JPS63197357U - - Google Patents
Info
- Publication number
- JPS63197357U JPS63197357U JP8986887U JP8986887U JPS63197357U JP S63197357 U JPS63197357 U JP S63197357U JP 8986887 U JP8986887 U JP 8986887U JP 8986887 U JP8986887 U JP 8986887U JP S63197357 U JPS63197357 U JP S63197357U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- multilayer circuit
- sub
- flange
- chip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986887U JPS63197357U (de) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986887U JPS63197357U (de) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197357U true JPS63197357U (de) | 1988-12-19 |
Family
ID=30949240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8986887U Pending JPS63197357U (de) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197357U (de) |
-
1987
- 1987-06-10 JP JP8986887U patent/JPS63197357U/ja active Pending
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