JPS63191647U - - Google Patents
Info
- Publication number
- JPS63191647U JPS63191647U JP1987082912U JP8291287U JPS63191647U JP S63191647 U JPS63191647 U JP S63191647U JP 1987082912 U JP1987082912 U JP 1987082912U JP 8291287 U JP8291287 U JP 8291287U JP S63191647 U JPS63191647 U JP S63191647U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor chip
- insulating layer
- insulator
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 7
- 239000012212 insulator Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082912U JPH0526759Y2 (US06633600-20031014-M00021.png) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082912U JPH0526759Y2 (US06633600-20031014-M00021.png) | 1987-05-29 | 1987-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63191647U true JPS63191647U (US06633600-20031014-M00021.png) | 1988-12-09 |
| JPH0526759Y2 JPH0526759Y2 (US06633600-20031014-M00021.png) | 1993-07-07 |
Family
ID=30936002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987082912U Expired - Lifetime JPH0526759Y2 (US06633600-20031014-M00021.png) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526759Y2 (US06633600-20031014-M00021.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01273367A (ja) * | 1988-04-26 | 1989-11-01 | Iwasaki Electric Co Ltd | 発光ダイオード |
| JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
| JPH08298345A (ja) * | 1995-04-26 | 1996-11-12 | Shichizun Denshi:Kk | チップ型発光ダイオード |
| WO2004093204A1 (ja) * | 2003-04-16 | 2004-10-28 | Tabuchi Electric Co., Ltd. | 反射型発光ダイオード |
| WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614585U (US06633600-20031014-M00021.png) * | 1979-07-16 | 1981-02-07 | ||
| JPS5950762A (ja) * | 1982-09-01 | 1984-03-23 | パワトロン・デイビジヨン・オブ・コントラヴエス・ゴ−ツ・コ−ポレイシヨン | 永久磁石直流機およびその管状フレ−ム |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614585B2 (US06633600-20031014-M00021.png) * | 1972-07-21 | 1981-04-04 |
-
1987
- 1987-05-29 JP JP1987082912U patent/JPH0526759Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5614585U (US06633600-20031014-M00021.png) * | 1979-07-16 | 1981-02-07 | ||
| JPS5950762A (ja) * | 1982-09-01 | 1984-03-23 | パワトロン・デイビジヨン・オブ・コントラヴエス・ゴ−ツ・コ−ポレイシヨン | 永久磁石直流機およびその管状フレ−ム |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01273367A (ja) * | 1988-04-26 | 1989-11-01 | Iwasaki Electric Co Ltd | 発光ダイオード |
| JPH0311771A (ja) * | 1989-05-31 | 1991-01-21 | Siemens Ag | 表面実装可能なオプトデバイス |
| JPH08298345A (ja) * | 1995-04-26 | 1996-11-12 | Shichizun Denshi:Kk | チップ型発光ダイオード |
| WO2004093204A1 (ja) * | 2003-04-16 | 2004-10-28 | Tabuchi Electric Co., Ltd. | 反射型発光ダイオード |
| CN100394618C (zh) * | 2003-04-16 | 2008-06-11 | 株式会社珍珠电球制作所 | 反射型发光二极管 |
| WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
| JP5669866B2 (ja) * | 2011-02-09 | 2015-02-18 | 三菱電機株式会社 | パワー半導体モジュール |
| US9129949B2 (en) | 2011-02-09 | 2015-09-08 | Mitsubishi Electric Corporation | Power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526759Y2 (US06633600-20031014-M00021.png) | 1993-07-07 |
