JPS63193596A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS63193596A JPS63193596A JP2661187A JP2661187A JPS63193596A JP S63193596 A JPS63193596 A JP S63193596A JP 2661187 A JP2661187 A JP 2661187A JP 2661187 A JP2661187 A JP 2661187A JP S63193596 A JPS63193596 A JP S63193596A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- terminal
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000006732 Torreya nucifera Nutrition 0.000 description 1
- 244000111306 Torreya nucifera Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a printed wiring board.
従来、この種のプリント配線板の製造は第３図に示すよ
うに一枚の基板４内に端子部３を有する複数のプリント
配線板形成用領域１を編集し、ブランク加工、穴明け、
パネルめっき、回路形成、ソルダーレジスト形成及び端
子めっきをした後、外形加工を行い第４図のように個々
のプリント配線板ＩＡに切断し、その後第５図（ａ）に
示すように、端子部３をＢ−Ｂ’面まで端面研磨し、第
５図（ｂ）に示すような一端子３Ａを有するプリント配
線板ＩＡを得ていた。Conventionally, manufacturing of this type of printed wiring board involves editing a plurality of printed wiring board forming areas 1 having terminal portions 3 in one board 4, blanking, drilling, etc. as shown in FIG.
After panel plating, circuit formation, solder resist formation, and terminal plating, the external shape is processed and cut into individual printed wiring boards IA as shown in Fig. 4. Then, as shown in Fig. 5(a), terminal parts are formed. 3 was polished to the BB' plane to obtain a printed wiring board IA having one terminal 3A as shown in FIG. 5(b).
しかしながら、上述した従来のプリント配線板の製造法
では、複数のプリント配線板を１枚の基板より製作して
いるにもかかわらず端子めっき後複数のプリント配線板
に切断し、その個々について端面研磨を行うため以下の
ような欠点を有していた。However, in the conventional printed wiring board manufacturing method described above, although multiple printed wiring boards are manufactured from a single board, after terminal plating, the boards are cut into multiple printed wiring boards, and the edges of each board are polished. Because of this, it had the following drawbacks.
（１）切断する事によって処理すべき板枚数が増えるの
で、管理工数が増大する。(1) Cutting increases the number of boards to be processed, which increases management man-hours.
＜２）切断する事によって増えた処理板金てに端面研磨
を行うので製作工数が増大する。<2) The number of man-hours required for manufacturing increases as the number of processed sheet metals increased by cutting is required to perform edge polishing.
（３）未使用部分が多いため基板の使用効率が低下する
。(3) Since there are many unused parts, the usage efficiency of the board decreases.
本発明の目的は、上記欠点を除去し、基板の使用効率を
上げ、製作工数及び管理工数の低減されたプリン）〜配
線板の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing wiring boards that eliminates the above-mentioned drawbacks, increases the efficiency of use of the board, and reduces the number of manufacturing and management steps.
本発明のプリント配線板の製造方法は、基板上に隣り合
うプリント配線板の端子部が向き合いかつ接するように
プリント配線板形成用領域を編集する工程と、前記基板
をブランク加工したのち端子めっきを行う工程と、めっ
きされた前記端子部の境界線部を裏表よりＶ溝加工する
工程と、この■溝部より前記基板を切断する工程とを含
んで構成される。The method for manufacturing a printed wiring board of the present invention includes the steps of editing a printed wiring board forming area on the board so that the terminal parts of adjacent printed wiring boards face each other and are in contact with each other, and after blanking the board, terminal plating is performed. The method includes a step of forming a V-groove on the boundary line portion of the plated terminal portion from the front and back sides, and a step of cutting the substrate from the groove portion.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を説明するための平面図、第
２図（ａ）〜（ｃ）は第１図のＡ−Ａ’線における工程
順に示した拡大断面図である。FIG. 1 is a plan view for explaining one embodiment of the present invention, and FIGS. 2(a) to 2(c) are enlarged sectional views taken along the line AA' in FIG. 1 in the order of steps.
まず、第１図に示すように、基板４上に２枚のプリント
配線板形成用領域１を編集する。この時各プリント配線
板の端子部３がそれぞれ向き合いかつ接するように編集
する。その後、°公知の技術によりブランク加工、穴明
け、パネルめっき回路形成、ソルダーレジスト形成及び
端子めっきとしての金めつきを行う。この時の端子部３
近傍の断面図を第２図（ａ）に示す。First, as shown in FIG. 1, two printed wiring board forming areas 1 are edited on a substrate 4. At this time, the terminal portions 3 of each printed wiring board are edited so that they face each other and are in contact with each other. Thereafter, blank processing, hole drilling, panel plating circuit formation, solder resist formation, and gold plating as terminal plating are performed using known techniques. Terminal part 3 at this time
A sectional view of the vicinity is shown in FIG. 2(a).
次に、第２図（ｂ）に示すように、隣り合う端子部３の
外形境界線りに添ってＶ字状の切り溝５を基板４の表裏
から、■溝加工機または彫刻機等の工作機械にて穿設す
る。このＶ溝加工により２つのプリント配線板の外形境
界線り上に形成した端子めっき用リード線７が削除され
、各プリント配線板の端子３Ａが完成する。Next, as shown in FIG. 2(b), V-shaped cut grooves 5 are cut from the front and back of the board 4 along the external boundaries of the adjacent terminal parts 3 using a groove processing machine, engraving machine, etc. Drill using a machine tool. By this V-groove processing, the terminal plating lead wire 7 formed on the outer boundary line of the two printed wiring boards is removed, and the terminal 3A of each printed wiring board is completed.
次に、第２図（Ｃ）に示すように、プレス加工機により
、Ｖ４５より個々のプリント配線板に切断することによ
り、端子先端部が加工されたプリント配線板ＩＡを得る
ことができる。Next, as shown in FIG. 2(C), by cutting V45 into individual printed wiring boards using a press machine, printed wiring boards IA with processed terminal tips can be obtained.
以上説明したように本発明は、隣り合うプリント配線板
の端子部が向い合い、かつ接するようにプリント配線板
形成用領域を編集し、端子めつき後、端子部の境界線部
を■溝加工する事により、外形加工され個々のプリント
配線板に切断された時にはすでに端面研磨をした時と同
じ状態となっている。このなめ次の効果がある。As explained above, the present invention edits the printed wiring board forming area so that the terminal parts of adjacent printed wiring boards face each other and are in contact with each other, and after terminal plating, grooves are formed on the boundary line of the terminal parts. By doing this, when the external shape is processed and cut into individual printed wiring boards, the state is already the same as when the end faces were polished. This lick has the following effects.
（１）複数のプリント配線板の端面研磨を同時に行える
ため、処理枚数は変らず、管理工数は増えない。(1) Since the end faces of multiple printed wiring boards can be polished at the same time, the number of processed boards does not change and the number of management steps does not increase.
（２）複数のプリント配線板を一枚の基板内に編集した
状態で端面＠磨できるので、製作工数も従来の数分の−
で済む。(2) Since the edges of multiple printed wiring boards can be polished on a single board, the manufacturing time is reduced to just a few compared to the conventional method.
That's enough.
（３）基板の使用効率が向上するため、資材費の低減を
はかることができる。(3) Since the usage efficiency of the board is improved, material costs can be reduced.
第１図は本発明の一実施例を説明するための基板の平面
図、第２図（ａ）〜（ｃ）は第１図のＡ−Ａ’線におけ
る工程順に示した拡大断面図、第３図及び第４図は従来
のプリント配線板の製造方法を説明するための基板の平
面図、第５図（ａ）、（ｂ）は従来のプリント配線板の
端子部の加工方法を説明するための断面図である。
１・・・プリント配線板形成用領域、ＩＡ・・・プリン
ト配線板、３・・・端子部、３Ａ・・・端子、４・・・
基板、５・・・Ｖ溝、７・・・端子めっき用リード線。
代理人 弁理士 内 原 音ｔ
＄ ／ 圀
茅 ２Ｍｎ
茅 ５ 回FIG. 1 is a plan view of a substrate for explaining one embodiment of the present invention, FIGS. 2(a) to 2(c) are enlarged sectional views taken along line AA' in FIG. 3 and 4 are plan views of a board for explaining a conventional method of manufacturing a printed wiring board, and FIGS. 5(a) and 5(b) illustrate a conventional method of processing a terminal portion of a printed wiring board. FIG. DESCRIPTION OF SYMBOLS 1... Printed wiring board formation area, IA... Printed wiring board, 3... Terminal part, 3A... Terminal, 4...
Board, 5... V groove, 7... Lead wire for terminal plating. Agent Patent Attorney Uchihara Oto $ / Kuni Kaya 2Mn Kaya 5 times
Claims (1)
かつ接するようにプリント配線板形成用領域を編集する
工程と、前記基板をブランク加工したのち端子めっきを
行う工程と、めっきされた前記端子部の境界線部をＶ溝
加工する工程と、該Ｖ溝部より前記基板を切断する工程
とを含むことを特徴とするプリント配線板の製造方法。A step of editing a printed wiring board forming area so that the terminal parts of adjacent printed wiring boards face each other on the board and touch each other, a step of blanking the board and then plating the terminals, and a step of plating the terminal parts of the plated terminal parts. A method for manufacturing a printed wiring board, comprising the steps of forming a V-groove in a boundary line portion, and cutting the substrate from the V-groove portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2661187A JPS63193596A (en) | 1987-02-06 | 1987-02-06 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2661187A JPS63193596A (en) | 1987-02-06 | 1987-02-06 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193596A true JPS63193596A (en) | 1988-08-10 |
Family
ID=12198292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2661187A Pending JPS63193596A (en) | 1987-02-06 | 1987-02-06 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193596A (en) |
-
1987
- 1987-02-06 JP JP2661187A patent/JPS63193596A/en active Pending
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