JPS63157952U - - Google Patents
Info
- Publication number
- JPS63157952U JPS63157952U JP5113187U JP5113187U JPS63157952U JP S63157952 U JPS63157952 U JP S63157952U JP 5113187 U JP5113187 U JP 5113187U JP 5113187 U JP5113187 U JP 5113187U JP S63157952 U JPS63157952 U JP S63157952U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- pad
- thick film
- film substrate
- clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例の正面図、第2図は
混成集積回路の構造を示す斜視図、第3図は従来
の端子分割パツドの正面図である。
1,2……角形端子パツド、3……厚膜基板、
4……クリツプ端子、5……絶縁ガラス、6,7
……導電パターン、12……端子パツド部、13
……電子部品。
FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of a hybrid integrated circuit, and FIG. 3 is a front view of a conventional terminal split pad. 1, 2... Square terminal pad, 3... Thick film substrate,
4...Clip terminal, 5...Insulating glass, 6,7
... Conductive pattern, 12 ... Terminal pad part, 13
...Electronic parts.
Claims (1)
プ端子に対してほぼ直角にこのクリツプ端子に圧
接されるよう前記厚膜基板上に設けられ一端が導
電パターンに連結された第1の角形端子パツドと
、該第1の角形端子パツドに対して平行でかつほ
ぼ同じ長さを有するよう前記導電パターンとの交
差部分に絶縁体を介して前記厚膜基板上に設けら
れ前記クリツプ端子に圧接する第2の角形端子パ
ツドとを備えたことを特徴とする混成集積回路の
クリツプ端子用分割パツド。 a first rectangular terminal pad that is provided on the thick film substrate so as to be pressed into contact with the clip terminal at a substantially right angle to the clip terminal inserted so as to sandwich the thick film substrate, and one end of which is connected to the conductive pattern; A first square terminal pad is provided on the thick film substrate via an insulator at the intersection with the conductive pattern so as to be parallel to the first rectangular terminal pad and have approximately the same length, and is pressed into contact with the clip terminal. 1. A split pad for a clip terminal of a hybrid integrated circuit, characterized by comprising two square terminal pads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5113187U JPS63157952U (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5113187U JPS63157952U (en) | 1987-04-03 | 1987-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63157952U true JPS63157952U (en) | 1988-10-17 |
Family
ID=30875108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5113187U Pending JPS63157952U (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63157952U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295642U (en) * | 1989-01-10 | 1990-07-30 | ||
JPH0295643U (en) * | 1989-01-10 | 1990-07-30 |
-
1987
- 1987-04-03 JP JP5113187U patent/JPS63157952U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295642U (en) * | 1989-01-10 | 1990-07-30 | ||
JPH0295643U (en) * | 1989-01-10 | 1990-07-30 |
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