JPS63185575U - - Google Patents

Info

Publication number
JPS63185575U
JPS63185575U JP7643287U JP7643287U JPS63185575U JP S63185575 U JPS63185575 U JP S63185575U JP 7643287 U JP7643287 U JP 7643287U JP 7643287 U JP7643287 U JP 7643287U JP S63185575 U JPS63185575 U JP S63185575U
Authority
JP
Japan
Prior art keywords
socket
lead
high frequency
semiconductor element
contact conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7643287U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7643287U priority Critical patent/JPS63185575U/ja
Publication of JPS63185575U publication Critical patent/JPS63185575U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図はそれぞれ本考案の一実施
例および他の実施例を回路基板に取付け被測定Ｉ
Ｃを装着した状態を示す断面図、第３図は従来の
半導体素子測定用ソケツトの断面図である。 １…帯状コンタクト導体、２，４……高周波用
絶縁体、３，５……外部接地導体、６……回路基
板、７……ストリツプ線路、８……絶縁体、１１
……半導体素子、１２……リード。 Figures 1 and 2 show one embodiment of the present invention and another embodiment of the present invention mounted on a circuit board to be measured.
FIG. 3 is a cross-sectional view of a conventional socket for measuring semiconductor devices. DESCRIPTION OF SYMBOLS 1... Band-shaped contact conductor, 2, 4... High frequency insulator, 3, 5... External grounding conductor, 6... Circuit board, 7... Strip line, 8... Insulator, 11
...Semiconductor element, 12...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被測定半導体素子のリードが差し込まれるリー
ド受部に前記半導体素子のリードと接触接続され
るコンタクト導体を有するソケツトにおいて、こ
のソケツトが実装される回路基板の高周波伝送路
の特性インピーダンスと整合されたストリツプ線
路を形成するための接地導体層が、高周波用絶縁
体を間に介して前記コンタクト導体の外側に設け
られていることを特徴とする半導体素子の測定用
ソケツト。 In a socket having a contact conductor that is connected to the lead of the semiconductor element in a lead receiving part into which the lead of the semiconductor element to be measured is inserted, a strip is provided that matches the characteristic impedance of the high frequency transmission path of the circuit board on which the socket is mounted. 1. A socket for measuring a semiconductor device, characterized in that a ground conductor layer for forming a line is provided on the outside of the contact conductor with a high frequency insulator interposed therebetween.
JP7643287U 1987-05-20 1987-05-20 Pending JPS63185575U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7643287U JPS63185575U (en) 1987-05-20 1987-05-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7643287U JPS63185575U (en) 1987-05-20 1987-05-20

Publications (1)

Publication Number Publication Date
JPS63185575U true JPS63185575U (en) 1988-11-29

Family

ID=30923504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7643287U Pending JPS63185575U (en) 1987-05-20 1987-05-20

Country Status (1)

Country Link
JP (1) JPS63185575U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8058892B2 (en) 2009-01-09 2011-11-15 Mitsubishi Electric Corporation Radiofrequency contactor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8058892B2 (en) 2009-01-09 2011-11-15 Mitsubishi Electric Corporation Radiofrequency contactor

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