JPS63157952U - - Google Patents

Info

Publication number
JPS63157952U
JPS63157952U JP5113187U JP5113187U JPS63157952U JP S63157952 U JPS63157952 U JP S63157952U JP 5113187 U JP5113187 U JP 5113187U JP 5113187 U JP5113187 U JP 5113187U JP S63157952 U JPS63157952 U JP S63157952U
Authority
JP
Japan
Prior art keywords
terminal
pad
thick film
film substrate
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5113187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5113187U priority Critical patent/JPS63157952U/ja
Publication of JPS63157952U publication Critical patent/JPS63157952U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の正面図、第2図は
混成集積回路の構造を示す斜視図、第3図は従来
の端子分割パツドの正面図である。 1,2……角形端子パツド、3……厚膜基板、
4……クリツプ端子、5……絶縁ガラス、6,7
……導電パターン、12……端子パツド部、13
……電子部品。
FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a perspective view showing the structure of a hybrid integrated circuit, and FIG. 3 is a front view of a conventional terminal split pad. 1, 2... Square terminal pad, 3... Thick film substrate,
4...Clip terminal, 5...Insulating glass, 6,7
... Conductive pattern, 12 ... Terminal pad part, 13
...Electronic parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 厚膜基板をはさみ込むように挿着されるクリツ
プ端子に対してほぼ直角にこのクリツプ端子に圧
接されるよう前記厚膜基板上に設けられ一端が導
電パターンに連結された第1の角形端子パツドと
、該第1の角形端子パツドに対して平行でかつほ
ぼ同じ長さを有するよう前記導電パターンとの交
差部分に絶縁体を介して前記厚膜基板上に設けら
れ前記クリツプ端子に圧接する第2の角形端子パ
ツドとを備えたことを特徴とする混成集積回路の
クリツプ端子用分割パツド。
a first rectangular terminal pad that is provided on the thick film substrate so as to be pressed into contact with the clip terminal at a substantially right angle to the clip terminal inserted so as to sandwich the thick film substrate, and one end of which is connected to the conductive pattern; A first square terminal pad is provided on the thick film substrate via an insulator at the intersection with the conductive pattern so as to be parallel to the first rectangular terminal pad and have approximately the same length, and is pressed into contact with the clip terminal. 1. A split pad for a clip terminal of a hybrid integrated circuit, characterized by comprising two square terminal pads.
JP5113187U 1987-04-03 1987-04-03 Pending JPS63157952U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5113187U JPS63157952U (en) 1987-04-03 1987-04-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5113187U JPS63157952U (en) 1987-04-03 1987-04-03

Publications (1)

Publication Number Publication Date
JPS63157952U true JPS63157952U (en) 1988-10-17

Family

ID=30875108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5113187U Pending JPS63157952U (en) 1987-04-03 1987-04-03

Country Status (1)

Country Link
JP (1) JPS63157952U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295642U (en) * 1989-01-10 1990-07-30
JPH0295643U (en) * 1989-01-10 1990-07-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295642U (en) * 1989-01-10 1990-07-30
JPH0295643U (en) * 1989-01-10 1990-07-30

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