JPS63191633U - - Google Patents
Info
- Publication number
- JPS63191633U JPS63191633U JP8275387U JP8275387U JPS63191633U JP S63191633 U JPS63191633 U JP S63191633U JP 8275387 U JP8275387 U JP 8275387U JP 8275387 U JP8275387 U JP 8275387U JP S63191633 U JPS63191633 U JP S63191633U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- push
- resin sheet
- pushes
- pushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は本考案の第１の実施例の側面図、第２
図ａ〜ｃはそれぞれ半導体素子の剥離動作を動作
順に説明するための第１図の実施例の側面図、第
３図は本考案の第２の実施例の側面図、第４図は
従来の半導体装置の組立装置の一例の側面図であ
る。
１……半導体素子、２……樹脂シート、３〜５
……突上げ針、６……突上げ枠、７〜１０……ア
クチユエータ、１１……排気口、１２……真空チ
ヤツク。
Figure 1 is a side view of the first embodiment of the present invention;
Figures a to c are side views of the embodiment of Figure 1 for explaining the peeling operation of semiconductor elements in the order of operation, Figure 3 is a side view of the second embodiment of the present invention, and Figure 4 is a side view of the conventional embodiment. FIG. 1 is a side view of an example of a semiconductor device assembly apparatus. 1...Semiconductor element, 2...Resin sheet, 3-5
... Push-up needle, 6... Push-up frame, 7 to 10... Actuator, 11... Exhaust port, 12... Vacuum chuck.
Claims (1)
ート側から突上げて剥離する突上げ部を備える半
導体装置の組立装置において、前記突上げ部は前
記半導体素子の周辺部を突上げる第１の組と、該
第１の組の突上げ後前記半導体素子の中央部を突
上げる第２の組とを有することを特徴とする半導
体装置の組立装置。 In a semiconductor device assembly apparatus including a push-up portion that pushes up and peels off a semiconductor element fixed to a resin sheet from the resin sheet side, the push-up portion includes a first set that pushes up a peripheral portion of the semiconductor element; A semiconductor device assembly apparatus comprising: a second set for pushing up the central portion of the semiconductor element after pushing up the first set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8275387U JPS63191633U (en) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8275387U JPS63191633U (en) | 1987-05-28 | 1987-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63191633U true JPS63191633U (en) | 1988-12-09 |
Family
ID=30935693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8275387U Pending JPS63191633U (en) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63191633U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162445A (en) * | 1990-10-24 | 1992-06-05 | Nec Corp | Pushing-up mechanism for pellet |
-
1987
- 1987-05-28 JP JP8275387U patent/JPS63191633U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162445A (en) * | 1990-10-24 | 1992-06-05 | Nec Corp | Pushing-up mechanism for pellet |