JPS63209851A - Energization transfer recording head - Google Patents
Energization transfer recording headInfo
- Publication number
- JPS63209851A JPS63209851A JP4369587A JP4369587A JPS63209851A JP S63209851 A JPS63209851 A JP S63209851A JP 4369587 A JP4369587 A JP 4369587A JP 4369587 A JP4369587 A JP 4369587A JP S63209851 A JPS63209851 A JP S63209851A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- plating
- recording
- recording head
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000001050 lubricating effect Effects 0.000 claims abstract description 4
- -1 ferrous metals Chemical class 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229910052742 iron Inorganic materials 0.000 claims abstract 2
- 239000002131 composite material Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 3
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 229910020674 Co—B Inorganic materials 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 101100069231 Caenorhabditis elegans gkow-1 gene Proteins 0.000 claims 1
- 229910018104 Ni-P Inorganic materials 0.000 claims 1
- 229910018536 Ni—P Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 3
- 229910052721 tungsten Inorganic materials 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052961 molybdenite Inorganic materials 0.000 abstract 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 abstract 1
- 229910052702 rhenium Inorganic materials 0.000 abstract 1
- 229910003470 tongbaite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020515 Co—W Inorganic materials 0.000 description 1
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリンタ等の記録装置の記録ヘッドに関し、
詳しくは通電発熱型の熱転写リボンを使用する通電転写
型記録装置の記録ヘッドに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a recording head of a recording device such as a printer,
More specifically, the present invention relates to a recording head of an electrical transfer type recording device that uses an electrically heated thermal transfer ribbon.
通電転写型記録装置の熱転写リボンに通電する記録ヘッ
ドは、特開昭６０−２１４９７２号公報に示されるよう
に、スクリーン印刷法により、セラミック基板上にタン
グステン、モリブデン、又はタングステンとモリブデン
の混合物等のメタライズ層を形成した後、フォトエツチ
ングにより複数の記録電極を形成する。As shown in Japanese Unexamined Patent Application Publication No. 60-214972, the recording head of the current transfer type recording device, which supplies electricity to the thermal transfer ribbon, prints tungsten, molybdenum, or a mixture of tungsten and molybdenum, etc. on a ceramic substrate using a screen printing method. After forming the metallized layer, a plurality of recording electrodes are formed by photoetching.
しかしながら、このものはメタライズ層中に焼成時に基
板より侵入するガラス質が多く、フォトエツチングによ
る記録電極の微細化に限界があり、またこのガラス部分
の混在により通電特性が悪く、印字画質の低下を招く、
また、基板のセラミック材料の中にはメタライズが困難
なものが多（、基板材料が限定されるという欠点がある
。また、ガラス質の混在により記録電極の緻密性が低く
、耐久性に乏しい。However, with this method, there is a lot of glass that enters the metallized layer from the substrate during firing, which limits the miniaturization of recording electrodes by photoetching.Additionally, the mixture of glass parts has poor current conduction characteristics, resulting in a decrease in printed image quality. invite,
In addition, many of the ceramic materials for the substrate are difficult to metallize (there is a drawback that the substrate material is limited. Also, due to the presence of glass, the density of the recording electrode is low, resulting in poor durability).
本発明は上記点に鑑みてなされたもので、記録電極の微
細化を実現でき、通電特性も良好に維持でき、耐久性も
優れた通電転写型の記録ヘッドを提供することを目的と
する。The present invention has been made in view of the above points, and an object of the present invention is to provide a current transfer type recording head that can realize finer recording electrodes, maintain good current conduction characteristics, and has excellent durability.
上記目的を達成するための本発明の構成は、熱溶融性イ
ンクと導電抵抗層を備えたリボンの導電抵抗層に通電し
、この通電部にジュール熱を発生させインクを溶融して
記録紙に転写する通電転写型記録装置の記録ヘッドにお
いて、前記導電抵抗層に通電するための記録電極をＦｅ
、Ｃｏ、Ｎｉ等の鉄族金属とＭ ｏ 、Ｗ ＋ Ｒｅ
等の高融点金属とからなる合金に粒子を分散させた複合
合金めっきで形成したことを特徴とする。前記複合合金
めっきの分散粒子としてはＡｊ！ｇｏｓ 、Ｃｒ５Ｃｚ
。The configuration of the present invention for achieving the above object is to apply electricity to a conductive resistance layer of a ribbon provided with heat-melting ink and a conductive resistance layer, and generate Joule heat in this current-carrying portion to melt the ink and transfer it to recording paper. In the recording head of the current transfer type recording device, the recording electrode for supplying current to the conductive resistance layer is made of Fe.
, Co, Ni and other iron group metals and M o , W + Re
It is characterized by being formed by composite alloy plating in which particles are dispersed in an alloy consisting of a high melting point metal such as. As the dispersed particles of the composite alloy plating, Aj! gos, Cr5Cz
.
Ｃｒｇｏｓ 、ＷＣ，Ｓ ｉ Ｃ，Ｓ ｉ３Ｎ４等の硬
質粒子又は／及びＢＮ、Ｍｏ３！等の潤滑性粒子が用い
られる。Hard particles such as Crgos, WC, S i C, S i3N4 or/and BN, Mo3! Lubricating particles such as
ヘッド基板上に形成した負電極用下地層の記録電極パタ
ーン上に所定の複合合金めっきを施して記録電極を形成
するので、微細化を実現でき、かつ緻密であるから通電
特性も良好なものができる。Since the recording electrode is formed by plating a specified composite alloy on the recording electrode pattern of the negative electrode base layer formed on the head substrate, miniaturization can be achieved, and since it is dense, it has good current conduction characteristics. can.
更に、複合合金めっきは、時効処理により硬度の調節が
可能（最高硬さＨｖｌ ３００程度）であるため、基板
材質に合わせた硬度（耐摩耗性）を選択でき、基板と記
録電極の摩耗段差を生じることがなくなり、通電特性が
良好に維持される。Furthermore, the hardness of composite alloy plating can be adjusted through aging treatment (maximum hardness of around 300 Hvl), so the hardness (wear resistance) can be selected according to the substrate material, reducing the level of wear between the substrate and recording electrode. This does not occur, and the current conduction characteristics are maintained satisfactorily.
そして、硬質粒子を分散させた複合合金めっきによれば
耐摩耗性を合金めっきよりも更に向上させることができ
、また潤滑性粒子を分散させれば摩耗が減る。Composite alloy plating in which hard particles are dispersed can further improve wear resistance than alloy plating, and dispersion of lubricating particles reduces wear.
ヘッド基板２の材料はＡ１．Ｏ，とＭｇＯを主成分とす
るセラミック（通称スピネル）を用い、負電極用となる
下層めっきとして、無電解Ｃｏ−Ｗ−Ｐめっきを基板２
上に厚さ２μｍ施した後、基板２上に環化ゴム系フォト
レジストを３μｍの厚さで塗布した。次にフォトレジス
トを露光し、記録電極のネガパターンを作成した。そし
て、無電解Ｃｏ−Ｗ−Ｐめっきをエツチングし記録電極
パターンを形成した。次に、５ｉ３Ｎａ粒子（粒子の大
きさは２μｍ以下）を複合させた電解Ｇｏ−Ｗ複合合金
めっきを無電解Ｃｏ−Ｗ−Ｐめっきパターン３上に３０
μｍの厚さで析出させ記録電極４を形成した。このとき
のめっき条件は、浴組成が硫酸コバルト０．０３モル／
１、酒石酸アンモニウム０．２６モル／ｌ、タングステ
ン酸ナトリウム０．２３モル／！で、ＰＨ７〜９、浴温
７０℃、電流密度１〜３０ Ａ／ ｄ ｍ”である。The material of the head substrate 2 is A1. Using ceramic (commonly known as spinel) whose main components are O, and MgO, electroless Co-W-P plating is applied to the substrate 2 as the lower layer plating for the negative electrode.
After applying a cyclized rubber photoresist to a thickness of 2 μm on the substrate 2, a cyclized rubber photoresist was applied to a thickness of 3 μm. The photoresist was then exposed to light to create a negative pattern for the recording electrode. Then, the electroless Co-W-P plating was etched to form a recording electrode pattern. Next, electrolytic Go-W composite alloy plating containing 5i3Na particles (particle size is 2 μm or less) was applied to the electroless Co-W-P plating pattern 3 for 30 minutes.
The recording electrode 4 was formed by depositing it to a thickness of μm. The plating conditions at this time were such that the bath composition was 0.03 mol of cobalt sulfate/
1. Ammonium tartrate 0.26 mol/l, sodium tungstate 0.23 mol/l! The pH was 7 to 9, the bath temperature was 70°C, and the current density was 1 to 30 A/dm''.
そして更に、記録電極４の先端部のうちリボンと接触す
る端面５以外の部分をプラズマ溶射法により、基板２と
同材質のセラミック（通称スピネル） ６で溶射被覆し
た。これにより、記録電極４間の隙間がセラミック６で
充填され、リボンとの摺動により生じたリボンのカーボ
ン等が記録電極４間に堆積することがなくなり、通電特
性が良好に維持される。また、記録電極４がセラミック
６で被覆されて記録電極４とヘッド基板２との密着性が
良好となり、記録電極４の剥離等を生じることがなくな
り、耐久性に優れる。なお、上記セラミック６は、記録
電極４の少なくとも先端部をリボンとの接触端面を除い
て被覆すればよい。Furthermore, a portion of the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon was coated with ceramic (commonly known as spinel) 6 made of the same material as the substrate 2 by plasma spraying. As a result, the gap between the recording electrodes 4 is filled with the ceramic 6, and carbon of the ribbon generated by sliding with the ribbon is prevented from being deposited between the recording electrodes 4, so that good current conduction characteristics are maintained. Furthermore, since the recording electrode 4 is coated with the ceramic 6, the adhesion between the recording electrode 4 and the head substrate 2 is good, and peeling of the recording electrode 4 does not occur, resulting in excellent durability. Note that the ceramic 6 may cover at least the tip of the recording electrode 4 except for the end surface in contact with the ribbon.
そして更に、Ｃｏ−Ｗ複合合金めっきの時効温度と硬度
の関係から、３５０℃でＩＨｒ時効処理を施し、ヘッド
基板２と同−硬さのＨｖ８５０を得た。Further, based on the relationship between aging temperature and hardness of Co-W composite alloy plating, IHr aging treatment was performed at 350°C to obtain Hv850, which is the same hardness as the head substrate 2.
なお、ヘッド基板２の材料としてはＡｌｚＯｓ。Note that the material of the head substrate 2 is AlzOs.
ＳｉＯ，、又はＭｇＯの単体、若しくはこれらの混合物
等、あるいは上記セラミックの他、ポリイミド、エポキ
シ、ポリアミド、フェノール等の耐熱性を存する樹脂等
が適当である。Suitable materials include SiO, MgO alone, or a mixture thereof, or in addition to the above-mentioned ceramics, heat-resistant resins such as polyimide, epoxy, polyamide, and phenol.
また、記録電極４の被覆材としては、上記セラミックの
他、絶縁性を有する他の物質例えばポリイミド、エポキ
シ、ポリアミド、フェノール等の耐熱性を有する樹脂等
が適当である。In addition to the ceramic described above, other insulating materials such as heat-resistant resins such as polyimide, epoxy, polyamide, and phenol are suitable as the covering material for the recording electrode 4.
また、負電極用となる下層めっき３はＣｏ −Ｗ−Ｐめ
っきに限らず、その他無電解Ｃｕめっき又はＮ１−Ｐ、
Ｎｉ −Ｂ、 Ｎｉ −Ｗ−Ｐ、 Ｃｏ−Ｐ。In addition, the lower layer plating 3 for the negative electrode is not limited to Co-W-P plating, but also electroless Cu plating or N1-P,
Ni-B, Ni-W-P, Co-P.
Ｃｏ−Ｂ等の無電解合金めっき、更には耐摩耗性を付与
するためにそれらに” ｚｏｓ ＋ Ｃｒ ３Ｃ２。Electroless alloy plating such as Co-B, and even ``ZOS + Cr 3C2'' to them to impart wear resistance.
Ｃｒ ｚ Ｏｘ ＋ Ｗ Ｃ＋ Ｂ Ｎ ＋ Ｓ
ｉＣ、Ｓ Ｉ ３ Ｎ ４等の硬質粒子を分散させた複
合めっき等を用いることができる。Cr z Ox + W C+ B N + S
Composite plating in which hard particles such as iC and S I 3 N 4 are dispersed can be used.
また、無電解めっきに換えて、Ｃｕ箔又はＮｉ箔等の通
電性のある箔を基板２に接着してもよく、例えば銅張り
プリント基板等を用いることもできる。Further, instead of electroless plating, a conductive foil such as a Cu foil or a Ni foil may be adhered to the substrate 2, and for example, a copper-clad printed circuit board or the like may be used.
また、記録電極４の先端部のうちリボンと接触する端面
５以外の部分の絶縁性物質の被覆方法として、セラミッ
ク被覆方法としては、上記溶射法の他、真空蒸着法、ス
パッター法等でもよく、また樹脂被覆方法としてはフィ
ルムの接着、又は浸漬法、スプレー法による接着剤樹脂
の塗布等が好ましい。Further, as a method of coating the insulating material on the tip of the recording electrode 4 other than the end surface 5 that contacts the ribbon, the ceramic coating method may be a vacuum evaporation method, a sputtering method, etc. in addition to the above-mentioned thermal spraying method. Preferable resin coating methods include film adhesion, dipping, spraying, and the like.
以上の実施例により作製した記録ヘッド１は、従来のス
クリーン印刷法によるメタライズ法では記録電極のピッ
チ３００μｍ、幅１００μｍ（３本、／ｆｌ）がほぼ限
界であったのに対し、記！３電極１６本／ｆｌの微細化
が可能となり、通電特性も良好で、従来品に比べて印字
画質が著しく向上し、記録電極の剥離等を生じることが
ない。The recording head 1 manufactured according to the above embodiment has the following advantages, whereas the pitch of recording electrodes is 300 μm and the width is 100 μm (3 electrodes, /fl), which is almost the limit in the conventional metallization method using screen printing method. It is possible to miniaturize the three electrodes to 16/fl, the current conduction properties are good, the print quality is significantly improved compared to conventional products, and there is no occurrence of peeling of the recording electrodes.
この記録へラド１は、第４図に示すように、その記録電
極４の端面５を熱溶融性インクを備えた熱転写リボン７
の一面に接触させ、記録電極４に選択的に通電すること
によりリボン７の導電抵抗層に部分的に電流を流し、こ
の部分にジュール熱を発生させて、その部分のリボン７
のインクを溶融させ、リボン７の記録電極４と反対側の
面に密着している記録紙８に転写するものである。９は
記録紙８の搬送ロールである。As shown in FIG. 4, this recording electrode 1 has an end surface 5 of its recording electrode 4 connected to a thermal transfer ribbon 7 containing heat-melting ink.
By contacting one surface of the ribbon 7 and selectively energizing the recording electrode 4, a current is applied to a portion of the conductive resistance layer of the ribbon 7, generating Joule heat in this portion.
The ink is melted and transferred onto the recording paper 8 that is in close contact with the surface of the ribbon 7 opposite to the recording electrode 4. 9 is a transport roll for the recording paper 8.
以上説明したように本発明によれば、記録ヘッドの基板
上に形成する複数の記録電極の微細化が可能となり、通
電特性も良好で、高画質の記録が可能となり、また通電
特性も良好に維持でき、記録電極の剥離も生ぜず、耐久
性も優れるものである。As explained above, according to the present invention, it is possible to miniaturize the plurality of recording electrodes formed on the substrate of the recording head, and the current conduction characteristics are good, making it possible to record high image quality, and the current conduction characteristics are also good. It can be maintained, the recording electrode does not peel off, and the durability is excellent.
図面は本発明の一実施例を示し、第１図は絶縁性物質被
覆前の記録ヘッド端部の一部を示す斜視図、第２図は絶
縁性物質被覆後の記録ヘッド端部の一部を示す正面図、
第３図は同側断面図、第４図は通電転写型記録装置の一
部を示す説明図である。
１は記録ヘッド、２はヘッド基板、３は下地層、４は記
録電極、５は端面、６は絶縁性物質被覆、７はリボン、
８は記録紙。The drawings show an embodiment of the present invention; FIG. 1 is a perspective view showing a part of the end of the recording head before being coated with an insulating material, and FIG. 2 is a perspective view showing a part of the end of the recording head after being coated with an insulating material. A front view showing
FIG. 3 is a sectional view of the same side, and FIG. 4 is an explanatory diagram showing a part of the current transfer type recording apparatus. 1 is a recording head, 2 is a head substrate, 3 is a base layer, 4 is a recording electrode, 5 is an end face, 6 is an insulating material coating, 7 is a ribbon,
8 is recording paper.
Claims (7)
電抵抗層に通電し、この通電部にジュール熱を発生させ
インクを溶融して記録紙に転写する通電転写型記録装置
の記録ヘッドにおいて、前記導電抵抗層に通電するため
の記録電極をＦｅ、Ｃｏ、Ｎｉ等の鉄族金属とＭｏ、Ｗ
、Ｒｅ等の高融点金属とからなる合金に粒子を分散させ
た複合合金めっきで形成したことを特徴とする通電転写
型記録ヘッド。(1) A recording head of a current transfer type recording device that applies electricity to the conductive resistance layer of a ribbon that includes heat-melting ink and a conductive resistance layer, and generates Joule heat in this current-carrying section to melt the ink and transfer it to recording paper. The recording electrode for supplying current to the conductive resistance layer is made of iron group metals such as Fe, Co, and Ni, and Mo, W.
, a high melting point metal such as Re, etc., and formed by composite alloy plating in which particles are dispersed.
なることを特徴とする特許請求の範囲第１項記載の通電
転写型記録ヘッド。(2) The current transfer type recording head according to claim 1, wherein the head substrate is made of ceramic or heat-resistant resin.
、Ｃｒ＿３Ｃ＿２、Ｃｒ＿２Ｏ＿３、ＷＣ、ＳｉＣ、Ｓ
ｉ＿３Ｎ＿４等の硬質粒子又は／及びＢＮ、ＭｏＳ＿２
等の潤滑性粒子であることを特徴とする特許請求の範囲
第１項記載の通電転写型記録ヘッド。(3) The dispersed particles of the composite alloy plating are Al_2O_3
, Cr_3C_2, Cr_2O_3, WC, SiC, S
Hard particles such as i_3N_4 or/and BN, MoS_2
An electrically conductive transfer type recording head according to claim 1, characterized in that the particles are lubricating particles such as.
解Ｃｕめっき又はＮｉ−Ｐ、Ｎｉ−Ｂ、Ｎｉ−Ｗ−Ｐ、
Ｃｏ−Ｐ、Ｃｏ−Ｂ、Ｃｏ−Ｗ−Ｐ等の無電解合金めっ
き若しくはそれらに硬質粒子を分散させた複合めっきを
ヘッド基板に施してなることを特徴とする特許請求の範
囲第１項記載の通電転写型記録ヘッド。(4) Electroless Cu plating or Ni-P, Ni-B, Ni-W-P, as the base layer for the negative electrode of the composite alloy plating,
Claim 1, characterized in that the head substrate is coated with electroless alloy plating such as Co-P, Co-B, Co-W-P, or a composite plating in which hard particles are dispersed therein. Electric transfer type recording head.
子がＡｌ＿２Ｏ＿３、Ｃｒ＿３Ｃ＿２、Ｃｒ＿２Ｏ＿３
、ＷＣ、ＢＮ、ＳｉＣ、Ｓｉ＿３Ｎ＿４等であることを
特徴とする特許請求の範囲第４項記載の通電転写型記録
ヘッド。(5) The hard particles dispersed in the composite plating as the base layer are Al_2O_3, Cr_3C_2, Cr_2O_3
, WC, BN, SiC, Si_3N_4, etc., as claimed in claim 4.
箔又はＮｉ箔等の通電性のある箔をヘッド基板に接着し
てなることを特徴とする特許請求の範囲第１項記載の通
電転写型記録ヘッド。(6) Cu as the base layer for the negative electrode of the composite alloy plating
2. The current transfer type recording head according to claim 1, wherein a conductive foil such as foil or Ni foil is bonded to the head substrate.
の接触端面を除いてセラミック又は樹脂等の絶縁性物質
で被覆したことを特徴とする特許請求の範囲第１項記載
の通電転写型記録ヘッド。(7) An electrical transfer type recording head according to claim 1, characterized in that at least the tip end of the recording electrode is coated with an insulating material such as ceramic or resin, except for the end surface in contact with the ribbon. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369587A JPS63209851A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369587A JPS63209851A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63209851A true JPS63209851A (en) | 1988-08-31 |
Family
ID=12670963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4369587A Pending JPS63209851A (en) | 1987-02-26 | 1987-02-26 | Energization transfer recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63209851A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199669A (en) * | 1984-03-23 | 1985-10-09 | Seiko Epson Corp | Printing device |
| JPS60214972A (en) * | 1984-03-23 | 1985-10-28 | Seiko Epson Corp | Printer |
-
1987
- 1987-02-26 JP JP4369587A patent/JPS63209851A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199669A (en) * | 1984-03-23 | 1985-10-09 | Seiko Epson Corp | Printing device |
| JPS60214972A (en) * | 1984-03-23 | 1985-10-28 | Seiko Epson Corp | Printer |
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