KR100553192B1 - Heating body cooling apparatus using thermoelectric element - Google Patents

Abstract

The present invention relates to an apparatus for cooling a heating element such as a power semiconductor or a central processing unit (hereinafter referred to as a CPU) using a thermoelectric element, and in particular, using a thermoelectric element including an absorber for absorbing and drying water generated from a thermoelectric element. It relates to a heating element cooling device.

Heating element, thermoelectric element, microfiber

Description

Heating body cooling apparatus using thermoelectric element

1 is a perspective view showing a separate CPU cooling device using a conventional thermoelectric element.

2 is a cross-sectional view showing a heating element cooling apparatus using a thermoelectric element according to a preferred embodiment of the present invention.

3 is a bottom view of the heat sink of FIG.

<Explanation of symbols for the main parts of the drawings>

2: heating element (CPU) 10: aluminum block

30: thermoelectric element 40: heat sink

41: base 43: passage (long hole)

46: heat sink fin 50: fan

160,160a: absorber 170: thermoelectric element fixing frame

180: cover

The present invention relates to an apparatus for cooling a heating element such as a power semiconductor or a central processing unit (hereinafter referred to as a CPU) using a thermoelectric element, and in particular, using a thermoelectric element including an absorber for absorbing and drying water generated from a thermoelectric element. It relates to a heating element cooling device.

As an example of a CPU cooling system, a conventional ice cooler using a thermoelectric element is a continuous operation of a thermoelectric element, which causes a low load on the computer and continuously cools even when entering a sleep state, causing frost or dew to form. If caught, the frost may melt and cause water to flow onto the computer's board, causing the computer to malfunction.

As such, when the thermoelectric element is used for cooling the heating element, the cooling effect is excellent, but when condensation (water) occurs due to rapid cooling, the circuit due to short circuit cannot be used.

As a conventional cooling system for preventing such condensation, for example, the one disclosed in Korean Patent Application Laid-Open No. 20-0250196 is proposed. As shown in FIG. 1, the central processing unit cooling system of the computer includes an aluminum block 10 installed close to the rear of the CPU 2 and a temperature installed in the hole 12 drilled in the aluminum block 10. A sensor 20, a thermoelectric element 30 closely attached to the opposite surface of the CPU 2 of the aluminum block 10, and a heat sink closely attached to the other surface of the thermoelectric element 30 (in the prior art, a heat sink 40, a cooling fan 50 for circulating outside air to the heat sink 40, a switch 62 for allowing a user to set a temperature for allowing the CPU 2 to operate normally, and the temperature When power is applied to the computer based on the signals output from the sensor 20 and the switch 62, the cooling fan 50 is driven, and the thermoelectric element 30 when the CPU 2 is above a predetermined temperature. It consists of a control unit 64 to drive the CPU 2 to cool below a predetermined specific temperature, A circuit board 66 constituting the control group 64 is used ganpyeonhi is attached to the mounting grooves on the rear various cards of the computer case.

Such a dew condensation prevention system has a problem that it is difficult to apply to a compact product due to the complicated number of parts and layout for the temperature sensor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a heating element cooling apparatus using a thermoelectric element that does not affect the heating element even if condensation (water) is generated from the thermoelectric element.

Heating element cooling apparatus using a thermoelectric element of the present invention for achieving the above object is a block in which the heating element is disposed installed; Heat sink; A thermoelectric element disposed between the other surface of the block and the heat sink; An absorber for absorbing water generated in the thermoelectric element; It is made, including.

According to this structure, even if dew condensation (water) is generated from the thermoelectric element, it does not affect the heating element.

In the above-described configuration, the absorbent body is preferably dried through the heat sink.

When the absorber is made of microfiber, the efficiency of absorbency and drainage can be improved.

When the absorbent body is closely attached to the block and the heat sink by the cover, the absorber functions not only as the support of the absorber but also as a safety cover.

On the other hand, the heat sink is composed of a base on which the thermoelectric element is disposed and a plurality of heat dissipation fins formed on the other surface of the base, it is preferable that the passage is further formed in the base.

At this time, the passage is a through hole, and the absorbent is inserted into the hole, it is possible to further increase the drying efficiency.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present embodiment will now be described with reference to the accompanying drawings, where like reference numerals refer to like parts, and detailed description thereof will be omitted.

2 is a cross-sectional view showing a heating element cooling device using a thermoelectric element according to a preferred embodiment of the present invention.

As shown in FIG. 2, the heating element cooling apparatus of the present embodiment includes the thermoelectric element 30 and the thermoelectric element 30 interposed between the block 10, the heat sink 40, the block 10, and the heat sink 40. It is composed of an absorber 160 for absorbing heat generated from the.

The heating element 2 is provided on one surface of the block 10 to function as a cooling function to primarily absorb the heat of the heating element 2. In order to increase the efficiency of the cooling function, it is preferable to implement the aluminum block 10 having excellent thermal conductivity and workability.

The heat sink 40 is composed of a base 41 to which the thermoelectric element 30 is attached to a lower surface thereof, and a heat dissipation fin 46 formed on an upper surface of the base. At this time, in order to further increase the cooling efficiency, it is preferable that the cooling fan 50 is coupled to the upper end of the heat radiation fin 46.

The thermoelectric element 30 is a module having excellent cooling or heating efficiency, which is described as a thermoelectric module for cooling. Since the thermoelectric element 30 should not move in the attached state, the thermoelectric element 30 is preferably attached to the thermoelectric element fixing frame 170 coupled to the block 10.

The block 10 and the thermoelectric element fixing frame 170 are preferably fastened to the heat sink 40 by a bolt or the like.

The absorber 160 may be disposed around the thermoelectric element 30 to absorb condensation (water) generated by rapid cooling of the thermoelectric element, thereby preventing breakage of the heating element.

The absorber 160 is preferably made of a new material fiber that causes a capillary phenomenon. New material fibers include a wick or (ultra) microfiber material, and in this embodiment, a microfiber pad having good absorbency and drainage is implemented. The pad is so thin that it does not take up space, contributing to its compactness.

This absorber 160 is preferably wrapped up to the heat sink 40, more preferably to the position where the heat radiation fins. This is because the water absorbed by the absorber 160 can be dried through the heat sink 40. Therefore, a separate drainage device is not necessary, and the device can be made compact and simplified.

In this way, the absorber 160 having a simple structure is disposed on the periphery of the thermoelectric element 30, so that even if water is generated from the thermoelectric element, the water is absorbed and dried, so that the heating element 2 is not affected. .

On the other hand, when the absorber 160 is implemented as a microfiber pad, it is preferable that the cover 180 is installed to support the pad in close contact with the thermoelectric element 30, in particular, the block 10 and the heat sink 40. Do.

Therefore, the absorption and drying efficiency of the water due to the adhesion can be further increased, the support can be easily performed, and dust adhesion and damage to the pad can be prevented.

The cover 180 is preferably supported in close contact with the heat sink 40 or the aluminum block 10 together with the absorber 160 with a bolt or the like.

On the other hand, the passage 43 is further formed in the base 41 of the heat sink 40, thereby forming a moving passage of water vapor, thereby increasing the drying efficiency of the absorber.

2 and 3, the passage 43 has a long hole 43 penetrating through both side edge portions of the base 41, and an absorber 160a is inserted into the long hole 43. The drying contact area of the absorber 160a with respect to the sink 40 may be increased to further increase drying efficiency. In addition, since the long hole 43 penetrates from the lower surface of the base 41 to the upper surface, not only the evaporation efficiency but also the accumulation of water can be prevented.

The long hole 43 may be disposed in parallel or perpendicular to the heat dissipation fin 46.

The heating element cooling apparatus using the thermoelectric element according to the embodiment of the present invention can be implemented without various modifications within the range allowed by the technical idea of the present invention without being limited to the above-described embodiment.

As apparent from the above description, the heating element cooling device using the thermoelectric element according to the embodiment of the present invention has the following effects.

First, by adopting the configuration of the absorber absorbing the water generated in the thermoelectric element disposed between the block and the heat sink disposed on the one surface, before the water flows to the heating element even if condensation (water) occurs from the thermoelectric element Since it absorbs, a thermoelectric element can be used continuously.

Second, since the absorber is dried through the heat sink, a separate drainage device is unnecessary, thereby making the device compact and simplified.

Third, since the absorbent body is made of microfiber, the efficiency of absorbency and drainage can be further increased, and the microfiber has a thin thickness, thus taking up a lot of space.

Fourth, the absorber is closely supported by the cover and the heat sink by the cover, so that the absorption and drying efficiency of the water due to the adhesion can be further increased, the support can be easily performed, and dust adhesion or damage of the pad can be prevented.

Fifth, by further forming a passage in the base of the heat sink, the passage can increase the drying efficiency of the absorber.

Sixth, the passage is a through hole, and the absorber is inserted into the hole, thereby increasing the dry contact area of the absorber to the heat sink, thereby further increasing the drying efficiency.

Claims (6)

Block in which the heating element is disposed installed on one surface; Heat sink; A thermoelectric element disposed between the other surface of the block and the heat sink; An absorber for absorbing water generated in the thermoelectric element; Including but not limited to, The absorber is supported by a cover coupled to the block and the heat sink around the thermoelectric element, The cover is a heating element cooling device using a thermoelectric element, characterized in that the absorber in close contact with the block and the heat sink. The method of claim 1, The absorber is a heating element cooling device using a thermoelectric element, characterized in that the drying through the heat sink. The method of claim 2, The absorber is a heating element cooling device using a thermoelectric element, characterized in that made of microfiber. delete The method according to any one of claims 1 to 4, The heat sink is composed of a base on which the thermoelectric element is disposed, and a plurality of heat dissipation fins formed on the other surface of the base, Heating element cooling apparatus using a thermoelectric element, characterized in that the passage is further formed in the base. The method of claim 5, The passage is a perforated long hole, The absorber is a heating element cooling device using a thermoelectric element, characterized in that inserted into the long hole.

Images