JP3160814U - Cooling system - Google Patents

Cooling system Download PDF

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JP3160814U
JP3160814U JP2010002793U JP2010002793U JP3160814U JP 3160814 U JP3160814 U JP 3160814U JP 2010002793 U JP2010002793 U JP 2010002793U JP 2010002793 U JP2010002793 U JP 2010002793U JP 3160814 U JP3160814 U JP 3160814U
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heat
cooling
electronic cooler
container
heat radiating
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宮下 悟
悟 宮下
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Miyasa
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Abstract

【課題】ファンやフィルタが不要で、故障が発生し難く、長期間にわたって冷却性能を維持することができ、動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れ、簡素な構造で冷却能力を大幅に向上させることができ、冷却の効率性、省エネルギー性、環境保護性に優れた冷却装置を提供する。【解決手段】冷却対象物の発熱部の熱を吸熱する吸熱部と吸熱部で吸熱した熱を放熱する放熱部とを有する電子冷却器3と、該電子冷却器の放熱部に連設された放熱フィン4と、該放熱フィンを挟んで電子冷却器に対向配置され放熱フィンに冷風を送風するボルテックスチューブ5とを備えている。【選択図】図1[PROBLEMS] No fan or filter is required, failure is unlikely to occur, cooling performance can be maintained over a long period of time, excellent operation stability, maintainability, long life, resource saving, low noise, Provided is a cooling device that can greatly improve the cooling capacity with a simple structure and is excellent in cooling efficiency, energy saving, and environmental protection. An electronic cooler having an endothermic portion that absorbs heat of a heat generating portion of an object to be cooled and a heat radiating portion that dissipates heat absorbed by the endothermic portion, and is connected to the heat radiating portion of the electronic cooler. A heat dissipating fin 4 and a vortex tube 5 that is disposed opposite to the electronic cooler with the heat dissipating fin interposed therebetween and blows cool air to the heat dissipating fin are provided. [Selection] Figure 1

Description

本考案は、電子部品などの発熱部を有する各種電子機器などの冷却対象物を冷却する冷却装置に関するものである。   The present invention relates to a cooling device for cooling an object to be cooled such as various electronic devices having a heat generating part such as an electronic component.

近年、電子機器においては半導体等の電子部品の高集積化、動作クロックの高周波数化等に伴う発熱量の増大に対して、電子部品の正常動作の為に、それぞれの電子部品の接点温度を動作温度範囲内に如何に保つかが問題となってきている。
これらの発熱部を冷却する方法としては空冷が一般的であり、従来は、発熱部にヒートシンクを取り付け、ファンで送風して冷却するものや、発熱部にペルチェ素子などの電子冷却器を接触させ、ペルチェ素子に連設された放熱フィン(ヒートシンク)にファンで送風して冷却するものが用いられてきた。
また、(特許文献1)には、ボルテックスチューブによって発生させた低温空気を用いて発熱体を冷却する冷却構造」が開示されている。
In recent years, in electronic devices, the contact temperature of each electronic component has been reduced for the normal operation of the electronic component against the increase in heat generation due to higher integration of electronic components such as semiconductors and higher operating clock frequencies. How to keep within the operating temperature range has become a problem.
Air cooling is generally used as a method of cooling these heat generating parts. Conventionally, a heat sink is attached to the heat generating part and cooled by blowing with a fan, or an electronic cooler such as a Peltier element is contacted with the heat generating part. In order to cool the radiating fins (heat sinks) connected to the Peltier elements, a fan is used to cool the radiating fins.
Further, (Patent Document 1) discloses a “cooling structure that cools a heating element using low-temperature air generated by a vortex tube”.

特開平8−316673号公報JP-A-8-316673

しかしながら上記従来の技術では、以下のような課題を有していた。
(1)ファンによる空冷において、筐体の外形寸法が制限される場合には、筐体内のスペースが限られることにより、ヒートシンクの大きさに制約を受け、風量を増加させる必要があるため、ファンの回転数が大きくなり、騒音が発生するという課題があった。
また、筐体に配設されるフィルタの目詰まりや、埃の付着などによるファンの故障が発生し易く、長寿命性、メンテナンス性、省資源性に欠けるという問題があった。
(2)(特許文献1)では、ボルテックスチューブで発生させた低温空気(冷風)を用いるため、ファンが不要となるが、発熱体に直接、冷風を噴射するだけなので、発熱体を十分に冷却することができず、冷却の効率性に欠けるという課題を有していた。
However, the above conventional techniques have the following problems.
(1) In the case of air cooling by a fan, when the external dimensions of the housing are limited, the space in the housing is limited, so that the size of the heat sink is restricted and the air volume needs to be increased. There was a problem that the number of rotations increased and noise was generated.
In addition, there is a problem that fan failure due to clogging of the filter disposed in the housing or adhesion of dust is likely to occur, resulting in lack of long life, maintainability, and resource saving.
(2) (Patent Document 1) uses low-temperature air (cold air) generated by a vortex tube, so a fan is not required, but only cool air is sprayed directly onto the heat generator, so that the heat generator is sufficiently cooled. It was not possible to do so, and there was a problem of lacking in cooling efficiency.

本考案は上記従来の課題を解決するもので、ファンやフィルタが不要で、故障が発生し難く、長期間にわたって冷却性能を維持することができ、動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れ、簡素な構造で冷却能力を大幅に向上させることができ、冷却の効率性、省電力性、環境保護性に優れた冷却装置の提供を目的とする。   The present invention solves the above-mentioned conventional problems, does not require a fan or a filter, is less prone to failure, can maintain cooling performance for a long period of time, has stable operation, maintainability, long life, The object is to provide a cooling device which is excellent in resource saving and low noise, can greatly improve the cooling capacity with a simple structure, and is excellent in cooling efficiency, power saving and environmental protection.

上記課題を解決するために本考案の冷却装置は、以下の構成を有している。
本考案の請求項1に記載の冷却装置は、電子部品などの発熱部を有する冷却対象物を冷却する冷却装置であって、前記冷却対象物の前記発熱部の熱を吸熱する吸熱部と前記吸熱部で吸熱した熱を放熱する放熱部とを有する電子冷却器と、前記電子冷却器の前記放熱部に連設された放熱フィンと、前記放熱フィンを挟んで前記電子冷却器に対向配置され前記放熱フィンに冷風を送風するボルテックスチューブと、を備えた構成を有している。
この構成により、以下のような作用を有する。
(1)冷却対象物の発熱部の熱を吸熱する吸熱部と吸熱部で吸熱した熱を放熱する放熱部とを有する電子冷却器と、電子冷却器の放熱部に連設された放熱フィンと、放熱フィンを挟んで電子冷却器に対向配置され放熱フィンに冷風を送風するボルテックスチューブを備えているので、発熱部の熱を電子冷却器の吸熱部で速やかに吸熱して、その熱を放熱部から放熱フィンに確実に伝達し、放熱フィンから空気中に短時間で効率的に放熱することができ、冷却の効率性、確実性に優れる。
(2)ボルテックスチューブにより放熱フィンに冷風を送風するので、ファンやフィルタが不要で、ファンの故障やフィルタの目詰まり等を気にする必要がなく、長期間にわたって安定した冷却性能を維持することができ、動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れる。
(3)ボルテックスチューブは圧縮空気を供給するだけで冷風を噴射することができ、フロンガスも使用しないので、省電力性、環境保護性に優れる。
(4)放熱フィンに冷風を送風するボルテックスチューブが、放熱フィンを挟んで電子冷却器に対向配置されるので、放熱フィンを短時間で冷却して、電子冷却器の放熱部から放熱フィンへの熱伝達を促進し、電子冷却器の冷却能力を大幅に向上させることができ、冷却の効率性、省エネルギー性に優れる。
In order to solve the above problems, the cooling device of the present invention has the following configuration.
The cooling device according to claim 1 of the present invention is a cooling device that cools a cooling object having a heat generating part such as an electronic component, and the heat absorbing part that absorbs heat of the heat generating part of the cooling object; An electronic cooler having a heat dissipating part that dissipates heat absorbed by the heat absorbing part, a heat dissipating fin connected to the heat dissipating part of the electronic cooler, and the electronic cooler disposed so as to sandwich the heat dissipating fin. And a vortex tube for blowing cool air to the heat dissipating fins.
This configuration has the following effects.
(1) An electronic cooler having an endothermic part that absorbs the heat of the heat generating part of the object to be cooled and a heat dissipating part that dissipates the heat absorbed by the endothermic part, and a radiating fin connected to the heat dissipating part of the electronic cooler Because it has a vortex tube that is placed opposite to the electronic cooler with the radiating fins sandwiched between it and blows cool air to the radiating fin, the heat of the heat generating part is quickly absorbed by the heat absorbing part of the electronic cooler, and the heat is dissipated. The heat can be reliably transmitted from the portion to the heat radiating fin, and the heat can be efficiently radiated in the air from the heat radiating fin in a short time, and the cooling efficiency and reliability are excellent.
(2) Since the vortex tube blows cold air to the radiating fins, there is no need for a fan or filter, and there is no need to worry about fan failure or filter clogging, and to maintain stable cooling performance over a long period of time. It is excellent in operational stability, maintainability, long life, resource saving, and low noise.
(3) The vortex tube can inject cold air just by supplying compressed air, and does not use chlorofluorocarbon, so it has excellent power saving and environmental protection.
(4) Since the vortex tube that blows cool air to the radiating fin is placed opposite the electronic cooler with the radiating fin in between, the radiating fin is cooled in a short time, and the radiating fin of the electronic cooler is connected to the radiating fin. Heat transfer can be promoted and the cooling capacity of the electronic cooler can be greatly improved, and the cooling efficiency and energy saving are excellent.

ここで、電子冷却器としては、ペルチェ素子が好適に用いられる。
また、ボルテックスチューブは、従来公知のものを使用することができる。ボルテックスチューブの冷風吐出部から放熱フィンに冷風を送風するが、ボルテックスチューブの冷風吐出部が放熱フィンを挟んで電子冷却器に対向するように配置することが好ましい。これにより、電子冷却器の放熱部と直接接触して高温になる放熱フィンの基部に冷風を噴射して、放熱フィンからの放熱を促進し、電子冷却器の放熱部を短時間で効率的に冷却して、電子冷却器の冷却能力を高めることができるためである。
Here, a Peltier device is preferably used as the electronic cooler.
A conventionally known vortex tube can be used. Cold air is blown from the cold air discharge portion of the vortex tube to the heat radiating fins, and it is preferable that the cold air discharge portion of the vortex tube is disposed so as to face the electronic cooler with the heat radiating fin interposed therebetween. As a result, cold air is sprayed onto the base of the heat dissipation fin that is in direct contact with the heat dissipation portion of the electronic cooler to promote heat dissipation from the heat dissipation fin, and the heat dissipation portion of the electronic cooler can be efficiently and quickly This is because the cooling capacity of the electronic cooler can be increased by cooling.

ボルテックスチューブの圧縮空気供給部は圧縮空気供給源と接続され、圧縮空気が供給されるが、供給される圧縮空気が水分を含んでいると、冷風吐出部のノズルが凍結し、冷風中に氷粒が発生するので、圧縮空気を供給する配管の途中に水分を除去するためのエアドライヤを配設することが好ましい。また、ゴミや油などの異物が混入して冷却能力が低下することを防止するため、配管の途中にエアフィルタやオイルミストセパレータを配設することが好ましい。
また、冷却対象物の発熱部或いはその周辺の温度を検出する温度センサを設け、温度センサで検出した温度が一定温度以下になった時に、ボルテックスチューブへの圧縮空気の供給(ボルテックスチューブの駆動)を停止するようにしてもよい。
The compressed air supply unit of the vortex tube is connected to a compressed air supply source, and compressed air is supplied. However, if the supplied compressed air contains moisture, the nozzle of the cold air discharge unit freezes, and ice is cooled in the cold air. Since particles are generated, it is preferable to dispose an air dryer for removing moisture in the middle of a pipe for supplying compressed air. Further, in order to prevent foreign matters such as dust and oil from entering and reducing the cooling capacity, it is preferable to arrange an air filter or an oil mist separator in the middle of the piping.
In addition, a temperature sensor that detects the temperature of the heat generating part of the object to be cooled or its surroundings is provided, and supply of compressed air to the vortex tube when the temperature detected by the temperature sensor falls below a certain temperature (drive of the vortex tube) May be stopped.

請求項2に記載の考案は、請求項1に記載の冷却装置であって、前記放熱フィンが収容される放熱容器と、前記放熱容器に形設された放熱側開口部と、を有し、前記電子冷却器が、前記放熱側開口部に配設され、前記ボルテックスチューブの冷風吐出部が、前記放熱容器の内部に挿通された構成を有している。
この構成により、請求項1の作用に加え、以下のような作用を有する。
(1)放熱フィンが収容される放熱容器と、放熱容器に形設された放熱側開口部と、を有し、電子冷却器が、放熱側開口部に配設されることにより、冷却対象物の発熱部から発生する熱を電子冷却器の吸熱部で確実に吸熱することができ、発熱部の冷却の確実性に優れる。
(2)放熱フィンが収容される放熱容器を有し、ボルテックスチューブの冷風吐出部が放熱容器の内部に挿通されることにより、放熱容器の内部に冷風を供給して、放熱容器の内部を低温に保ち、放熱フィンからの放熱を促進して、放熱フィンの温度上昇を防ぎ、電子冷却器の冷却能力を維持することができ、冷却能力の安定性、冷却の効率性に優れる。
The invention according to claim 2 is the cooling device according to claim 1, comprising a heat radiating container in which the heat radiating fins are accommodated, and a heat radiating side opening formed in the heat radiating container, The electronic cooler is disposed in the heat radiation side opening, and the cold air discharge part of the vortex tube is inserted into the heat radiation container.
With this configuration, in addition to the operation of the first aspect, the following operation is provided.
(1) A cooling object having a heat radiation container in which heat radiation fins are accommodated and a heat radiation side opening formed in the heat radiation container, and an electronic cooler being disposed in the heat radiation side opening. The heat generated from the heat generating part can be reliably absorbed by the heat absorbing part of the electronic cooler, and the heat generating part is reliably cooled.
(2) It has a heat radiating container in which radiating fins are housed, and the cold air discharge part of the vortex tube is inserted into the heat radiating container so that cold air is supplied to the inside of the heat radiating container and the inside of the heat radiating container is cooled at a low temperature. Therefore, the heat radiation from the radiation fins can be promoted, the temperature of the radiation fins can be prevented from rising, the cooling capacity of the electronic cooler can be maintained, and the stability of the cooling capacity and the cooling efficiency are excellent.

ここで、放熱容器の材質としては、ステンレス、鉄、アルミニウム等の金属が好適に用いられる。尚、放熱容器にはドレン抜きを設けることが好ましい。また、放熱容器の周壁部などに通気孔を設けてもよい。ボルテックスチューブの冷風吐出部から冷風が吐出された際に、放熱容器の内部に溜まった空気を外部に排出して温度上昇を防止できるためである。
電子冷却器の吸熱部は、冷却対象物の発熱部と直接、接触させてもよいし、間にアルミニウムや銅等の熱伝導率の高い金属で形成した熱伝導板を挟んでもよい。また、電子冷却器の吸熱部や熱伝導板の表面に熱伝導グリスや熱伝導シールなどの伝熱材を塗布又は貼着する等して、接触部の密着性を高め、熱伝導性を向上させることもできる。
Here, metals such as stainless steel, iron, and aluminum are preferably used as the material of the heat dissipation container. In addition, it is preferable to provide drainage in the heat dissipation container. Moreover, you may provide a vent hole in the surrounding wall part etc. of a thermal radiation container. This is because when cold air is discharged from the cold air discharge portion of the vortex tube, the air accumulated in the heat radiating container can be discharged to the outside to prevent temperature rise.
The heat absorption part of the electronic cooler may be in direct contact with the heat generating part of the object to be cooled, or a heat conduction plate formed of a metal having high thermal conductivity such as aluminum or copper may be sandwiched therebetween. In addition, by applying or sticking heat transfer material such as heat conductive grease or heat conductive seal to the heat absorption part of the electronic cooler or the surface of the heat conduction plate, the adhesion of the contact part is improved and the heat conductivity is improved. It can also be made.

請求項3に記載の考案は、請求項2に記載の冷却装置であって、断熱層によって外部と断熱され内部に前記冷却対象物が収容される断熱容器と、前記断熱容器に形設され前記放熱側開口部と連通した断熱側開口部と、を備えた構成を有している。
この構成により、請求項1又は2の作用に加え、以下のような作用を有する。
(1)断熱層によって外部と断熱され内部に冷却対象物が収容される断熱容器を有することにより、結露の発生を防止することができ、冷却対象物の動作安定性に優れる。
(2)断熱容器に形設され放熱側開口部と連通した断熱側開口部を有することにより、断熱容器の内部に配設された冷却対象物の発熱部から発生する熱を電子冷却器の吸熱部で効率的に吸熱して、発熱部を短時間で効果的に冷却することができ、冷却の効率性、冷却対象物の動作安定性に優れる。
Invention of Claim 3 is the cooling device of Claim 2, Comprising: The heat insulation container which is thermally insulated from the exterior by the heat insulation layer and the said cooling target object is accommodated inside, The said heat insulation container is shape-shaped, and the said And a heat insulating side opening communicated with the heat radiating side opening.
With this configuration, in addition to the operation of the first or second aspect, the following operation is provided.
(1) By having a heat insulating container which is insulated from the outside by the heat insulating layer and in which the object to be cooled is accommodated, the occurrence of condensation can be prevented and the operation stability of the object to be cooled is excellent.
(2) By having a heat insulating side opening formed in the heat insulating container and communicating with the heat radiating side opening, the heat generated by the heat generating portion of the cooling object disposed inside the heat insulating container can be absorbed by the electronic cooler. The heat can be absorbed efficiently at the part, and the heat generating part can be effectively cooled in a short time, and the cooling efficiency and the operational stability of the object to be cooled are excellent.

ここで、断熱層は、断熱容器の内壁面にグラスウール、ロックウール、ポリスチレンフォーム等の断熱材を貼着してもよいし、断熱塗装を施してもよい。   Here, the heat insulating layer may be affixed with a heat insulating material such as glass wool, rock wool, polystyrene foam or the like on the inner wall surface of the heat insulating container.

以上のように、本考案の冷却装置によれば、以下のような有利な効果が得られる。
請求項1に記載の考案によれば、以下のような効果を有する。
(1)発熱部の熱を電子冷却器の吸熱部で速やかに吸熱して、その熱を放熱部から放熱フィンに確実に伝達し、ボルテックスチューブから吐出される冷風によって、放熱フィンから空気中に短時間で効率的に放熱することができ、冷却の効率性、確実性に優れ、ファンの故障やフィルタの目詰まり等を気にする必要がなく、長期間にわたって安定した冷却性能を維持することができる動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れた冷却装置を提供することができる。
As described above, according to the cooling device of the present invention, the following advantageous effects can be obtained.
The device according to claim 1 has the following effects.
(1) The heat of the heat generating part is quickly absorbed by the heat absorbing part of the electronic cooler, and the heat is reliably transmitted from the heat radiating part to the heat radiating fin, and the cold air discharged from the vortex tube causes the heat radiating fin to enter the air. It can dissipate heat efficiently in a short time, has excellent cooling efficiency and reliability, does not need to worry about fan failure or filter clogging, etc., and maintains stable cooling performance over a long period of time Therefore, it is possible to provide a cooling device excellent in operational stability, maintainability, long life, resource saving, and low noise.

請求項2に記載の考案によれば、請求項1の効果に加え、以下のような効果を有する。
(1)放熱フィンが収容される放熱容器の内部を低温に保ち、放熱フィンからの放熱を促進して、放熱フィンの温度上昇を防ぎ、電子冷却器の冷却能力を維持することができる冷却能力の安定性、冷却の効率性に優れた冷却装置を提供することができる。
According to the invention described in claim 2, in addition to the effect of claim 1, the following effect is obtained.
(1) Cooling capacity capable of maintaining the cooling capacity of the electronic cooler by keeping the inside of the heat radiating container in which the radiating fins are kept at a low temperature, promoting heat radiation from the radiating fins, preventing the temperature of the radiating fins from rising It is possible to provide a cooling device having excellent stability and cooling efficiency.

請求項3に記載の考案によれば、請求項2の効果に加え、以下のような効果を有する。
(1)冷却対象物が収容される断熱容器での結露の発生を防止することができると共に、断熱容器の内部に配設された冷却対象物の発熱部から発生する熱を電子冷却器の吸熱部で確実に吸熱して、発熱部を効率的に冷却することができ、冷却の確実性、効率性に優れ、冷却対象物の動作安定性に優れた冷却装置を提供することができる。
According to the invention described in claim 3, in addition to the effect of claim 2, the following effect is obtained.
(1) Condensation can be prevented from occurring in the heat insulating container in which the object to be cooled is accommodated, and the heat generated from the heat generating portion of the object to be cooled disposed in the heat insulating container is absorbed by the electronic cooler. It is possible to provide a cooling device that can absorb heat reliably at the section and efficiently cool the heat generating section, is excellent in cooling reliability and efficiency, and is excellent in operational stability of the object to be cooled.

本考案の実施の形態1における冷却装置を示す要部断面模式側面図1 is a schematic cross-sectional side view of an essential part showing a cooling device according to Embodiment 1 of the present invention.

(実施の形態1)
本考案の実施の形態1における冷却装置について、以下図面を参照しながら説明する。
図1は本考案の実施の形態1における冷却装置を示す要部断面模式側面図である。
図1中、1は本考案の実施の形態1における冷却装置、2は後述する放熱フィン4が収容される放熱容器、2aは放熱容器2の壁部に形設された放熱側開口部、3は放熱側開口部2aに配設されたペルチェ素子を用いた電子冷却器、4は電子冷却器3の放熱部に連設された放熱フィン、5は放熱フィン4を挟んで冷風吐出部5aが電子冷却器3の略中央部に対向配置され放熱フィン4に冷風を送風するボルテックスチューブ、5bはボルテックスチューブ5の温風排出部、6はボルテックスチューブ5に圧縮空気を供給する圧縮空気供給配管、7は電子部品などの発熱部を有する各種電子機器などの冷却対象物が収容される断熱容器、7aは断熱容器7の空間部、7bは断熱容器7の壁部に形設され放熱容器2の放熱側開口部2aと連通した断熱側開口部、7cは断熱容器7の内壁に貼着されたグラスウールやロックウール等の断熱材で形成された断熱層、8はアルミニウムや銅等の熱伝導率の高い金属で形成され断熱側開口部7bに配設されて電子冷却器3の吸熱部と接触する熱伝導板、9は熱伝導板8の表面に塗布又は貼着され冷却対象物の発熱部(図示せず)と密着する熱伝導グリスや熱伝導シールなどの伝熱材である。
(Embodiment 1)
A cooling device according to Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional schematic side view showing a main part of a cooling device according to Embodiment 1 of the present invention.
In FIG. 1, reference numeral 1 denotes a cooling device according to the first embodiment of the present invention, 2 denotes a heat radiating container in which radiating fins 4 to be described later are housed, 2 a denotes a heat radiating side opening formed on the wall of the heat radiating container 2, 3 Is an electronic cooler using a Peltier element disposed in the heat radiation side opening 2a, 4 is a heat radiation fin connected to the heat radiation part of the electronic cooler 3, and 5 is a cold air discharge part 5a across the heat radiation fin 4. A vortex tube that is arranged opposite to the substantially central portion of the electronic cooler 3 and blows cool air to the heat radiating fins 4, 5 b is a hot air discharge portion of the vortex tube 5, and 6 is a compressed air supply pipe that supplies compressed air to the vortex tube 5, 7 is a heat-insulating container in which various objects to be cooled such as various electronic devices having heat-generating parts such as electronic parts are accommodated, 7a is a space part of the heat-insulating container 7, 7b is formed in the wall part of the heat-insulating container 7, and Communicating with the heat radiation side opening 2a Heat side opening, 7c is a heat insulating layer formed of a heat insulating material such as glass wool or rock wool adhered to the inner wall of the heat insulating container 7, and 8 is a heat insulating side formed of a metal having high heat conductivity such as aluminum or copper. A heat conductive plate 9 disposed in the opening 7b and in contact with the heat absorbing portion of the electronic cooler 3 is applied or pasted on the surface of the heat conductive plate 8, and is in close contact with the heat generating portion (not shown) of the object to be cooled. Heat transfer material such as heat conductive grease and heat conductive seal.

以上のように構成された実施の形態1における冷却装置の動作について説明する。
図1において、冷却対象物の発熱部(図示せず)で発生した熱は、伝熱材9、熱伝導板8を通って電子冷却器3の上面側の吸熱部で吸熱される。そして、電子冷却器3の吸熱部で吸熱された熱は電子冷却器3の下面側の放熱部から放熱フィン4に伝達される。
このとき、ボルテックスチューブ5の冷風吐出部5aから放熱フィン4に向かって冷風が噴射され、放熱フィン4の周辺の空気が冷やされることにより、放熱フィン4から空気中への放熱が促進され、電子冷却器3の冷却能力が大幅に向上し、短時間で効率的に冷却対象物の発熱部の温度を低下させることができる。
The operation of the cooling device according to Embodiment 1 configured as described above will be described.
In FIG. 1, the heat generated in the heat generating part (not shown) of the object to be cooled is absorbed by the heat absorbing part on the upper surface side of the electronic cooler 3 through the heat transfer material 9 and the heat conduction plate 8. The heat absorbed by the heat absorbing portion of the electronic cooler 3 is transmitted from the heat radiating portion on the lower surface side of the electronic cooler 3 to the heat radiating fins 4.
At this time, the cool air is ejected from the cool air discharge part 5a of the vortex tube 5 toward the heat radiating fin 4, and the air around the heat radiating fin 4 is cooled, so that the heat radiation from the heat radiating fin 4 into the air is promoted. The cooling capacity of the cooler 3 is greatly improved, and the temperature of the heat generating part of the object to be cooled can be lowered efficiently in a short time.

尚、冷却対象物の発熱部或いはその周辺(空間部7a)の温度を検出する温度センサを設け、温度センサで検出した温度が一定温度以下になった時に、ボルテックスチューブ5への圧縮空気の供給(ボルテックスチューブの駆動)を停止するようにしてもよい。
また、放熱容器2にはドレン抜きを設けることが好ましい。放熱容器2の周壁部などに通気孔を設けた場合、ボルテックスチューブ5の冷風吐出部5aから冷風が吐出された際に、放熱容器2の内部に溜まった空気を外部に排出して温度上昇を防止できる。
本実施の形態では、電子冷却器3と冷却対象物の発熱部との間に伝熱材9及び熱伝導板8を配置したが、いずれか一方を省略してもよいし、電子冷却器3と冷却対象物の発熱部を直接、接触させてもよい。
尚、断熱容器7は冷却装置1の一部として製作してもよいし、冷却対象物が収容されている既存の筐体を利用してもよい。
A temperature sensor is provided to detect the temperature of the heat generating part of the object to be cooled or its surroundings (space part 7a), and supply of compressed air to the vortex tube 5 when the temperature detected by the temperature sensor falls below a certain temperature. (Vortex tube driving) may be stopped.
Moreover, it is preferable to provide the drainage in the radiation container 2. When vent holes are provided in the peripheral wall of the heat radiating container 2 or the like, when cold air is discharged from the cold air discharging part 5a of the vortex tube 5, the temperature accumulated in the heat radiating container 2 is discharged to the outside to increase the temperature. Can be prevented.
In the present embodiment, the heat transfer material 9 and the heat conduction plate 8 are disposed between the electronic cooler 3 and the heat generating portion of the object to be cooled, but either one may be omitted, or the electronic cooler 3 The heating part of the object to be cooled may be brought into direct contact.
The heat insulating container 7 may be manufactured as a part of the cooling device 1 or an existing casing in which an object to be cooled is accommodated.

実施の形態1の冷却装置は以上のように構成されているので、以下の作用を有する。
(1)冷却対象物の発熱部の熱を吸熱する吸熱部と吸熱部で吸熱した熱を放熱する放熱部とを有する電子冷却器と、電子冷却器の放熱部に連設された放熱フィンと、放熱フィンを挟んで電子冷却器に対向配置され放熱フィンに冷風を送風するボルテックスチューブを備えているので、発熱部の熱を電子冷却器の吸熱部で速やかに吸熱して、その熱を放熱部から放熱フィンに確実に伝達し、放熱フィンから空気中に短時間で効率的に放熱することができ、冷却の効率性、確実性に優れる。
(2)ボルテックスチューブにより放熱フィンに冷風を送風するので、ファンやフィルタが不要で、ファンの故障やフィルタの目詰まり等を気にする必要がなく、長期間にわたって安定した冷却性能を維持することができ、動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れる。
(3)ボルテックスチューブは圧縮空気を供給するだけで冷風を噴射することができ、フロンガスも使用しないので、省電力性、環境保護性に優れる。
(4)放熱フィンに冷風を送風するボルテックスチューブが、放熱フィンを挟んで電子冷却器に対向配置されるので、放熱フィンを短時間で冷却して、電子冷却器の放熱部から放熱フィンへの熱伝達を促進し、電子冷却器の冷却能力を大幅に向上させることができ、冷却の効率性、省エネルギー性に優れる。
(5)放熱フィンが収容される放熱容器を有し、ボルテックスチューブの冷風吐出部が放熱容器の内部に挿通されることにより、放熱容器の内部に冷風を供給して、放熱容器の内部を低温に保ち、放熱フィンからの放熱を促進して、放熱フィンの温度上昇を防ぎ、電子冷却器の冷却能力を維持することができ、冷却能力の安定性、冷却の効率性に優れる。
(6)断熱層によって外部と断熱され内部に冷却対象物が収容される断熱容器を有することにより、結露の発生を防止することができ、冷却対象物の動作安定性に優れる。
(7)放熱容器に形設された放熱側開口部と断熱容器に形設された断熱側開口部が連通し、電子冷却器が放熱側開口部に配設されることにより、断熱容器の内部に配設された冷却対象物の発熱部から発生する熱を電子冷却器の吸熱部で確実に吸熱して、発熱部を効率的に冷却することができ、冷却の確実性、効率性に優れ、冷却対象物の動作安定性に優れる。
Since the cooling device of Embodiment 1 is configured as described above, it has the following operations.
(1) An electronic cooler having an endothermic part that absorbs the heat of the heat generating part of the object to be cooled and a heat dissipating part that dissipates the heat absorbed by the endothermic part, and a radiating fin connected to the heat dissipating part of the electronic cooler Because it has a vortex tube that is placed opposite to the electronic cooler with the radiating fins sandwiched between it and blows cool air to the radiating fin, the heat of the heat generating part is quickly absorbed by the heat absorbing part of the electronic cooler, and the heat is dissipated. The heat can be reliably transmitted from the portion to the heat radiating fin, and the heat can be efficiently radiated in the air from the heat radiating fin in a short time, and the cooling efficiency and reliability are excellent.
(2) Since the vortex tube blows cold air to the radiating fins, there is no need for a fan or filter, and there is no need to worry about fan failure or filter clogging, and to maintain stable cooling performance over a long period of time. It is excellent in operational stability, maintainability, long life, resource saving, and low noise.
(3) The vortex tube can inject cold air just by supplying compressed air, and does not use chlorofluorocarbon, so it has excellent power saving and environmental protection.
(4) Since the vortex tube that blows cool air to the radiating fin is placed opposite the electronic cooler with the radiating fin in between, the radiating fin is cooled in a short time, and the radiating fin of the electronic cooler is connected to the radiating fin. Heat transfer can be promoted and the cooling capacity of the electronic cooler can be greatly improved, and the cooling efficiency and energy saving are excellent.
(5) Having a heat radiating container in which radiating fins are housed, and the cold air discharge part of the vortex tube is inserted into the heat radiating container, thereby supplying cold air to the inside of the heat radiating container and cooling the inside of the heat radiating container at a low temperature. Therefore, the heat radiation from the radiation fins can be promoted, the temperature of the radiation fins can be prevented from rising, the cooling capacity of the electronic cooler can be maintained, and the stability of the cooling capacity and the cooling efficiency are excellent.
(6) By having the heat insulation container which is insulated from the outside by the heat insulation layer and in which the object to be cooled is accommodated, the occurrence of condensation can be prevented and the operation stability of the object to be cooled is excellent.
(7) The heat radiation side opening formed in the heat radiation container and the heat insulation side opening formed in the heat insulation container communicate with each other, and the electronic cooler is disposed in the heat radiation side opening. The heat generated from the heat generating part of the object to be cooled is reliably absorbed by the heat absorbing part of the electronic cooler, so that the heat generating part can be efficiently cooled, and the cooling reliability and efficiency are excellent. Excellent operation stability of the object to be cooled.

本考案は、ファンやフィルタが不要で、故障が発生し難く、長期間にわたって冷却性能を維持することができ、動作の安定性、メンテナンス性、長寿命性、省資源性、低騒音性に優れ、簡素な構造で冷却能力を大幅に向上させることができ、冷却の効率性、省電力性、環境保護性に優れた冷却装置の提供を行うことができ、工場などの温度上昇を防止して限られたスペースを有効に利用することができ、従来の空冷よりも優れた冷却を実現して環境保護に貢献することができる。   This device does not require a fan or a filter, is unlikely to fail, can maintain cooling performance over a long period of time, and has excellent operational stability, maintainability, long life, resource saving, and low noise. Cooling capacity can be greatly improved with a simple structure, cooling equipment with excellent cooling efficiency, power saving, and environmental protection can be provided, preventing temperature rise in factories and the like The limited space can be used effectively, and cooling superior to conventional air cooling can be realized to contribute to environmental protection.

1 冷却装置
2 放熱容器
2a 放熱側開口部
3 電子冷却器
4 放熱フィン
5 ボルテックスチューブ
5a 冷風吐出部
5b 温風排出部
6 圧縮空気供給配管
7 断熱容器
7a 空間部
7b 断熱側開口部
7c 断熱層
8 熱伝導板
9 伝熱材
DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat radiation container 2a Heat radiation side opening part 3 Electronic cooler 4 Heat radiation fin 5 Vortex tube 5a Cold air discharge part 5b Hot air discharge part 6 Compressed air supply piping 7 Heat insulation container 7a Space part 7b Heat insulation side opening part 7c Heat insulation layer 8 Heat conduction plate 9 Heat transfer material

Claims (3)

電子部品などの発熱部を有する冷却対象物を冷却する冷却装置であって、
前記冷却対象物の前記発熱部の熱を吸熱する吸熱部と前記吸熱部で吸熱した熱を放熱する放熱部とを有する電子冷却器と、前記電子冷却器の前記放熱部に連設された放熱フィンと、前記放熱フィンを挟んで前記電子冷却器に対向配置され前記放熱フィンに冷風を送風するボルテックスチューブと、を備えたことを特徴とする冷却装置。
A cooling device for cooling a cooling object having a heat generating part such as an electronic component,
An electronic cooler having an endothermic part that absorbs heat of the heat generating part of the object to be cooled, and a heat dissipating part that dissipates heat absorbed by the endothermic part, and heat dissipation that is connected to the heat dissipating part of the electronic cooler A cooling device comprising: a fin; and a vortex tube that is disposed to face the electronic cooler with the heat radiating fin interposed therebetween and blows cool air to the heat radiating fin.
前記放熱フィンが収容される放熱容器と、前記放熱容器に形設された放熱側開口部と、を有し、前記電子冷却器が、前記放熱側開口部に配設され、前記ボルテックスチューブの冷風吐出部が、前記放熱容器の内部に挿通されたことを特徴とする請求項1に記載の冷却装置。 A heat radiating container in which the heat radiating fins are accommodated, and a heat radiating side opening formed in the heat radiating container, wherein the electronic cooler is disposed in the heat radiating side opening, The cooling device according to claim 1, wherein the discharge unit is inserted into the heat radiating container. 断熱層によって外部と断熱され内部に前記冷却対象物が収容される断熱容器と、前記断熱容器に形設され前記放熱側開口部と連通した断熱側開口部と、を備えたことを特徴とする請求項2に記載の冷却装置。
A heat insulating container which is insulated from the outside by a heat insulating layer and accommodates the object to be cooled therein, and a heat insulating side opening which is formed in the heat insulating container and communicates with the heat radiating side opening. The cooling device according to claim 2.
JP2010002793U 2010-04-26 2010-04-26 Cooling system Expired - Fee Related JP3160814U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201324A (en) * 2012-03-26 2013-10-03 Panasonic Corp Screen printer and screen printing method
JP2017153340A (en) * 2016-02-22 2017-08-31 エルエス産電株式会社Lsis Co., Ltd. Cooling apparatus for power converter
WO2018096695A1 (en) * 2016-11-28 2018-05-31 株式会社シバソク Cooling device, cooling method, and semiconductor inspection device, each of which using thermoelectric element
CN108362025A (en) * 2018-03-27 2018-08-03 南京工业大学 Airborne spray cooling system using phase-change material to cool spray medium and micro-channel heat exchanger to prevent failure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201324A (en) * 2012-03-26 2013-10-03 Panasonic Corp Screen printer and screen printing method
JP2017153340A (en) * 2016-02-22 2017-08-31 エルエス産電株式会社Lsis Co., Ltd. Cooling apparatus for power converter
US10426065B2 (en) 2016-02-22 2019-09-24 Lsis Co., Ltd. Cooling apparatus for power converter
WO2018096695A1 (en) * 2016-11-28 2018-05-31 株式会社シバソク Cooling device, cooling method, and semiconductor inspection device, each of which using thermoelectric element
CN108362025A (en) * 2018-03-27 2018-08-03 南京工业大学 Airborne spray cooling system using phase-change material to cool spray medium and micro-channel heat exchanger to prevent failure
CN108362025B (en) * 2018-03-27 2023-10-31 南京工业大学 Airborne spray cooling system using phase change material to cool spray medium and micro-channel heat exchanger to prevent failure

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