JPS63188945U - - Google Patents

Info

Publication number
JPS63188945U
JPS63188945U JP1987080603U JP8060387U JPS63188945U JP S63188945 U JPS63188945 U JP S63188945U JP 1987080603 U JP1987080603 U JP 1987080603U JP 8060387 U JP8060387 U JP 8060387U JP S63188945 U JPS63188945 U JP S63188945U
Authority
JP
Japan
Prior art keywords
lead
leads
land
thin metal
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987080603U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0539630Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080603U priority Critical patent/JPH0539630Y2/ja
Publication of JPS63188945U publication Critical patent/JPS63188945U/ja
Application granted granted Critical
Publication of JPH0539630Y2 publication Critical patent/JPH0539630Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1987080603U 1987-05-26 1987-05-26 Expired - Lifetime JPH0539630Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080603U JPH0539630Y2 (https=) 1987-05-26 1987-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080603U JPH0539630Y2 (https=) 1987-05-26 1987-05-26

Publications (2)

Publication Number Publication Date
JPS63188945U true JPS63188945U (https=) 1988-12-05
JPH0539630Y2 JPH0539630Y2 (https=) 1993-10-07

Family

ID=30931558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080603U Expired - Lifetime JPH0539630Y2 (https=) 1987-05-26 1987-05-26

Country Status (1)

Country Link
JP (1) JPH0539630Y2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340677A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd ワイヤボンダの押さえパーツおよび支持パーツ
JP2017055031A (ja) * 2015-09-11 2017-03-16 トヨタ自動車株式会社 ワイヤ接続方法と端子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340677A (ja) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd ワイヤボンダの押さえパーツおよび支持パーツ
JP2017055031A (ja) * 2015-09-11 2017-03-16 トヨタ自動車株式会社 ワイヤ接続方法と端子

Also Published As

Publication number Publication date
JPH0539630Y2 (https=) 1993-10-07

Similar Documents

Publication Publication Date Title
JPS63188945U (https=)
JPS63278264A (ja) Ｍｏｓｆｅｔモジユ−ル
JPS63187330U (https=)
JPH0446544U (https=)
JPS61203564U (https=)
JPS5858354U (ja) 半導体装置用リ−ドフレ−ム
JPS63201331U (https=)
JPH0176043U (https=)
JPS6037253U (ja) 半導体装置
JPS646041U (https=)
JPS60153543U (ja) 半導体装置用リ−ドフレ−ム
JPS61127635U (https=)
JPS58422U (ja) ワイヤボンデイングの接続構造
JPH0328730U (https=)
JPS6219737U (https=)
JPH0165134U (https=)
JPH0224548U (https=)
JPS62204327U (https=)
JPH0390444U (https=)
JPS63115217U (https=)
JPS63153535U (https=)
JPH0498857A (ja) 半導体装置用パッケージ
JPH01135736U (https=)
JPS58144835U (ja) ワイヤボンデイング用ヒ−トステ−ジ
JPS62199949U (https=)