JPS61136574U - - Google Patents

Info

Publication number
JPS61136574U
JPS61136574U JP1916185U JP1916185U JPS61136574U JP S61136574 U JPS61136574 U JP S61136574U JP 1916185 U JP1916185 U JP 1916185U JP 1916185 U JP1916185 U JP 1916185U JP S61136574 U JPS61136574 U JP S61136574U
Authority
JP
Japan
Prior art keywords
integrated circuit
height
circuit package
package
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1916185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1916185U priority Critical patent/JPS61136574U/ja
Publication of JPS61136574U publication Critical patent/JPS61136574U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の集積回路のパツケージの斜
視図、第2図は同上使用状態を示す正面図である
。 尚、図中符号Pは集積回路のパツケージ、1は
パツケージ本体、2は外部リード、3は外部リー
ドの支持脚である。
FIG. 1 is a perspective view of the integrated circuit package of this invention, and FIG. 2 is a front view showing the same in use. In the drawing, reference numeral P indicates a package of an integrated circuit, 1 is a package body, 2 is an external lead, and 3 is a supporting leg of the external lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] デユアル・インライン型の集積回路のパツケー
ジにおいて、外部リードの支持脚部分端よりパツ
ケージ本体下面に至る高さを、印刷配線板上に実
装された他の部品を跨ぐ高さ以上に設定したこと
を特徴とする集積回路のパツケージ。
In a dual in-line integrated circuit package, the height from the end of the support leg part of the external lead to the bottom surface of the package body is set to be greater than the height that straddles other components mounted on the printed wiring board. integrated circuit package.
JP1916185U 1985-02-15 1985-02-15 Pending JPS61136574U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1916185U JPS61136574U (en) 1985-02-15 1985-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1916185U JPS61136574U (en) 1985-02-15 1985-02-15

Publications (1)

Publication Number Publication Date
JPS61136574U true JPS61136574U (en) 1986-08-25

Family

ID=30508479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1916185U Pending JPS61136574U (en) 1985-02-15 1985-02-15

Country Status (1)

Country Link
JP (1) JPS61136574U (en)

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