JPS63191642U - - Google Patents
Info
- Publication number
- JPS63191642U JPS63191642U JP8236787U JP8236787U JPS63191642U JP S63191642 U JPS63191642 U JP S63191642U JP 8236787 U JP8236787 U JP 8236787U JP 8236787 U JP8236787 U JP 8236787U JP S63191642 U JPS63191642 U JP S63191642U
- Authority
- JP
- Japan
- Prior art keywords
- mini
- flat
- general
- dip
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係るミニフラツト
ＩＣ用アダプター基板を示す斜視図、第２図は従
来の汎用基板を示す斜視図である。
１０……ミニフラツトＩＣ用アダプター基板、
１１……ミニフラツトＩＣ用パツド部、１２……
スルーホール、１３……電源バイパスコンデンサ
用パツド部、１４……ミニフラツトＩＣ、１５…
…スルーホール、１６……ＤＩＰ型ＩＣ用汎用基
板、１７……接続ピン。
FIG. 1 is a perspective view showing a mini-flat IC adapter board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional general-purpose board. 10...Mini flat IC adapter board,
11... Mini flat IC pad part, 12...
Through hole, 13... Pad part for power supply bypass capacitor, 14... Mini flat IC, 15...
...Through hole, 16...General-purpose board for DIP type IC, 17...Connection pin.
Claims (1)
実装するミニフラツトＩＣ用アダプター基板であ
つて、ミニフラツトＩＣの実装に必要な電源バイ
パスコンデンサ用のパツド部及びミニフラツトＩ
Ｃ用パツド部と、ＤＩＰ型ＩＣ用汎用基板の取付
けピツチに相対するピツチのスルーホール及び該
スルーホールに設けるＤＩＰ型ＩＣ用汎用基板へ
の接続ピンとを備えることを特徴とするミニフラ
ツトＩＣ用アダプター基板。 This is an adapter board for mini-flat IC that mounts mini-flat IC on a general-purpose board for DIP type IC, and it includes a pad part for a power supply bypass capacitor necessary for mounting mini-flat IC and mini-flat I.
An adapter board for a mini-flat IC, characterized in that it is equipped with a C pad part, a through hole at a pitch opposite to a mounting pitch of a general-purpose board for a DIP-type IC, and a connection pin to the general-purpose board for a DIP-type IC provided in the through-hole. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8236787U JPS63191642U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8236787U JPS63191642U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191642U true JPS63191642U (en) | 1988-12-09 |
Family
ID=30934956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8236787U Pending JPS63191642U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017217211A1 (en) * | 2016-06-17 | 2017-12-21 | 株式会社村田製作所 | Sample kit, conversion substrate, and method for manufacturing electronic component mounting body |
-
1987
- 1987-05-29 JP JP8236787U patent/JPS63191642U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017217211A1 (en) * | 2016-06-17 | 2017-12-21 | 株式会社村田製作所 | Sample kit, conversion substrate, and method for manufacturing electronic component mounting body |
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