JPS63206490A - Production of high-purity copper - Google Patents
Production of high-purity copperInfo
- Publication number
- JPS63206490A JPS63206490A JP61239794A JP23979486A JPS63206490A JP S63206490 A JPS63206490 A JP S63206490A JP 61239794 A JP61239794 A JP 61239794A JP 23979486 A JP23979486 A JP 23979486A JP S63206490 A JPS63206490 A JP S63206490A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic
- bath
- electrolytic cell
- main
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000010949 copper Substances 0.000 title claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007670 refining Methods 0.000 claims abstract description 21
- 239000008151 electrolyte solution Substances 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 8
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 4
- 239000010935 stainless steel Substances 0.000 abstract description 4
- 238000005192 partition Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電解精製法による高純度銅の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for producing high-purity copper by electrolytic refining.
（従来の技術とその問題点）
従来、高純度の銅を￥Ｊ造する方法としては、電解精製
法或いはゾーン精製法を何回かくり返して行う方法又は
両者を併用する方法等がとられている。(Conventional technology and its problems) Conventionally, methods for producing high-purity copper include repeating electrolytic refining or zone refining several times, or a combination of both. There is.
しかしながら、これらの方法では一定の純度（残留抵抗
比１０００程度）の銅しか製造することができなかった
。However, these methods could only produce copper of a certain purity (residual resistance ratio of about 1000).
これは、陽極側の銅板に含有されている微りの不純物を
除去することができないためであった。そのため例えば
、近年金の代替として半導体装置の結線に使用されてい
るボンディング用銅線は、ボンディングワイヤーに供せ
る程度の純度に高めることができず、アルミや金線より
も硬いため結線の際に半導体素子に割れ等のボンディン
グダメージをあたえる欠点があった。This was because it was not possible to remove minute impurities contained in the copper plate on the anode side. For example, copper wire for bonding, which has recently been used as a substitute for gold to connect semiconductor devices, cannot be made to a purity level that can be used as bonding wire, and because it is harder than aluminum or gold wire, This method has the drawback of causing bonding damage such as cracking to the semiconductor element.
（発明が解決しようとする技術的課題）以上の問題を解
決しようとする本発明の技術的課題は、銅に含有される
微ｍ不純物の除去を可能とするこにより高純度の銅の精
製をすることである。(Technical problem to be solved by the invention) The technical problem to be solved by the present invention is to purify high-purity copper by making it possible to remove minute impurities contained in copper. It is to be.
（技術的課題を達成するための技術的手段）以上の技術
的課題を達成するための本発明の第１の技術的手段は電
解精製法による高純度銅の製造方法において、電解槽を
主電解槽と副電解槽とにより形成し、該副電解槽内の電
流密度を主電解槽の電流密度の１倍より大きく５倍以下
にすると共に、これらの電解液を主電解槽から副電解槽
へ循環させながら電解精製を行うことであり、第２の技
術的課題は電解精製法による高純度銅の製造方法におい
て、電解槽を主電解槽と副電解槽とにより形成し、該副
電解槽内の電流密度を主電解槽の電流密度の１倍より大
きく５倍以下にすると共に、これら電解液を主電解槽か
ら副電解層へ循環させながら電解精製を行って高純度の
銅を得、該銅にゾーン精製を行って高純度銅を製造する
ことであり、副電解槽の電流密度が主電解槽の電流密度
の１倍以下である場合は効果がなく、５倍より大きくな
ると不純物の溶出が多くなりすぎるため逆効果となる。(Technical Means for Achieving the Technical Problem) The first technical means of the present invention for achieving the above-mentioned technical problem is to use an electrolytic cell as the main electrolytic The electrolyte is formed by a cell and a sub-electrolytic cell, and the current density in the sub-electrolytic cell is set to be more than 1 times and 5 times or less than the current density of the main electrolytic cell, and these electrolytes are transferred from the main electrolytic cell to the sub-electrolytic cell. The second technical problem is to perform electrolytic refining while circulating.The second technical problem is that in a method for producing high-purity copper by electrolytic refining, an electrolytic cell is formed of a main electrolytic cell and a sub-electrolytic cell, and a The current density of the main electrolytic cell is set to more than 1 times and 5 times or less of the current density of the main electrolytic cell, and the electrolytic solution is circulated from the main electrolytic cell to the sub-electrolytic layer while performing electrolytic refining to obtain high-purity copper. The process involves zone refining copper to produce high-purity copper. If the current density in the sub-electrolyzer is less than 1 times the current density in the main electrolyzer, it is ineffective, and if it is more than 5 times, impurities will be leached. If there are too many, it will have the opposite effect.
Ｄｉ！明の効果）
本発明は以上の様な方法にしたことにより、電解精製法
による高純度銅の製造方法において、微量の不純物を除
去することができたので、高純度銅の純度をボンディン
グワイヤーとして使用しうる程度の純度にまで高めるこ
とができた。Di! (Effects of Light) By using the method described above, the present invention has been able to remove trace amounts of impurities in the method for producing high-purity copper by electrolytic refining. It was possible to improve the purity to a usable level.
（実施例） 以下、本発明の一実施例を図面に基づいて説明する。(Example) Hereinafter, one embodiment of the present invention will be described based on the drawings.
図中（Ａ）は主電解槽（１）と予備電解槽（２）が隣接
して形成された電解槽であり、その底部にはポンプ（３
）を備える連結管（４）が配設されて両電解槽（１）（
２＞を連結すると共に、これら両電解槽（１）（２）を
区画する隔壁（ｄ）の上部には流入孔（５）が開穿され
ている。In the figure, (A) is an electrolytic cell in which a main electrolytic cell (1) and a preliminary electrolytic cell (2) are formed adjacent to each other, and a pump (3) is located at the bottom of the electrolytic cell.
) is arranged so that both electrolytic cells (1) (
An inflow hole (5) is formed in the upper part of the partition wall (d) that connects the electrolytic cells (1) and (2) and partitions the two electrolytic cells (1) and (2).
また、両電解槽（１）（２）の陽極の銅板（ｎ）（ｎ’
）は電解精製により一定の純度に精製されたものが使
用され、陰極の金属板（Ｓ）（Ｓ′）は電解液により溶
解されないステンレス板等が使用される。In addition, the copper plates (n) (n') of the anodes of both electrolytic cells (1) and (2)
) are used which have been purified to a certain purity by electrolytic refining, and the metal plates (S) and (S') of the cathode are made of stainless steel plates or the like which are not dissolved by the electrolytic solution.
而して、本発明の電解精製は主電解槽（１）の電流密度
が主電解ＭＩ（１）の１倍より大きく５倍以下、副電解
ｍ（２）の電流密度が５〜２５Ａ／ｄｌｌｌ’・で行な
われると共に、主電解槽（１）の電解液（ｍ）が連結管
（４）のポンプ（３）により副電解４ｆｆ（２）内へ強
制移送される一方、＆Ｉ１１電解槽（２）内の電解液（
ｍ′）が流入孔（５）から主電解槽（１）へ流入されて
、これら電解液（ｍ）（ｍ’ ）が循環しながら行なわ
れる。Therefore, in the electrolytic refining of the present invention, the current density of the main electrolytic cell (1) is greater than 1 times and less than 5 times that of the main electrolytic MI (1), and the current density of the sub-electrolytic m(2) is 5 to 25 A/dlll. At the same time, the electrolyte (m) in the main electrolytic cell (1) is forcibly transferred into the auxiliary electrolytic cell 4ff (2) by the pump (3) of the connecting pipe (4), while the &I11 electrolytic cell (2 ) in electrolyte (
The electrolytic solution (m') flows into the main electrolytic cell (1) from the inflow hole (5), and the electrolytic solutions (m) and (m') are circulated.
したがって主電解１（１）内の陽極の銅板（ｎ＞から電
解液（ｍ＞内に溶出された微ｍの不純物は、主電解槽（
１）より高い電流密度の副電解槽（２）の陰極のステン
レス板（Ｓ′）に付着される。Therefore, the minute impurities eluted from the anode copper plate (n> into the electrolyte (m>) in the main electrolytic tank (1) are
1) It is attached to the stainless steel plate (S') of the cathode of the sub-electrolytic cell (2) with higher current density.
依って、不純物の混入のないより純粋な電解液（ｍ゛）
が流入孔（５）から主電解槽（１）にもどされる。Therefore, a purer electrolyte (m゛) without contamination with impurities
is returned to the main electrolytic cell (1) through the inflow hole (5).
従って、主電解槽（１）における陽極の銅板（ｎ）から
溶出された銅は、はとんど不純物のない状態で陰極のス
テンレス板（Ｓ′）に付着してより純度の高い銅が精製
される。Therefore, the copper eluted from the copper plate (n) of the anode in the main electrolytic cell (1) adheres to the stainless steel plate (S') of the cathode in an almost impurity-free state, and the copper with higher purity is purified. be done.
そして、以上の精製法により￥＃製された銅を次の精製
段階における主電解槽（１）の陽極の銅板（ｎ）に使用
して電解精製を行ない、かつ以上の様な方法でこのＮ製
法を数回くり返すことにより、より純度の高い銅が精製
され、ざらにこの銅にゾーン精製を数回くり返すことに
よりより純度の高い銅を得ることができる。Then, the copper produced by the above refining method is used for the copper plate (n) of the anode of the main electrolytic cell (1) in the next refining step, and electrolytic refining is carried out. By repeating the manufacturing process several times, copper with higher purity is refined, and by repeating zone refining on this copper several times, copper with higher purity can be obtained.
次の表は本発明により製造された高純度銅の残留抵抗比
（ＲＲＲ）を測定したものである。The following table shows the measured residual resistance ratio (RRR) of high purity copper produced according to the present invention.
以上の様な結果から前記発明の効果を確認することがで
きた。From the above results, the effects of the invention could be confirmed.
【図面の簡単な説明】 図は本発明を実施するための電解槽の断面図である。 尚図中 （Ａ）：電解槽 （１）：１電Ｎ１ｆｌ （２）：副電解槽 を示す。[Brief explanation of the drawing] The figure is a sectional view of an electrolytic cell for implementing the present invention. Also in the diagram (A): Electrolytic cell (1): 1 electric N1 fl (2): Sub-electrolyzer shows.
Claims (1)
解槽を主電解槽と副電解槽とにより形成し、該副電解槽
内の電流密度を主電解槽の電流密度の１倍より大きく５
倍以下にすると共に、これらの電解液を主電解槽から副
電解槽へ循環させながら電解精製を行うことを特徴とす
る高純度銅の製造方法。 ２）電解精製法による高純度銅の製造方法において、電
解槽を主電解槽と副電解槽とにより形成し、該副電解槽
内の電流密度を主電解槽の電流密度の１倍より大きく５
倍以下にすると共に、これら電解液を主電解槽から副電
解槽へ循環させながら電解精製を行つて高純度の銅を得
、該銅にゾーン精製を行つて製造する高純度銅の製造方
法。[Claims] 1) In a method for producing high-purity copper by electrolytic refining, an electrolytic cell is formed of a main electrolytic cell and a sub-electrolytic cell, and the current density in the sub-electrolytic cell is set to the current density of the main electrolytic cell. greater than 1 times 5
A method for producing high-purity copper, which is characterized in that electrolytic refining is carried out while the electrolytic solution is circulated from a main electrolytic cell to a sub-electrolytic cell. 2) In a method for producing high-purity copper by electrolytic refining, an electrolytic cell is formed of a main electrolytic cell and a sub-electrolytic cell, and the current density in the sub-electrolytic cell is set to be greater than 1 times the current density of the main electrolytic cell.
A method for producing high-purity copper, in which the electrolytic solution is circulated from a main electrolytic cell to a sub-electrolytic cell while electrolytically refining to obtain high-purity copper, and the copper is subjected to zone refining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61239794A JPS63206490A (en) | 1986-10-07 | 1986-10-07 | Production of high-purity copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61239794A JPS63206490A (en) | 1986-10-07 | 1986-10-07 | Production of high-purity copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63206490A true JPS63206490A (en) | 1988-08-25 |
Family
ID=17049973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61239794A Pending JPS63206490A (en) | 1986-10-07 | 1986-10-07 | Production of high-purity copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63206490A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015054982A (en) * | 2013-09-11 | 2015-03-23 | アサヒプリテック株式会社 | ELECTROLYTIC PURIFICATION APPARATUS OF Ag AND ELECTROLYTIC PURIFICATION METHOD OF Ag USING THE SAME APPARATUS |
| JP2017155343A (en) * | 2017-06-15 | 2017-09-07 | アサヒプリテック株式会社 | Ag ELECTROLYTIC REFINING DEVICE |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52111818A (en) * | 1976-03-18 | 1977-09-19 | Sumitomo Metal Mining Co | Electrolytic decoppering method |
-
1986
- 1986-10-07 JP JP61239794A patent/JPS63206490A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52111818A (en) * | 1976-03-18 | 1977-09-19 | Sumitomo Metal Mining Co | Electrolytic decoppering method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015054982A (en) * | 2013-09-11 | 2015-03-23 | アサヒプリテック株式会社 | ELECTROLYTIC PURIFICATION APPARATUS OF Ag AND ELECTROLYTIC PURIFICATION METHOD OF Ag USING THE SAME APPARATUS |
| JP2017155343A (en) * | 2017-06-15 | 2017-09-07 | アサヒプリテック株式会社 | Ag ELECTROLYTIC REFINING DEVICE |
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