JPH0160573U - - Google Patents
Info
- Publication number
- JPH0160573U JPH0160573U JP15592487U JP15592487U JPH0160573U JP H0160573 U JPH0160573 U JP H0160573U JP 15592487 U JP15592487 U JP 15592487U JP 15592487 U JP15592487 U JP 15592487U JP H0160573 U JPH0160573 U JP H0160573U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hybrid
- fitted
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、実施例ハイブリツドＩＣを示す分解
斜視図、第２図は、実施例ハイブリツドＩＣをプ
リント基板に取付けた状態を示す正面図、第３図
は、支承部材の他の実施例を示す斜視図、第４図
は、支承部材の更に他の実施例を示す斜視図、第
５図は、従来のハイブリツドＩＣをプリント基板
に取付けた状態を示す側面図である。
１：混成集積回路本体、２：支承部材、３：プ
リント基板、２２：溝条、２４：固定具。
Fig. 1 is an exploded perspective view showing the hybrid IC of the embodiment, Fig. 2 is a front view of the hybrid IC of the embodiment mounted on a printed circuit board, and Fig. 3 shows another embodiment of the support member. FIG. 4 is a perspective view showing still another embodiment of the support member, and FIG. 5 is a side view showing a conventional hybrid IC mounted on a printed circuit board. 1: Hybrid integrated circuit main body, 2: Supporting member, 3: Printed circuit board, 22: Groove, 24: Fixing tool.
Claims (1)
、この混成集積回路本体の基板端部を嵌着する溝
条を備え、且つ下端部にプリント基板に対し圧入
固定する固定具を備えた一対の支承部材とから成
るハイブリツドＩＣ。 A hybrid integrated circuit body in which electronic components are mounted on a board, and a pair of supports each having a groove into which the end of the board of the hybrid integrated circuit body is fitted, and a fixture at the lower end to be press-fitted and fixed to the printed circuit board. A hybrid IC consisting of components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592487U JPH0160573U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592487U JPH0160573U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160573U true JPH0160573U (en) | 1989-04-17 |
Family
ID=31433990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15592487U Pending JPH0160573U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160573U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997024910A1 (en) * | 1995-12-28 | 1997-07-10 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Female terminal |
-
1987
- 1987-10-12 JP JP15592487U patent/JPH0160573U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997024910A1 (en) * | 1995-12-28 | 1997-07-10 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Female terminal |
| US5975963A (en) * | 1995-12-28 | 1999-11-02 | Kabushiki Kaisha Tokai Rika Denki Seisakusho | Female terminal |