であったのに対し、記録電
極１６本／ｍｍの微細化が可能となった。これらによる
記録ヘッド１は通電特性も良好で、従来品に比べて印字
画質が著しく向上した。The recording nozzle 1 manufactured in accordance with the above embodiments does not suffer from the retraction of recording electrodes or short circuits due to adhesion and accumulation of ribbon debris, which were observed in conventional current transfer type recording heads.
Durability is significantly improved and current conduction characteristics are maintained well. Furthermore, in the conventional metallization method using screen printing, the recording electrode pitch is 300/Jm and the width is 100 μm (3
Although the recording electrodes/mm) was almost the limit, it has become possible to miniaturize the recording electrodes to 16/mm. The recording head 1 made of these had good current conduction characteristics, and the quality of printed images was significantly improved compared to conventional products.
この記録へノド１は、第２図に示すように、その記録電
極５の端面６を熱溶融性インクを備えた熱転写リボン７
の一面に接触させ、記録電極５に選択的に通電すること
によりリボン７の導電抵抗層に部分的に電流を流し、こ
の部分にジュール熱を発生させて、その部分のリボン７
のインクを溶融させ、リボン７の記録電極５と反対側の
面に密着している記録紙８に転写するものである。９は
記録紙８の搬送ロールである。As shown in FIG. 2, this recording gutter 1 connects the end surface 6 of the recording electrode 5 to a thermal transfer ribbon 7 containing heat-melting ink.
By contacting one surface of the ribbon 7 and selectively energizing the recording electrode 5, a current is applied to a part of the conductive resistance layer of the ribbon 7, generating Joule heat in this part, and the ribbon 7 in that part is heated.
The ink is melted and transferred onto the recording paper 8 that is in close contact with the surface of the ribbon 7 opposite to the recording electrode 5. 9 is a transport roll for the recording paper 8.
以上説明したように本発明によれば、導電抵抗層に通電
するための複数の記録電極を設けたヘッド基板の記録電
極間に凹溝を形成したことにより、記録電極の側面にリ
ボンカスが付着堆積せず、記録電極間の短絡を防止でき
る。またヘッド基板材料として記録電極の硬さと同等も
しくはそれより低いセラミックを用いることにより、記
録電極がヘッド基板と同等もしくはそれ以上の耐摩耗性
を備えるため、記！３電極の後退を防止できる。また記
録電極をめっきで形成することにより、記録ヘッドの基
板上に形成する複数の記録電極の微細化、緻密化が可能
となる。As explained above, according to the present invention, by forming grooves between the recording electrodes of the head substrate provided with a plurality of recording electrodes for supplying current to the conductive resistance layer, ribbon debris adheres and accumulates on the side surfaces of the recording electrodes. This prevents short circuits between recording electrodes. In addition, by using ceramic as the head substrate material, which has a hardness equal to or lower than that of the recording electrode, the recording electrode has wear resistance equal to or higher than that of the head substrate. It is possible to prevent the three electrodes from retreating. Furthermore, by forming the recording electrodes by plating, it is possible to make the plurality of recording electrodes formed on the substrate of the recording head finer and denser.
第１図は本発明の一実施例を示し、記録ヘッド端部の一
部を示す斜視図、第２図は通電転写型記録装置の一部を
示す説明図、第３図は従来例を示し、記録へノド端部の
一部を示す斜視図である。
ｌは記録ヘッド、２はヘッド基板、３は凹溝、４は下層
めっき、５は記録電極、６は端面、７はリボン、８は記
録紙。FIG. 1 shows an embodiment of the present invention, a perspective view showing a part of the end of a recording head, FIG. 2 an explanatory diagram showing a part of an electric transfer type recording device, and FIG. 3 shows a conventional example. FIG. 2 is a perspective view showing a part of the recording gutter end. 1 is a recording head, 2 is a head substrate, 3 is a groove, 4 is a lower layer plating, 5 is a recording electrode, 6 is an end surface, 7 is a ribbon, and 8 is recording paper.
Claims (3)
電抵抗層に通電し、この通電部にジュール熱を発生させ
インクを溶融して記録紙に転写する通電転写型記録装置
の記録ヘッドにおいて、前記導電抵抗層に通電するため
の複数の記録電極を設けたヘッド基板の記録電極間に凹
溝を形成したことを特徴とする通電転写型記録ヘッド。(1) A recording head of a current transfer type recording device that applies electricity to the conductive resistance layer of a ribbon that includes heat-melting ink and a conductive resistance layer, and generates Joule heat in this current-carrying section to melt the ink and transfer it to recording paper. An electric transfer type recording head characterized in that a groove is formed between recording electrodes of a head substrate provided with a plurality of recording electrodes for supplying current to the conductive resistance layer.
もしくはそれより低いセラミックを用いたことを特徴と
する請求項１記載の通電転写型記録ヘッド。(2) The current transfer type recording head according to claim 1, wherein a ceramic material having a hardness equal to or lower than that of the recording electrode is used as the head substrate material.
る請求項１又は２記載の通電転写型記録ヘッド。(3) The current transfer type recording head according to claim 1 or 2, wherein the recording electrode is formed by plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10525688A JPH01275063A (en) | 1988-04-27 | 1988-04-27 | Energization transfer-type recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10525688A JPH01275063A (en) | 1988-04-27 | 1988-04-27 | Energization transfer-type recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01275063A true JPH01275063A (en) | 1989-11-02 |
Family
ID=14402572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10525688A Pending JPH01275063A (en) | 1988-04-27 | 1988-04-27 | Energization transfer-type recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01275063A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208269A (en) * | 1981-06-19 | 1982-12-21 | Ricoh Co Ltd | Recorder |
| JPS60214971A (en) * | 1984-03-23 | 1985-10-28 | Seiko Epson Corp | Printer |
| JPS63262251A (en) * | 1987-04-20 | 1988-10-28 | Sharp Corp | Current conduction type transfer recording head |
| JPS6420159A (en) * | 1987-07-16 | 1989-01-24 | Fuji Xerox Co Ltd | Printing recording head |
| JPH01148566A (en) * | 1987-12-04 | 1989-06-09 | Fuji Xerox Co Ltd | Printing head |
-
1988
- 1988-04-27 JP JP10525688A patent/JPH01275063A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57208269A (en) * | 1981-06-19 | 1982-12-21 | Ricoh Co Ltd | Recorder |
| JPS60214971A (en) * | 1984-03-23 | 1985-10-28 | Seiko Epson Corp | Printer |
| JPS63262251A (en) * | 1987-04-20 | 1988-10-28 | Sharp Corp | Current conduction type transfer recording head |
| JPS6420159A (en) * | 1987-07-16 | 1989-01-24 | Fuji Xerox Co Ltd | Printing recording head |
| JPH01148566A (en) * | 1987-12-04 | 1989-06-09 | Fuji Xerox Co Ltd | Printing head |
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