JPS6320133Y2 - - Google Patents

Info

Publication number
JPS6320133Y2
JPS6320133Y2 JP1981081158U JP8115881U JPS6320133Y2 JP S6320133 Y2 JPS6320133 Y2 JP S6320133Y2 JP 1981081158 U JP1981081158 U JP 1981081158U JP 8115881 U JP8115881 U JP 8115881U JP S6320133 Y2 JPS6320133 Y2 JP S6320133Y2
Authority
JP
Japan
Prior art keywords
light
emitting diode
resin
lamp
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981081158U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57193245U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981081158U priority Critical patent/JPS6320133Y2/ja
Publication of JPS57193245U publication Critical patent/JPS57193245U/ja
Application granted granted Critical
Publication of JPS6320133Y2 publication Critical patent/JPS6320133Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1981081158U 1981-06-01 1981-06-01 Expired JPS6320133Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981081158U JPS6320133Y2 (OSRAM) 1981-06-01 1981-06-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981081158U JPS6320133Y2 (OSRAM) 1981-06-01 1981-06-01

Publications (2)

Publication Number Publication Date
JPS57193245U JPS57193245U (OSRAM) 1982-12-07
JPS6320133Y2 true JPS6320133Y2 (OSRAM) 1988-06-03

Family

ID=29876685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981081158U Expired JPS6320133Y2 (OSRAM) 1981-06-01 1981-06-01

Country Status (1)

Country Link
JP (1) JPS6320133Y2 (OSRAM)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315267U (OSRAM) * 1976-07-20 1978-02-08
JPS548499A (en) * 1977-06-22 1979-01-22 Hitachi Shomei Kk Escape guide device

Also Published As

Publication number Publication date
JPS57193245U (OSRAM) 1982-12-07

Similar Documents

Publication Publication Date Title
US5266817A (en) Package structure of multi-chip light emitting diode
US4929866A (en) Light emitting diode lamp
CA2353326C (en) Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
CN112349825B (zh) 白色光源系统以及屋内照明装置
US9595645B2 (en) LED lens design with more uniform color-over-angle emission
US7777243B2 (en) Light emitting device
GB1308487A (en) Light emitting assemblies
US20110147778A1 (en) Light emitting device
JP4411732B2 (ja) 面状発光装置
CN211980635U (zh) 一种led器件和背光模组
JP3065544B2 (ja) 蛍光剤入りｌｅｄランプ
JPS6320133Y2 (OSRAM)
JPH03206672A (ja) 発光ダイオード素子およびその製造方法
TWI582345B (zh) 透鏡及使用該透鏡之光源模組
CN110085730A (zh) 发光器件封装结构、量子点led光源以及电子器件
JP6666873B2 (ja) 疑似白色系ｌｅｄ装置及びシリコーンキャップ
JP2002280615A (ja) 発光ダイオード
JP2002368283A (ja) 発光ダイオードランプ
That et al. Enhancing color quality of WLEDs with dual-layer remote phosphor geometry
JPH05206524A (ja) 光半導体用モールド樹脂
CN203215319U (zh) 一种提高光线均匀性的led灯
CN208764875U (zh) 用于洗墙的混光混色小角度透镜
CN105911753B (zh) 背光模组及显示装置
JP2016015523A (ja) 光半導体発光装置、照明器具、及び表示装置
CN222126574U (zh) 一种降低顶部出光的ncsp灯珠结构