JPS6319714A - Manufacture of conductor for covered wire - Google Patents
Manufacture of conductor for covered wireInfo
- Publication number
- JPS6319714A JPS6319714A JP16445386A JP16445386A JPS6319714A JP S6319714 A JPS6319714 A JP S6319714A JP 16445386 A JP16445386 A JP 16445386A JP 16445386 A JP16445386 A JP 16445386A JP S6319714 A JPS6319714 A JP S6319714A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wire
- ion
- copper
- implanted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims description 44
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 24
- 238000005260 corrosion Methods 0.000 description 18
- 230000007797 corrosion Effects 0.000 description 18
- 238000005336 cracking Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000005468 ion implantation Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052695 Americium Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、ポリエチレンなどによって絶縁被覆された
被覆電線用導体の製造方法に関し、特に電柱間等に架線
される被覆電線用導体の製造方法に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a conductor for a covered electric wire that is insulated with polyethylene or the like, and particularly relates to a method for manufacturing a conductor for a covered electric wire that is installed between utility poles, etc. .
[従来の技術]
電柱間などに架線される架空配電線用導体としては、従
来から硬銅線(タフピッチ銅や無酸素銅を冷間伸線加工
した線材)が使用されている。集合した複数本の硬銅線
は撚り合わせられ、この撚線上にポリエチレン、ポリ塩
化ビニルなどによる絶縁被覆が施される。また、硬銅線
を単線として用い、この単線上に絶縁被覆を施したもの
もある。[Prior Art] Hard copper wire (a wire made from cold-drawn tough pitch copper or oxygen-free copper) has traditionally been used as a conductor for overhead distribution lines installed between utility poles. A plurality of assembled hard copper wires are twisted together, and an insulating coating made of polyethylene, polyvinyl chloride, or the like is applied to the twisted wires. In addition, there is also one that uses a hard copper wire as a single wire and has an insulating coating applied to the single wire.
[発明が解決しようとする問題点コ
タフピッチ銅や無酸素銅に冷間伸線加工を施した場合、
得られた線材表面にしばしば残留応力が存在したりする
。残留応力としては、特に引張りの残留応力が存在する
。また、撚り合わせられた各硬銅線の表面には、撚りを
解除しようとする撚線反発力が必然的に生ずる。この撚
線反発力は、各硬銅線の表面上に引張り残留応力として
表われる。さらに、各硬銅線には、ドラムに巻かれてい
たときについた巻き癖に起因する残留応力が存在するこ
ともある。[Problems to be solved by the invention When cold wire drawing is applied to Kotafu pitch copper or oxygen-free copper,
Residual stress often exists on the surface of the obtained wire. The residual stress includes, in particular, tensile residual stress. Further, on the surface of each twisted hard copper wire, a stranded wire repulsion force that tends to untwist is inevitably generated. This twisted wire repulsive force appears as tensile residual stress on the surface of each hard copper wire. Furthermore, each hard copper wire may have residual stress due to curling curls formed when it was wound around a drum.
従来の被覆電線では、上述のような残留応力が1つの要
因となって断線を生じることがあった。In conventional coated electric wires, the residual stress as described above may be one of the causes of wire breakage.
すなわち、被0電線内に雨水が侵入したりすると、被覆
層内部は腐食しやすい環境となり、硬銅線表面に酸化被
膜が形成したりする。このような腐食環境と上述の残留
応力とが互いに影響し合うと硬銅線に応力腐食割れか生
じ、その結果断線にまで至る。That is, when rainwater enters the covered wire, the inside of the coating layer becomes a corrosive environment, and an oxide film is formed on the surface of the hard copper wire. When such a corrosive environment and the above-mentioned residual stress interact with each other, stress corrosion cracking occurs in the hard copper wire, resulting in wire breakage.
被覆電線用導体として軟銅線を用いれば、上述のような
残留応力が小さいので応力腐食割れ現象の生ずる可能性
は少なくなる。しかし、その反面、引張り強さの低下は
免れず、そのため実際上軟銅線を被覆電線用導体として
用いることはできない。If an annealed copper wire is used as the conductor for the covered electric wire, the residual stress as described above is small, so that the possibility of stress corrosion cracking occurring is reduced. However, on the other hand, the tensile strength inevitably decreases, and therefore, in practice, annealed copper wire cannot be used as a conductor for coated wires.
耐食性の優れた導体素線を得るために、硬銅線の表面に
Am、Zn、Sn、Ni等を電気めっきすることが考え
られる。しかし、めっき法によって被覆層を形成すれば
、その被覆層にはどうしてもピンホールが発生しやすく
なる。このようなピンホールがあれば、導体素線が腐食
雰囲気下に置かれたとき、ピンホール部分が集中的に腐
食され、その部分に応力腐食割れが生じたりする。また
、異種金属をめっきするものであるので、銅とめっき金
属との間で電食が生じたりすることもある。In order to obtain conductor wires with excellent corrosion resistance, it is possible to electroplate Am, Zn, Sn, Ni, etc. on the surface of hard copper wires. However, if the coating layer is formed by plating, pinholes are likely to occur in the coating layer. If such a pinhole exists, when the conductor wire is placed in a corrosive atmosphere, the pinhole portion will be intensively corroded, and stress corrosion cracking may occur in that portion. Furthermore, since dissimilar metals are plated, electrolytic corrosion may occur between the copper and the plated metal.
それゆえに、この発明の目的は、引張り強さを維持する
とともに、応力腐食割れ現象を生じさせない被覆電線用
導体を得ることのできる製造方法を提供することである
。Therefore, an object of the present invention is to provide a manufacturing method capable of obtaining a conductor for a coated electric wire that maintains tensile strength and does not cause stress corrosion cracking.
[問題点を解決するための手段]および[作用効果]
この発明に従った被覆電線用導体の製造方法は、第1図
に示すように、銅を主体とし、かつ長手方向に長く延び
た伸線加工組織を宵している導体1の表面に、N5Ar
、Ne、Heを含む群から選ばれた1種または2種以上
の元素をイオン注入することを特徴とする。第1図にお
いて、イオン注入層を参照番号2で示している。[Means for Solving the Problems] and [Operations and Effects] As shown in FIG. N5Ar is applied to the surface of the conductor 1 on which the wire-processed structure is formed.
, Ne, and He. In FIG. 1, the ion implantation layer is designated by reference number 2.
導体表面にN、Ar、Ne、Heを含む群から選ばれた
1種または2F[i以上の元素をイオン注入することに
より、導体表面に存在していた残留応力を緩和し、耐応
力腐食割れ性を向上させる。また、めっき法と異なり、
イオン注入法によって形成された表面層にはピンホール
が存在せず、その付着強度も大きい。したがって、導体
は優れた耐食性を有し、局部的に却って耐食性が劣化す
るということもない。さらに、異種金属が存在していな
いので、電食が生ずるおそれもない。しかも、銅導体の
汚染がないので、リサイクルにも有利である。By ion-implanting one or more elements selected from the group including N, Ar, Ne, and He into the conductor surface, the residual stress existing on the conductor surface is alleviated and stress corrosion cracking resistance is improved. Improve your sexuality. Also, unlike the plating method,
There are no pinholes in the surface layer formed by ion implantation, and its adhesion strength is high. Therefore, the conductor has excellent corrosion resistance, and the corrosion resistance does not deteriorate locally. Furthermore, since there are no dissimilar metals present, there is no risk of electrolytic corrosion occurring. Moreover, since there is no contamination of the copper conductor, it is advantageous for recycling.
イオン注入されるべき導体は、銅を主体とし、かつ長手
方向に長く延びた伸線加工組織を倚している。したがっ
て、導体は、その引張り強度が比較的大きく、被覆電線
用導体としての使用に耐え得るだけの引張り強さを維持
し得る。N、Ar、Ne、Heを含む群から選ばれた1
種または2種以上の元素からなるイオン注入層は、銅を
主体とする導体の接続特性を害しない。The conductor to be ion-implanted is mainly made of copper and has a drawn wire structure extending in the longitudinal direction. Therefore, the conductor has a relatively high tensile strength and can maintain a tensile strength sufficient to withstand use as a conductor for a covered electric wire. 1 selected from the group containing N, Ar, Ne, He
The ion-implanted layer consisting of a species or two or more elements does not impair the connection characteristics of the copper-based conductor.
第1図に示すようにイオン注入層2が形成された導体1
は、複数本撚り合わされ、この撚線上に絶縁被覆が施さ
れる。あるいは、第1図に示す導体1を単線として用い
、この単線上に絶縁被覆を施してもよい。A conductor 1 on which an ion-implanted layer 2 is formed as shown in FIG.
A plurality of wires are twisted together, and an insulating coating is applied to the twisted wires. Alternatively, the conductor 1 shown in FIG. 1 may be used as a single wire, and an insulating coating may be applied to the single wire.
なお、イオン注入されるべき導体は、単線に限られない
。たとえば、第2図に示すように、複数本の導体素線3
を撚り合わせ、この撚線導体の表面に8%Ar、Ne、
Heを含む群から選ばれた1種または2種以上の元素を
イオン注入してもよい。第2図において、イオン注入層
は参照番号4で示される。Note that the conductor to be ion-implanted is not limited to a single wire. For example, as shown in FIG.
are twisted together, and 8% Ar, Ne,
One or more elements selected from the group including He may be ion-implanted. In FIG. 2, the ion implantation layer is designated by reference number 4.
さらに、イオン注入されるべき導体は丸線である必要は
なく、たとえばテープ状の材料であってもよい。Furthermore, the conductor to be ion-implanted need not be a round wire, but may be, for example, a tape-shaped material.
以上のように、この発明によれば、引張り強さを維持す
るとともに、応力腐食割れ現象を生じさせない被覆電線
用導体を得ることができる。As described above, according to the present invention, it is possible to obtain a conductor for a covered electric wire that maintains tensile strength and does not cause stress corrosion cracking.
[実施例]
(1)実施例1
第1図に示した構造の導体を製造した。つまり、直径2
mmで引張り強さが48kg/mm2のタフピッチ銅線
の表面にNを加速電圧50KeVにてイオン注入した。[Examples] (1) Example 1 A conductor having the structure shown in FIG. 1 was manufactured. That is, diameter 2
N ions were implanted into the surface of a tough pitch copper wire with a tensile strength of 48 kg/mm 2 at an acceleration voltage of 50 KeV.
この際、表面厚さ0.2μmの領域内において、N原子
濃度が10%以上となるようにした。At this time, the N atom concentration was set to be 10% or more within a region with a surface thickness of 0.2 μm.
こうして得られたタフピッチ銅線の引張り強さは、Nを
イオン注入する前とほぼ同等であった。The tensile strength of the tough pitch copper wire thus obtained was almost the same as that before N ion implantation.
また、イオン注入後において導電率の低下もほとんど見
られなかった。Further, almost no decrease in conductivity was observed after ion implantation.
上述のようにして得られた導体に対して、引張り応力2
0kg/mm2、アンモニア水溶液での応力腐食割れテ
ストを行なったところ、従来のタフピッチ銅線の破断時
間の2倍の時間が経過しても破断しなかった。For the conductor obtained as described above, a tensile stress of 2
When a stress corrosion cracking test was conducted using an ammonia aqueous solution at 0 kg/mm2, the wire did not break even after twice the breaking time of conventional tough pitch copper wire.
(2) 実施例2
第3図に断面構造を模式的に示した厚さ0. 25mm
、幅25mmのベリリウム銅合金テープ5の片側表面の
厚さ0□ 1μmの領域内に、HeとNeとを加速電圧
150KeVにてイオン注入した。第3図では、イオン
注入層を参照番号6で示している。(2) Example 2 The cross-sectional structure is schematically shown in FIG. 3, and the thickness is 0. 25mm
, He and Ne were ion-implanted at an accelerating voltage of 150 KeV into a region with a thickness of 0 □ 1 μm on one side surface of a beryllium copper alloy tape 5 having a width of 25 mm. In FIG. 3, the ion implantation layer is designated by reference number 6.
こうして得られたテープを、イオン注入した側が外側に
なるように12.5Hの曲率でU字形に曲げて拘束し、
アンモニア蒸気雰囲気下にて放置した。比較のため、イ
オン注入されていないベリリウム銅合金テープを同様に
U字形に曲げて拘束してアンモニア蒸気雰囲気下にて放
置した。その結果、イオン注入したテープは、比較試料
が応力腐食割れのために破断した時間の3倍の時間が経
過してもまだ破断しなかった。The tape thus obtained was bent and restrained into a U-shape with a curvature of 12.5H so that the ion-implanted side was on the outside.
It was left in an ammonia vapor atmosphere. For comparison, a beryllium-copper alloy tape without ion implantation was similarly bent into a U-shape, restrained, and left in an ammonia vapor atmosphere. As a result, the ion-implanted tape still did not fracture even after three times the time that the comparative sample fractured due to stress corrosion cracking.
なお、本発明法によって得られたベリリウム銅合金テー
プを導体コネクタとして使用したところ、接続特性は良
好であった。Note that when the beryllium copper alloy tape obtained by the method of the present invention was used as a conductor connector, the connection characteristics were good.
(3) 実施例3
第4図に断面構造を模式的に示すように、タフピッチ銅
からなる導体素線7を19本撚り合わせ、この撚線導体
の表面にArを加速電圧200KeVにてイオン注入し
た。イオン注入した部分は、外部に露出している表面の
ところでほぼ0.2μm厚の領域内である。(3) Example 3 As the cross-sectional structure is schematically shown in FIG. 4, 19 conductor strands 7 made of tough pitch copper were twisted together, and Ar ions were implanted into the surface of the stranded conductor at an accelerating voltage of 200 KeV. did. The ion-implanted portion is within a region approximately 0.2 μm thick at the externally exposed surface.
こうして得られた撚線導体に対して、その撚り形状を両
端にて拘束した状態で以下の応力腐食割れテストを行な
った。The stranded wire conductor thus obtained was subjected to the following stress corrosion cracking test with its twisted shape restrained at both ends.
印加した応力=20kg/mm2
使用した溶液:NH,Cα 53.5g/ICuCIL
2 ・2H20
4,26g/店
アンモニア水 21cc/店
テスト方法:撚線導体の下端を上記溶液中に浸漬して、
70’C,36Hrで=常温、18Hrのサイクルで応
力腐食割れテストを行なった。Applied stress = 20 kg/mm2 Solution used: NH, Cα 53.5 g/ICuCIL
2 ・2H20 4.26g/store Ammonia water 21cc/store Test method: Immerse the lower end of the stranded conductor in the above solution,
A stress corrosion cracking test was conducted at a cycle of 70'C, 36 hours = normal temperature, 18 hours.
比較のために、イオン注入されていないタフピッチ銅か
らなる同一形状の撚線導体に同一条件の応力腐食割れテ
ストを行なった。この比較試料は、48日後に最外層の
素線から応力腐食割れを発生した。しかし、表面にイオ
ン注入層を有する本発明例である撚線導体は、96日後
であっても応力腐食割れを発生しなかった。For comparison, a stress corrosion cracking test was conducted under the same conditions on a stranded wire conductor of the same shape made of tough pitch copper without ion implantation. In this comparative sample, stress corrosion cracking occurred in the outermost layer of strands after 48 days. However, the stranded wire conductor according to the present invention having an ion-implanted layer on its surface did not suffer from stress corrosion cracking even after 96 days.
第1図は、この発明の方法によって得られた導体の一例
を模式的に示す断面図である。第2図は、この発明の方
法によって得られた導体の他の例を模式的に示す断面図
である。第3図は、この発明の方法によって得られた導
体のさらに他の例を模式的に示す断面図である。第4図
は、この発明の方法によって得られた導体のさらに他の
例を模式的に示す断面図である。
図において、1は導体、2はイオン注入層を示す。FIG. 1 is a cross-sectional view schematically showing an example of a conductor obtained by the method of the present invention. FIG. 2 is a cross-sectional view schematically showing another example of a conductor obtained by the method of the present invention. FIG. 3 is a cross-sectional view schematically showing still another example of a conductor obtained by the method of the present invention. FIG. 4 is a cross-sectional view schematically showing still another example of a conductor obtained by the method of the present invention. In the figure, 1 indicates a conductor and 2 indicates an ion-implanted layer.
Claims (3)
工組織を有している導体の表面に、N、Ar、Ne、H
eを含む群から選ばれた1種または2種以上の元素をイ
オン注入する、被覆電線用導体の製造方法。(1) N, Ar, Ne, H
A method for manufacturing a conductor for a covered electric wire, the method comprising ion-implanting one or more elements selected from the group including e.
1項に記載の被覆電線用導体の製造方法。(2) The method for manufacturing a covered electric wire conductor according to claim 1, wherein the conductor is a single wire conductor.
1項に記載の被覆電線用導体の製造方法。(3) The method for manufacturing a conductor for a covered electric wire according to claim 1, wherein the conductor is a stranded wire conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16445386A JPH0664948B2 (en) | 1986-07-12 | 1986-07-12 | Method for manufacturing conductor for coated electric wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16445386A JPH0664948B2 (en) | 1986-07-12 | 1986-07-12 | Method for manufacturing conductor for coated electric wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6319714A true JPS6319714A (en) | 1988-01-27 |
JPH0664948B2 JPH0664948B2 (en) | 1994-08-22 |
Family
ID=15793462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16445386A Expired - Lifetime JPH0664948B2 (en) | 1986-07-12 | 1986-07-12 | Method for manufacturing conductor for coated electric wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0664948B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0277570A (en) * | 1988-09-12 | 1990-03-16 | Mitsubishi Metal Corp | Method for preventing stress corrosion cracking of metal bolt |
WO2008043964A2 (en) * | 2006-10-11 | 2008-04-17 | Quertech Ingenierie | Copper layer comprising inserted nitrogen atoms, and associated implantation method |
-
1986
- 1986-07-12 JP JP16445386A patent/JPH0664948B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0277570A (en) * | 1988-09-12 | 1990-03-16 | Mitsubishi Metal Corp | Method for preventing stress corrosion cracking of metal bolt |
JP2560794B2 (en) * | 1988-09-12 | 1996-12-04 | 三菱マテリアル株式会社 | How to prevent stress corrosion cracking of metal bolts |
WO2008043964A2 (en) * | 2006-10-11 | 2008-04-17 | Quertech Ingenierie | Copper layer comprising inserted nitrogen atoms, and associated implantation method |
WO2008043964A3 (en) * | 2006-10-11 | 2008-07-03 | Quertech Ingenierie | Copper layer comprising inserted nitrogen atoms, and associated implantation method |
Also Published As
Publication number | Publication date |
---|---|
JPH0664948B2 (en) | 1994-08-22 |
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