JPS63186878A - Sheet for heat conduction - Google Patents
Sheet for heat conductionInfo
- Publication number
- JPS63186878A JPS63186878A JP62016728A JP1672887A JPS63186878A JP S63186878 A JPS63186878 A JP S63186878A JP 62016728 A JP62016728 A JP 62016728A JP 1672887 A JP1672887 A JP 1672887A JP S63186878 A JPS63186878 A JP S63186878A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- corrosion resistance
- thermal conductivity
- heat conduction
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005260 corrosion Methods 0.000 claims abstract description 11
- 230000007797 corrosion Effects 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Abstract
Description
【発明の詳細な説明】
〔概要〕
本発明は伝導冷却に用いる熱伝導用シートの熱伝導性と
耐食性を改善するために＋ Ｉｎシートの表面にＡｕ
またはＡｕゝＫＮｉ等の貴金属めっき保護層を施したも
のである。[Detailed Description of the Invention] [Summary] In order to improve the thermal conductivity and corrosion resistance of a thermally conductive sheet used for conduction cooling, the present invention incorporates Au on the surface of a +In sheet.
Alternatively, a protective layer of precious metal plating such as Au or KNi is applied.
本発明は、半導体素子などの冷却方法に関する。 The present invention relates to a method for cooling semiconductor devices and the like.
良くするために、Ｉｎ等の熱伝導用シート４をはさんで
いた。In order to improve the performance, a heat conductive sheet 4 made of In or the like was sandwiched.
Ｉｎ等の熱伝導用シート４は、放熱用フィン５と回路基
板ｌ上にはんだ２Ｖｃより接合された半導体素子３との
間の押圧力を均一化し両表面に密着されることにより、
熱伝導性を良好にする作用を有する。The heat conductive sheet 4 made of In or the like equalizes the pressing force between the heat dissipation fin 5 and the semiconductor element 3 bonded to the circuit board l by solder 2Vc and is brought into close contact with both surfaces.
It has the effect of improving thermal conductivity.
第３図は第２図のより詳細な斜視図であり、放熱用フィ
ン（ベローズ）５は冷却管６に接続され冷却水７により
冷却される。FIG. 3 is a more detailed perspective view of FIG. 2, and the heat radiation fins (bellows) 5 are connected to a cooling pipe 6 and cooled by cooling water 7.
従来の熱伝導用Ｉｎシートでは、Ｉｎの耐食性が劣るた
め、真空あるいは不活性ガスなど雰囲気でしか用いるこ
とができなかった。空気中等酸化性雰囲気中では熱伝導
用Ｉｎシートが表面より次第に酸化され、Ｉｎｇｏｎ等
の熱伝導性の悪い、柔軟性の乏しい酸化物が生じ、半導
体素子と放熱用フィンとの間の熱伝導特性を劣化させる
。Conventional heat-conducting In sheets can only be used in vacuum or inert gas atmospheres because of the poor corrosion resistance of In. In an oxidizing atmosphere such as air, the heat conductive In sheet is gradually oxidized from the surface, producing oxides with poor thermal conductivity and poor flexibility such as Ingon, which deteriorates the thermal conductivity between the semiconductor element and the heat dissipation fin. deteriorate.
本発明は、Ｉｎシートの柔軟性をそこなわない範囲でＡ
ｕまたはＡｕ／Ｎｉのめっきを表面に施し。In the present invention, A
U or Au/Ni plating applied to the surface.
耐食性を改善するようにしたものである。It is designed to improve corrosion resistance.
Ｉｎシートに耐蝕性・熱伝導性良好な保設層全設けるこ
とにより、熱伝導用シートの熱伝導性及び耐食性を改善
でき信頼性を向上しうる。By providing all the storage layers with good corrosion resistance and thermal conductivity on the In sheet, the thermal conductivity and corrosion resistance of the thermally conductive sheet can be improved and the reliability can be improved.
厚さ１鎮のＩｎシートに、２μｍの厚さＫＡｕ（または
Ａｕ／Ｎｉ ）を無電解めっ龜する。このようにすれば
＋ Ｉｎの表面は耐食性の良いＡｕで覆われることに
なるので耐食性が向上する。また。An In sheet having a thickness of 1 mm is electrolessly plated with KAu (or Au/Ni) having a thickness of 2 μm. If this is done, the surface of the +In will be covered with Au, which has good corrosion resistance, so that the corrosion resistance will be improved. Also.
めっきの厚さは２μｍ程度と薄いので、シートの柔軟性
がそこなわれることはない。さらに＋ＡｕはＩｎより熱
伝導性が良いので、シートの熱伝導性も向上する。Since the thickness of the plating is as thin as about 2 μm, the flexibility of the sheet is not impaired. Furthermore, since +Au has better thermal conductivity than In, the thermal conductivity of the sheet also improves.
本発明によれば、熱伝導用Ｉｎシートの柔軟性をそこな
わずに、熱伝導性、耐食性を改善することができる。According to the present invention, thermal conductivity and corrosion resistance can be improved without impairing the flexibility of the thermally conductive In sheet.
【図面の簡単な説明】
第１図は本発明の熱伝導用シートの断面図。
′：ＩＸＺ図及び第３図は熱伝導用シートの応用例を示
す断面図及び斜′４Ｆ１図である。
１：回路基板、２：はんだ５３：半導体素子。
４：熱伝導用シート、５：放熱用フィン、６：冷却管、
７：冷却水。
／か−
ど
移２図 然イ太導用シート−爪、川イ列’３Ｊ３ＢBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of the heat conductive sheet of the present invention. ': IXZ diagram and Figure 3 are a sectional view and a diagonal '4F1 diagram showing an application example of the heat conductive sheet. 1: Circuit board, 2: Solder 53: Semiconductor element. 4: Heat conduction sheet, 5: Heat dissipation fin, 6: Cooling pipe,
7: Cooling water. /Ka- Do-transfer 2 figure Zenii-da leading sheet - Nail, Kawa-i row'3J3B
Claims (1)
性、耐食性を改善したことを特徴とする熱伝導用シート
。A heat conductive sheet characterized by having improved thermal conductivity and corrosion resistance by plating Au or Au/Ni on the surface of In.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62016728A JPS63186878A (en) | 1987-01-27 | 1987-01-27 | Sheet for heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62016728A JPS63186878A (en) | 1987-01-27 | 1987-01-27 | Sheet for heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63186878A true JPS63186878A (en) | 1988-08-02 |
Family
ID=11924324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62016728A Pending JPS63186878A (en) | 1987-01-27 | 1987-01-27 | Sheet for heat conduction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63186878A (en) |
-
1987
- 1987-01-27 JP JP62016728A patent/JPS63186878A/en active Pending
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