JPS63189255A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS63189255A JPS63189255A JP2143087A JP2143087A JPS63189255A JP S63189255 A JPS63189255 A JP S63189255A JP 2143087 A JP2143087 A JP 2143087A JP 2143087 A JP2143087 A JP 2143087A JP S63189255 A JPS63189255 A JP S63189255A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin layer
- thermal head
- coupling agent
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 23
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 20
- 150000003949 imides Chemical class 0.000 claims abstract description 14
- 229910000077 silane Inorganic materials 0.000 claims abstract description 7
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000004202 carbamide Substances 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims abstract description 4
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 claims abstract description 3
- -1 silane compound Chemical class 0.000 claims abstract 6
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 18
- 150000001408 amides Chemical class 0.000 claims description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 description 17
- 239000002966 varnish Substances 0.000 description 16
- 239000009719 polyimide resin Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 12
- 239000004962 Polyamide-imide Substances 0.000 description 11
- 229920002312 polyamide-imide Polymers 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、金属支持体上にイミド成分を含有する耐熱樹
脂層を形成し、この耐熱樹脂層上に多数の発熱抵抗体を
形成してなるサーマルヘッドに関する。Detailed Description of the Invention [Objective of the Invention] (Industrial Application Field) The present invention involves forming a heat-resistant resin layer containing an imide component on a metal support, and forming a large number of heat-generating resistors on this heat-resistant resin layer. It relates to a thermal head formed by a body.
（従来の技術）
近年、サーマルヘッドは、歩合、省保守、低ランニング
コスト等の利点を生かして、ファクシミリ、ワードプｏ
ｔ’ツサ用プリンタ等の各種記録装置に多用されるよう
になってぎている。一方、これらの機器は小形化、低価
格化が要請されでＪ３す、このためサーマルヘッドにも
小型で安価なものが望まれている。(Prior art) In recent years, thermal heads have been used in facsimile and word printers, taking advantage of their advantages such as commission rates, reduced maintenance, and low running costs.
It is increasingly being used in various recording devices such as t'printers. On the other hand, there is a demand for these devices to be smaller and lower in price, and therefore there is a desire for thermal heads to be smaller and cheaper.
ところで従来のサーマルヘッドは、へβ２０３純度が９
０％以上のアルミナセラミック基板の上にグレーズガラ
ス層を形成し、その上に多数の発熱体と、この発熱体に
接続された導電体を形成してなるものが多用されていた
。しかしながらこのようなサーマルヘッドに用いられる
セラミック基板は、その製造に際して、原料粉末からア
ルカリ金属成分を除去する処理、高温焼成、高温焼成時
に生じた基板の反りをとるための仕上げの研摩等の多く
の工程を必要とするため生産コストが高くなるという問
題があった。By the way, the conventional thermal head has a β203 purity of 9.
A glazed glass layer is formed on a 0% or more alumina ceramic substrate, and a large number of heating elements and conductors connected to the heating elements are formed on the glazed glass layer. However, the ceramic substrates used in such thermal heads undergo many processes during manufacturing, such as processing to remove alkali metal components from raw powder, high-temperature firing, and finishing polishing to remove warping of the substrate that occurs during high-temperature firing. There was a problem in that the production cost was high because it required a process.
このため、最近、金属基板上に熱の放散および蓄熱をコ
ントロールする保温層としてポリイミド樹脂層を形成し
、このポリイミド樹脂層上に多数の発熱抵抗体を形成し
てなる小型で安価なサーマルヘッドが提案されている（
昭和６１年度電子通信学会総合全国大会概要集（１９８
６）、 １−１２５および５−１２６）。For this reason, recently, a small and inexpensive thermal head has been developed in which a polyimide resin layer is formed on a metal substrate as a heat insulating layer to control heat dissipation and heat accumulation, and a large number of heating resistors are formed on this polyimide resin layer. Proposed(
Collection of summaries of the 1986 IEICE Comprehensive National Conference (198
6), 1-125 and 5-126).
このように金属基板上に耐熱性に優れたポリイミド樹脂
層を形成し、この上に発熱抵抗体を形成してなるサーマ
ルヘッドは、従来のアルミナ基板上にグレーズガラス層
を形成してなる基板を用いたサーマルヘッドと比較して
、熱効率に優れ、しかも曲げ加工が可能で小型化し易い
という特長を有しており、今後小型で安価な高性能のサ
ーマルヘッドとして有望視されている。Thermal heads, which are made by forming a highly heat-resistant polyimide resin layer on a metal substrate and forming a heat generating resistor on top of this, use a conventional substrate made by forming a glazed glass layer on an alumina substrate. Compared to the thermal head used, it has excellent thermal efficiency, can be bent, and is easily miniaturized, and is seen as a promising compact, inexpensive, high-performance thermal head in the future.
ところがこのポリイミド樹脂層を用いたサーマルヘッド
では、ポリイミド樹脂が耐熱性に楊めて濁れている特長
を有する半面、金属支持体Ｊ３よび発熱抵抗体との密着
性に乏しく、このため後工程や使用中にはがれが生じ易
いという問題があった。However, in the thermal head using this polyimide resin layer, although the polyimide resin has the characteristic of being heat resistant and cloudy, it has poor adhesion with the metal support J3 and the heat generating resistor, and therefore, it is difficult to use in post-processing. There was a problem in that it easily peeled off during use.
（発明が解決しようとする問題点）
このようにポリイミド樹脂層上に多数の発熱抵抗体を形
成してなるサーマルヘッドでは、ポリイミド樹脂が極め
て耐熱性に優れ、熱効率に優れ、また曲げ加工が可能で
小型化し易いという長所を有する半面、後工程や使用中
にはがれが生じ易いという問題があった。(Problems to be Solved by the Invention) In the thermal head in which a large number of heating resistors are formed on a polyimide resin layer, the polyimide resin has extremely high heat resistance and thermal efficiency, and can be bent. Although it has the advantage of being easily miniaturized, it has the problem that it tends to peel off during post-processing or during use.
本発明者等は、このような欠点を解消すべく鋭意研究を
すすめたところ、イミド成分を含有する耐熱樹脂にシラ
ンカップリング剤を含有させた場合、金属支持体および
発熱抵抗体との密着性が著しく向上し、しかも耐熱性も
向上することを見出した。The inventors of the present invention conducted extensive research in order to eliminate these drawbacks, and found that when a silane coupling agent is added to a heat-resistant resin containing an imide component, the adhesion between the metal support and the heat-generating resistor is improved. It has been found that the heat resistance is significantly improved and the heat resistance is also improved.
本発明はかかる知見に基いてなされたもので、金属基板
上に熱の放散および蓄熱をコントロールする保温層とし
て設けた耐熱樹脂層と金属支持体および発熱抵抗体との
密着性を向上さＶた、熱効率に優れ曲げ加工が可能で小
型化しやすく、安価で高性能のサーマルヘッドを提供す
ることを目的としている。The present invention was made based on this knowledge, and aims to improve the adhesion between the heat-resistant resin layer provided on the metal substrate as a heat-retaining layer for controlling heat dissipation and heat accumulation, and the metal support and heat-generating resistor. The aim is to provide an inexpensive, high-performance thermal head that has excellent thermal efficiency, can be bent, is easy to downsize, and is inexpensive.
［発明の構成［
（問題点を解決するための手段）
本発明のサーマルヘッドは、金属支持体と、この金属支
持体上に形成されたイミド成分を含有する耐熱樹脂層と
、このイミド成分を含有する耐熱樹脂層上に形成された
多数の発熱抵抗体と、これら各発熱抵抗体に接続された
導電体とを備えてなるサーマルヘッドにおいて、前記イ
ミド成分を含有する耐熱樹脂層が、シランカップリング
剤を含有することを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The thermal head of the present invention includes a metal support, a heat-resistant resin layer containing an imide component formed on the metal support, and a heat-resistant resin layer containing the imide component. In a thermal head comprising a large number of heating resistors formed on a heat-resistant resin layer containing a heat-resistant resin layer, and a conductor connected to each heat-generating resistor, the heat-resistant resin layer containing an imide component is formed on a silane cup. It is characterized by containing a ring agent.
本発明に使用されるイミド成分を含有する耐熱樹脂とし
ては、ポリイミド樹脂、イミド成分とアミド成分とを任
意のモル比で含有するポリアミドイミド樹脂、分子構造
中にイミド基を含有する共重合体、その他これらの樹脂
とポリアミド樹脂との混合物等が挙げられる。The heat-resistant resin containing an imide component used in the present invention includes a polyimide resin, a polyamide-imide resin containing an imide component and an amide component in an arbitrary molar ratio, a copolymer containing an imide group in its molecular structure, Other examples include mixtures of these resins and polyamide resins.
また、本発明に使用されるシランカップリング剤として
は、例えばγ−アミノプロピルトリエトキシシラン、Ｎ
−７エニルーγ−アミノプロピルトリメトキシシランの
ようなアミノ結合を有するシラン化合物やγ−ウレイド
プロピルトリメトキシシランのような尿素結合を有する
シラン化合物が挙げられる。Further, examples of the silane coupling agent used in the present invention include γ-aminopropyltriethoxysilane, N
Examples include silane compounds having an amino bond such as -7enyl-γ-aminopropyltrimethoxysilane and silane compounds having a urea bond such as γ-ureidopropyltrimethoxysilane.
これらのシランカップリング剤は１種または２種以上で
使用される。These silane coupling agents may be used alone or in combination of two or more.
これらのシランカップリング剤は、耐熱樹脂としてポリ
イミド樹脂やポリアミドイミド樹脂を用いる場合は、こ
れらの前駆体であるポリアミック酸を有機溶剤に溶解さ
せたワニスに添加して用いられる。また、環化型のポリ
イミド樹脂やポリアミドイミド樹脂を用いる場合には、
すでに閉環したこれらの樹脂を有機溶剤に溶解させたワ
ニスに任意の比率で添加し分散させて使用される。When using polyimide resin or polyamideimide resin as the heat-resistant resin, these silane coupling agents are added to a varnish prepared by dissolving polyamic acid, which is a precursor thereof, in an organic solvent. In addition, when using cyclized polyimide resin or polyamideimide resin,
These resins, which have already been ring-closed, are added to a varnish prepared by dissolving them in an organic solvent at any desired ratio, and then dispersed therein.
なお前述したシランカップリング剤の添加量は、耐熱樹
脂層中に０．０５〜１０重足％程度とすることが望まし
い。The amount of the above-mentioned silane coupling agent added to the heat-resistant resin layer is preferably about 0.05 to 10% by weight.
（作 用）
本発明のサーマルヘッドにおいては、耐熱樹脂層を、金
属支持体および発熱抵抗体と、耐熱樹脂層との密着性を
向上させることが可能となる。(Function) In the thermal head of the present invention, it is possible to improve the adhesion between the heat-resistant resin layer, the metal support and the heating resistor, and the heat-resistant resin layer.
（実施例） 以下、本発明の実施例を図面を参照しながら説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
この実施例のサーマルヘッドは、Ｆｅ合金からなる金属
基板１上に、厚さ５〜１００μｍ、好ましくは１０〜５
０μｌのシランカップリング剤含有ポリアミドイミド樹
脂層２が形成され、その上にＴａ−８ｉｏｚ 、 Ｃｒ
−５ｉｏｚ、Ｔｉ−３ｉｏｚ等からなる発熱抵抗体３が
形成され°Ｃいる。この発熱抵抗体３上には、発熱部４
となる開口を形成すること＜ＡＪ２、Ａ１．−８ｉ等か
らなる個別電極５および共通電極６が形成され、少なく
ともこの発熱部４を被覆するようにへβ２０３等からな
る酸化防止兼耐摩耗膜７が形成されている。The thermal head of this embodiment has a thickness of 5 to 100 μm, preferably 10 to 5 μm, on a metal substrate 1 made of an Fe alloy.
A silane coupling agent-containing polyamideimide resin layer 2 of 0 μl was formed, and Ta-8ioz, Cr
A heating resistor 3 made of -5ioz, Ti-3ioz, etc. is formed at a temperature of -5ioz, Ti-3ioz, or the like. On this heating resistor 3, there is a heating section 4.
Forming an opening such that <AJ2, A1. Individual electrodes 5 and common electrodes 6 made of -8i or the like are formed, and an oxidation-preventing and wear-resistant film 7 made of β203 or the like is formed so as to cover at least the heat generating portion 4.
この実施例のシランカップリング剤含有ポリアミドイミ
ド樹脂層２は、下記の（Ｉ）式で表されるポリイミド樹
脂を有機溶剤・に溶解させたポリイミドワニスと下記の
（ＩＩ）式で表されるポリアミド樹脂を有機溶剤に溶解
してなるポリアミドワニスとを重量比で８．５：１．５
（樹脂分）に混合し、さらに下記の（ＩＩＩ）式で表さ
れるγ−アミノプロピルトリエトキシシランを０．５重
ω％添加、分散させたポリアミドイミドワニスを塗布、
焼付けすることにより形成されたものである。The silane coupling agent-containing polyamide-imide resin layer 2 of this example is made of a polyimide varnish obtained by dissolving a polyimide resin represented by the following formula (I) in an organic solvent and a polyamide represented by the following formula (II). The weight ratio of polyamide varnish made by dissolving resin in an organic solvent is 8.5:1.5.
(resin content), and further added and dispersed polyamideimide varnish of 0.5 weight ω% of γ-aminopropyltriethoxysilane represented by the following formula (III),
It is formed by baking.
・・・（Ｉ）
Ｈ２ＮＣ３Ｈ６Ｓｉ （ＯＣ２Ｈｓ ） ３・・・（Ｉ
ＩＩ）
なり、式中Ｘは−ｏ−０−ｏ−Ｏ−ｏ−１ｎＧ；ＬＩ１
７）ａを表わす。...(I) H2NC3H6Si (OC2Hs) 3...(I
II) where X is -o-0-o-O-o-1nG; LI1
7) Represents a.
そしてこのサーマルヘッドは、個別電極５と共通電極６
との間に所定の時間間隔でパルス電圧を印加することに
より発熱部４の発熱抵抗体３が発熱し印字記録が行われ
る。This thermal head has an individual electrode 5 and a common electrode 6.
By applying a pulse voltage at predetermined time intervals between the two, the heating resistor 3 of the heating section 4 generates heat, and printing is performed.
このサーマルヘッドは、例えば次のようにして製造され
る。This thermal head is manufactured, for example, as follows.
まず、例えばＣｒを１６重量％含有する厚さ０．３ｍｌ
程度のＦｅ合金からなる金属基板１をレベリング後、所
定の寸法に切断し、脱脂、洗浄および乾水素雰囲気中で
６００℃〜８００℃の温度で熱処理を行う。次に、前述
したシランカップリング剤の添加されたポリアミドイミ
ドワニスを、ローラーコーターやスピオンコーターを用
いて金属基板１上に所定の膜厚に塗布し、焼成炉を用い
て窒素ガス雰囲気中で１００℃１時間、次いで２００℃
１時間の加熱を行い溶媒を除去、成膜し耐熱樹脂層２を
形成する。First, for example, 0.3 ml thick containing 16% by weight of Cr.
After leveling, a metal substrate 1 made of a Fe alloy of about 100 mL is cut into predetermined dimensions, and subjected to degreasing, cleaning, and heat treatment at a temperature of 600 DEG C. to 800 DEG C. in a dry hydrogen atmosphere. Next, the polyamide-imide varnish to which the above-mentioned silane coupling agent has been added is applied to the metal substrate 1 to a predetermined thickness using a roller coater or spin-on coater, and then in a nitrogen gas atmosphere using a baking furnace. 100℃ for 1 hour, then 200℃
Heating is performed for 1 hour to remove the solvent and form a film to form the heat-resistant resin layer 2.
しかる後、この耐熱樹脂層２上にスパッタリングやその
他公知の方法によりＴａ−８ｉ１２、Ｑｒ−８ｉ０２、
Ｔｉ−８１０２等からなる発熱抵抗体３を形成し、ざら
にこの発熱抵抗体３上に発熱部４となる開口が形成され
るようにスパッタリング、その他公知の方法により／ｌ
、／ｌ−８ｉ１Ａぶ一３ｉ−ＣｕあるいはＡｕ等からな
る個別電極５および共通電極６を形成し、この発熱部４
を被覆するように ・
八ぶ２０３からなる酸化防止膜兼耐摩耗膜７を、例えば
イオンブレーティング法等で形成する。After that, Ta-8i12, Qr-8i02,
A heat-generating resistor 3 made of Ti-8102 or the like is formed, and then sputtering or other known methods are used to roughly form openings on the heat-generating resistor 3 to form the heat-generating portion 4.
, /l-8i1Abuichi3i-The individual electrodes 5 and the common electrode 6 made of Cu, Au, etc. are formed, and this heating part 4
・An oxidation-preventing film/wear-resistant film 7 made of Yabu 203 is formed by, for example, an ion blating method.
このサーマルヘッドの製造過程において、ボリイミド樹
脂表面の付着力および耐熱性について評価した。During the manufacturing process of this thermal head, the adhesion and heat resistance of the polyimide resin surface were evaluated.
第２図はシランカップリング剤の添加量と引張り試験か
ら求めた付着強度および熱重υ測定より求めた熱分解開
始温度を、シランカップリング剤の添加量の関数として
示した図である。第２図の結果からシランカップリング
剤の添加量は０．０５〜１０重間％程度の範囲が好まし
いことがわかる。FIG. 2 is a diagram showing the amount of silane coupling agent added, the adhesion strength determined from a tensile test, and the thermal decomposition initiation temperature determined from thermogravimetry as a function of the amount of silane coupling agent added. From the results shown in FIG. 2, it can be seen that the amount of the silane coupling agent added is preferably in the range of about 0.05 to 10% by weight.
また同図からシランカップリング剤の添加により、耐熱
性が向上することがわかる。同様の効果はシランカップ
リング剤として、＜ ＩＶ ）式で表されるＮ−７エニ
ルーγ−アミノプロピルトリメトキシシランや、（Ｖ）
式で示されるγ−ウレイドプロピルトリメト↑ジシラン
を用いた場合にも同様に得ることができた。The figure also shows that heat resistance is improved by adding a silane coupling agent. A similar effect can be obtained by using N-7enyl-γ-aminopropyltrimethoxysilane represented by the formula <IV) or (V) as a silane coupling agent.
A similar result could be obtained using γ-ureidopropyltrimeth↑disilane shown by the formula.
◎巾０・１１・５ｉ（０°Ｈ・）・
・・・（ｒＶ）
１１２ ＮＣ０ＮＩＩ（ＣＨ２） ３５ｉ（０１ｔｈ・
・・（Ｖ）
なお通常芳香族のポリイミドワニスやポリアミドイミド
ワニスは、これらの前駆体であるポリアミック酸の状態
で有機溶剤に溶解させ、焼付は段階で脱水縮合によりイ
ミド環を形成するものがほとんどである。このようなワ
ニスでは焼付は時の脱水により塗膜中のボイドやピンホ
ールが生じ易く、また真空中で着膜させる際、ガスの放
出を多くづる問題が生ずるが、実施例で用いたようなす
でに閉環反応の終ったポリイミド樹脂やポリアミドイミ
ド樹脂を有機溶剤に溶解させたワニスでは、このような
問題が発生せず、しかも焼付ｔノ温度を未閉環のワニス
の場合の約４５０℃に対して２００℃と低くすることが
できる利点がある。また未環化タイプのポリイミドワニ
スやポリアミドイミドワニスは、保管中しばしば分子間
で架橋し、部分ゲル化を起こすため接着強度が大幅に低
下したりするが、閉環したタイプのワニスを使用するこ
とによりこのような問題も解消することができる。なお
本発明は、環化タイプのりニスに限らず、未環化のタイ
プのポリイミドワニスやポリアミドイミドワニス用いた
場合にも有効である。◎Width 0.11.5i (0°H.) ... (rV) 112 NC0NII (CH2) 35i (01th.
...(V) Usually, aromatic polyimide varnishes and polyamide-imide varnishes are dissolved in an organic solvent in the form of their precursor polyamic acid, and most of them are baked to form imide rings through dehydration condensation in the baking step. It is. With such varnishes, voids and pinholes are likely to occur in the coating film due to dehydration during baking, and when the film is deposited in a vacuum, there is a problem that a large amount of gas is released. Varnishes made by dissolving polyimide resins or polyamideimide resins in which the ring-closing reaction has already been completed in an organic solvent do not cause this problem, and the baking temperature is lower than about 450°C for unclosed varnishes. There is an advantage that the temperature can be as low as 200°C. In addition, uncyclized polyimide varnish and polyamideimide varnish often cross-link between molecules during storage, causing partial gelation, which can significantly reduce adhesive strength. Such problems can also be solved. Note that the present invention is effective not only when using a cyclized type glue varnish, but also when using a non-cyclized type polyimide varnish or polyamide-imide varnish.
また本発明では金属支持体を用いているので、この金属
支持体を共通電極として用い、さらに生産コストを低減
させることも可能である。さらに酸化防止兼耐摩耗膜は
必ずしも全面に設ける必要はなく、少なくとも発熱部上
に形成されていれば充分その機能を発揮覆る。Furthermore, since a metal support is used in the present invention, it is also possible to use this metal support as a common electrode to further reduce production costs. Further, the oxidation-preventing and wear-resistant film does not necessarily need to be provided on the entire surface, but as long as it is formed at least on the heat generating part, it will sufficiently perform its function.
［発明の効果］
以上説明したように本発明においては、金属支持体上に
形成されたイミド成分を含有する耐熱樹脂中にシランカ
ップリング剤を含有させたので、金属支持体および発熱
抵抗体との密着性が著しく向上し、また耐熱性も向上し
、これにより信頼性に優れ、安価でかつ小型化されたサ
ーマルヘッドを提供することができる。[Effects of the Invention] As explained above, in the present invention, a silane coupling agent is contained in a heat-resistant resin containing an imide component formed on a metal support, so that the metal support and the heat generating resistor are bonded together. The adhesion is significantly improved, and the heat resistance is also improved, making it possible to provide a thermal head that is highly reliable, inexpensive, and compact.
第１図は本発明の一実施例のサーマルヘッドの要部を拡
大して示す断面図、第２図はシランカップリング剤の添
加量と付着強度および熱分解開始温度との関係を示した
グラフである。
１・・・・・・・・・・・・金属基板
２・・・・・・・・・・・・耐熱樹脂層３・・・・・・
・・・・・・発熱抵抗体４・・・・・・・・・・・・発
熱部
５・・・・・・・・・・・・個別電極
６・・・・・・・・・・・・共通電極
７・・・・・・・・・・・・酸化防止膜兼耐摩耗膜出願
人 株式会社 東 ２
周 東芝ケミカル株式会社
代理人弁理士 須 山 佐 −
第１図
シラン〃フプソンク”＃１添加量 （車量Ｘ）第２図Fig. 1 is an enlarged cross-sectional view of the main parts of a thermal head according to an embodiment of the present invention, and Fig. 2 is a graph showing the relationship between the amount of silane coupling agent added, adhesion strength, and thermal decomposition initiation temperature. It is. 1...Metal substrate 2...Heat-resistant resin layer 3...
・・・・・・Heating resistor 4・・・・・・・・・Heating part 5・・・・・・・・・Individual electrode 6・・・・・・・・・・・・・・Common electrode 7・・・・・・・・・・・・・ Anti-oxidation film and wear-resistant film Applicant: 2nd Shu Higashi Co., Ltd. Toshiba Chemical Co., Ltd. Representative Patent Attorney Sasu Suyama − Figure 1 Silan “Hupsonk” #1 Addition amount (vehicle amount x) Figure 2
Claims (5)
ミド成分を含有する耐熱樹脂層と、このイミド成分を含
有する耐熱樹脂層上に形成された多数の発熱抵抗体と、
これら各発熱抵抗体に接続された導電体とを備えてなる
サーマルヘッドにおいて、 前記イミド成分を含有する耐熱樹脂層が、シランカップ
リング剤を含有することを特徴とするサーマルヘッド。(1) a metal support, a heat-resistant resin layer containing an imide component formed on the metal support, and a large number of heating resistors formed on the heat-resistant resin layer containing the imide component;
A thermal head comprising a conductor connected to each heating resistor, wherein the heat-resistant resin layer containing the imide component contains a silane coupling agent.
るシラン化合物および尿素結合を有するシラン化合物か
ら選ばれた少くとも１種からなることを特徴とする特許
請求の範囲第１項記載のサーマルヘッド。(2) The thermal head according to claim 1, wherein the silane coupling agent comprises at least one selected from a silane compound having an amino bond and a silane compound having a urea bond.
ミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−
アミノプロピルトリメトキシシランのいずれかであるこ
とを特徴とする特許請求の範囲第２項記載のサーマルヘ
ッド。(3) The silane compound having an amino bond is γ-aminopropyltriethoxysilane, N-phenyl-γ-
The thermal head according to claim 2, characterized in that it is any one of aminopropyltrimethoxysilane.
イドプロピルトリメトキシシランであることを特徴とす
る特許請求の範囲第２項記載のサーマルヘッド。(4) The thermal head according to claim 2, wherein the silane compound having a urea bond is γ-ureidopropyltrimethoxysilane.
造中にアミド成分を含有することを特徴とする特許請求
の範囲第１項ないし第４項のいずれか１項記載のサーマ
ルヘッド。(5) The thermal head according to any one of claims 1 to 4, wherein the heat-resistant resin layer containing an imide component contains an amide component in its molecular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2143087A JPS63189255A (en) | 1987-01-31 | 1987-01-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2143087A JPS63189255A (en) | 1987-01-31 | 1987-01-31 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63189255A true JPS63189255A (en) | 1988-08-04 |
Family
ID=12054771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2143087A Pending JPS63189255A (en) | 1987-01-31 | 1987-01-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63189255A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469667A (en) * | 1987-08-21 | 1989-03-15 | Du Pont | Polyimide coating composition |
| JPH0288677A (en) * | 1988-09-27 | 1990-03-28 | Ube Ind Ltd | Polyimidesiloxane composition |
| JPH04366194A (en) * | 1991-06-12 | 1992-12-18 | Shin Etsu Chem Co Ltd | Primer composition and semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595648A (en) * | 1982-07-02 | 1984-01-12 | Oki Electric Ind Co Ltd | Manufacture of multilayer wiring structure |
| JPS59179651A (en) * | 1983-03-31 | 1984-10-12 | Nitto Electric Ind Co Ltd | Heat-resistant, electrically conductive paste composition |
| JPS59179650A (en) * | 1983-03-31 | 1984-10-12 | Nitto Electric Ind Co Ltd | Heat-resistant, electrically conductive paste composition |
| JPS61295057A (en) * | 1985-06-24 | 1986-12-25 | Toshiba Corp | Thermal head and its preparation |
-
1987
- 1987-01-31 JP JP2143087A patent/JPS63189255A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595648A (en) * | 1982-07-02 | 1984-01-12 | Oki Electric Ind Co Ltd | Manufacture of multilayer wiring structure |
| JPS59179651A (en) * | 1983-03-31 | 1984-10-12 | Nitto Electric Ind Co Ltd | Heat-resistant, electrically conductive paste composition |
| JPS59179650A (en) * | 1983-03-31 | 1984-10-12 | Nitto Electric Ind Co Ltd | Heat-resistant, electrically conductive paste composition |
| JPS61295057A (en) * | 1985-06-24 | 1986-12-25 | Toshiba Corp | Thermal head and its preparation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469667A (en) * | 1987-08-21 | 1989-03-15 | Du Pont | Polyimide coating composition |
| JPH0288677A (en) * | 1988-09-27 | 1990-03-28 | Ube Ind Ltd | Polyimidesiloxane composition |
| JPH04366194A (en) * | 1991-06-12 | 1992-12-18 | Shin Etsu Chem Co Ltd | Primer composition and semiconductor device |
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