JPS6320447U - - Google Patents
Info
- Publication number
- JPS6320447U JPS6320447U JP11437686U JP11437686U JPS6320447U JP S6320447 U JPS6320447 U JP S6320447U JP 11437686 U JP11437686 U JP 11437686U JP 11437686 U JP11437686 U JP 11437686U JP S6320447 U JPS6320447 U JP S6320447U
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- circuit
- heat sink
- attaching
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図乃至第３図ａ，ｂはいずれもこの考案の
一実施例を示すもので、第１図は半導体回路装置
の横断面図、第２図は同じく縦断面図、第３図ａ
は絶縁板の平面図、第３図ｂは放熱板の平面図、
第４図はＡＣスイツチ回路の回路図、第５図はそ
の回路装置の断面図である。
１……絶縁板、２……厚膜回路パターン、３…
…半導体、４……回路素子、５……端子、６……
回路モジユール、７……放熱板、９……溝、１０
……枠体、１１……接着剤。
1 to 3, a and b, each show an embodiment of this invention, in which FIG. 1 is a cross-sectional view of a semiconductor circuit device, FIG. 2 is a vertical cross-sectional view, and FIG.
is a plan view of the insulating plate, FIG. 3b is a plan view of the heat sink,
FIG. 4 is a circuit diagram of the AC switch circuit, and FIG. 5 is a sectional view of the circuit device. 1... Insulating plate, 2... Thick film circuit pattern, 3...
...Semiconductor, 4...Circuit element, 5...Terminal, 6...
Circuit module, 7... Heat sink, 9... Groove, 10
...Frame, 11...Adhesive.
Claims (1)
に半導体３ならびに回路素子４と端子５とを接続
した回路モジユール６を取付ける放熱板７の一面
に前記モジユール部分をモールドするための枠体
１０を取付ける溝９を該溝の外側縁に接し、溝上
に絶縁板１の外周部分が張り出すように幅広に形
成し、該溝の空隙部分に枠体取付用の接着剤１１
を充填し、前記絶縁板上に取付けられた導体と放
熱板までの沿面距離を大きくしたことを特徴とす
る半導体回路装置。 Thick film circuit pattern 2 formed on one side of insulating plate 1
A groove 9 for attaching a frame 10 for molding the module part is attached to one side of the heat sink 7 on which a circuit module 6 connecting the semiconductor 3, circuit elements 4, and terminals 5 is attached. The outer periphery of the insulating plate 1 is formed wide so that it protrudes, and an adhesive 11 for attaching the frame is applied to the gap between the grooves.
1. A semiconductor circuit device, characterized in that the creepage distance between the conductor mounted on the insulating plate and the heat sink is increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437686U JPS6320447U (en) | 1986-07-25 | 1986-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11437686U JPS6320447U (en) | 1986-07-25 | 1986-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320447U true JPS6320447U (en) | 1988-02-10 |
Family
ID=30997059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11437686U Pending JPS6320447U (en) | 1986-07-25 | 1986-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320447U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58184743A (en) * | 1982-04-23 | 1983-10-28 | Hitachi Ltd | Molded semiconductor device |
-
1986
- 1986-07-25 JP JP11437686U patent/JPS6320447U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58184743A (en) * | 1982-04-23 | 1983-10-28 | Hitachi Ltd | Molded semiconductor device |