JPS63197398A - Cooler - Google Patents
CoolerInfo
- Publication number
- JPS63197398A JPS63197398A JP3018887A JP3018887A JPS63197398A JP S63197398 A JPS63197398 A JP S63197398A JP 3018887 A JP3018887 A JP 3018887A JP 3018887 A JP3018887 A JP 3018887A JP S63197398 A JPS63197398 A JP S63197398A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling
- heat
- cooling water
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009834 vaporization Methods 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011148 porous material Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器の冷却装置に関し、特に気化熱の放散
を利用する強制空冷用ヒートシンクにおける冷却効果の
改善を図った電子機器の冷却装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a cooling device for electronic devices, and more particularly to a cooling device for electronic devices that improves the cooling effect of a forced air cooling heat sink that utilizes the dissipation of vaporization heat. .
従来、この種の冷却装置は第２図の従来の冷却装置の構
成を示す斜視図に示す如く、ヒートシンク１．海綿状多
孔物質２．下部タンク３．冷却水通２１４．冷却水タン
ク５．ファン６を備えて構成され冷却水タンク９に蓄え
られた冷却水は下部タンク３内の水が減った分だけ自動
的に下部タンク３内へ流動するしくみとなっている。下
部タンク３内の水は、この水に侵されたヒートシンク１
の表面に密着されている海綿状多孔物質２による毛細管
現象の為にヒートシンク１全体へ移動する。Conventionally, this type of cooling device has a heat sink 1, as shown in the perspective view of FIG. 2, which shows the configuration of a conventional cooling device. Spongy porous material 2. Lower tank 3. Cooling water passage 214. Cooling water tank5. Cooling water stored in a cooling water tank 9 equipped with a fan 6 is configured to automatically flow into the lower tank 3 in proportion to the amount of water in the lower tank 3 reduced. The water in the lower tank 3 is absorbed by the heat sink 1, which has been affected by this water.
The heat sink 1 moves throughout the heat sink 1 due to capillary action caused by the spongy porous material 2 that is in close contact with the surface of the heat sink 1 .
ヒートシンク１は、発熱体１００から伝わる熱により高
温になるがこの熱はヒートシンク１の表面から冷却空気
５０に伝わり空気中に放散される。The heat sink 1 becomes high in temperature due to the heat transmitted from the heating element 100, but this heat is transmitted from the surface of the heat sink 1 to the cooling air 50 and is dissipated into the air.
この際ヒートシンク表面の水分が同時に蒸発し、このと
き大屋の気化熱をヒートシンク１から奪うことにより、
このヒートシンク１の冷却効率は高いものとなる。At this time, the moisture on the surface of the heat sink evaporates at the same time, and at this time, the heat of vaporization of Oya is taken away from the heat sink 1.
The cooling efficiency of this heat sink 1 is high.
上述した従来のこの種の冷却装置は、水に濡れたヒート
シンク１の表面、に空気を吹き付けるので空気中の塵埃
がヒートシンクの表面の海綿状多孔物質２に付着し、そ
の結果、ヒートシンク１の表面の熱抵抗が増大し、冷却
効果も低下することが避けられないという欠点がある。The above-mentioned conventional cooling device of this kind blows air onto the surface of the heat sink 1 which is wet with water, so that dust in the air adheres to the spongy porous material 2 on the surface of the heat sink 1. As a result, the surface of the heat sink 1 The drawback is that the thermal resistance increases and the cooling effect inevitably decreases.
本発明の目的は上述した欠点を除去し、ヒートシンクの
表面に塵埃が付着することを防止して冷却効果の低下を
大幅に排除した冷却装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling device which eliminates the above-mentioned drawbacks, prevents dust from adhering to the surface of a heat sink, and substantially eliminates a decrease in cooling effectiveness.
本発明の装置は、ヒートシンクの表面から水分を強制空
冷によって蒸発させる際に発生する気化熱の放散を介し
て前記ヒートシンクに密着した電子機器発熱体を冷却す
る冷却装置において、前記ヒートシンクの表面に水を滴
下または吹付けつつ冷却を行なう手段を備えて構成され
る。The device of the present invention is a cooling device that cools a heating element of an electronic device that is in close contact with the heat sink through the dissipation of vaporization heat generated when moisture is evaporated from the surface of the heat sink by forced air cooling. It is constructed with a means for cooling while dropping or spraying.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
発熱体１００から伝わった熱がヒートシンク１で冷却空
気５０によって冷却される。ここで、ポンプで冷却水通
路９を介して圧送する冷却水１０をヒートシンク１に滴
下または吹付けることによりヒートシンク１の表面が濡
れ、この水が同時に蒸発することにより気化熱を利用し
て放熱効果を上げる。さらに、このときヒートシンク１
に吹き付ける水の量を蒸発量以上にすることによりヒー
トシンク１の表面に付着したゴミを洗い流すことが出来
る。The heat transmitted from the heating element 100 is cooled by the cooling air 50 at the heat sink 1. Here, the surface of the heat sink 1 is wetted by dripping or spraying the cooling water 10 that is force-fed through the cooling water passage 9 by a pump onto the heat sink 1, and this water evaporates at the same time, so that the heat dissipation effect is achieved by utilizing the heat of vaporization. raise. Furthermore, at this time, the heat sink 1
Dust adhering to the surface of the heat sink 1 can be washed away by making the amount of water sprayed equal to or greater than the evaporation amount.
ヒートシンク１を流れた水は下部タンク７に留り、ポン
プ８によって吸い上げられた冷却水１０は冷却水通路９
を通りノズル１１から再びヒートシンク１に吹き付けら
れ循環利用される。冷却水１０中のゴミはストレーナ１
２に溜る。こうして、絶えず塵埃がヒートシンクに付着
することを抑止しながら冷却効果の低下を大幅に改善し
た冷却を実施することができる。The water flowing through the heat sink 1 remains in the lower tank 7, and the cooling water 10 sucked up by the pump 8 flows into the cooling water passage 9.
The heat is then sprayed from the nozzle 11 onto the heat sink 1 and recycled. Dust in cooling water 10 is removed from strainer 1
It accumulates at 2. In this way, it is possible to perform cooling that greatly improves the deterioration of the cooling effect while preventing dust from constantly adhering to the heat sink.
以上説明したように本発明は、ヒートシンクに冷却水を
滴下もしくは吹付けつつ冷却を行なうことにより、ヒー
トシンクの放熱効率を上げ、且つ、冷却水がヒートシン
クに付着する塵埃を流し落すことにより、ヒートシンク
の放熱効率を著しく高いレベルに維持することができる
という効果がある。As explained above, the present invention improves the heat dissipation efficiency of the heat sink by cooling the heat sink while dripping or spraying cooling water, and also improves the heat sink by causing the cooling water to wash away dust attached to the heat sink. This has the effect that heat dissipation efficiency can be maintained at a significantly high level.
第１図は本発明の一実施例を示す斜視図、第２図は従来
の冷却装置の構成を示す斜視図である。
１・・・ヒートシンク、２・・・海綿状多孔物質、３゜
１７・・・下部タンク、４，９・・・冷却水通路、５・
・・冷却水タンク、６・・・ファン、８・・・ポンプ、
１０・・・冷却水、１１・・・ノズル、１２・・・スト
レーナ、５０・・・冷却空気、１００・・・発熱体。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing the configuration of a conventional cooling device. 1... Heat sink, 2... Spongy porous material, 3゜17... Lower tank, 4, 9... Cooling water passage, 5.
...Cooling water tank, 6...Fan, 8...Pump,
DESCRIPTION OF SYMBOLS 10... Cooling water, 11... Nozzle, 12... Strainer, 50... Cooling air, 100... Heating element.
Claims (1)
させる際に発生する気化熱の放散を介して前記ヒートシ
ンクに密着した電子機器発熱体を冷却する冷却装置にお
いて、 前記ヒートシンクの表面に水を滴下または吹付けつつ冷
却を行なう手段を備えて成ることを特徴とする冷却装置
。[Scope of Claims] A cooling device that cools a heating element of an electronic device that is in close contact with the heat sink through the dissipation of vaporization heat generated when moisture is evaporated from the surface of the heat sink by forced air cooling, comprising: A cooling device characterized by comprising means for cooling while dropping or spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018887A JPS63197398A (en) | 1987-02-10 | 1987-02-10 | Cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3018887A JPS63197398A (en) | 1987-02-10 | 1987-02-10 | Cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197398A true JPS63197398A (en) | 1988-08-16 |
Family
ID=12296778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3018887A Pending JPS63197398A (en) | 1987-02-10 | 1987-02-10 | Cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197398A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000034723A1 (en) * | 1998-12-10 | 2000-06-15 | Seft Development Laboratory Co., Ltd. | Cooling device |
| WO2000075581A1 (en) * | 1999-06-07 | 2000-12-14 | Seft Development Laboratory Co., Ltd. | Cooling machine |
| JP2006179404A (en) * | 2004-12-24 | 2006-07-06 | Ebara Corp | Air cooling type fuel cell power generating device |
| JP2014029285A (en) * | 2012-07-31 | 2014-02-13 | Fujitsu Semiconductor Ltd | Temperature regulator, temperature adjustment method, manufacturing method of electronic apparatus, and temperature adjustment program |
-
1987
- 1987-02-10 JP JP3018887A patent/JPS63197398A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000034723A1 (en) * | 1998-12-10 | 2000-06-15 | Seft Development Laboratory Co., Ltd. | Cooling device |
| WO2000075581A1 (en) * | 1999-06-07 | 2000-12-14 | Seft Development Laboratory Co., Ltd. | Cooling machine |
| JP2006179404A (en) * | 2004-12-24 | 2006-07-06 | Ebara Corp | Air cooling type fuel cell power generating device |
| JP2014029285A (en) * | 2012-07-31 | 2014-02-13 | Fujitsu Semiconductor Ltd | Temperature regulator, temperature adjustment method, manufacturing method of electronic apparatus, and temperature adjustment program |
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